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Category:CPC H01L23/46
Pages in category "CPC H01L23/46"
The following 34 pages are in this category, out of 34 total.
1
- 18016411. CHIP HEAT SINK AND NUCLEIC ACID EXTRACTION DEVICE simplified abstract (Beijing BOE Technology Development Co., Ltd.)
- 18016411. CHIP HEAT SINK AND NUCLEIC ACID EXTRACTION DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18092136. HETEROGENEOUS INTEGRATED MULTI-CHIP COOLER MODULE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18505670. HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18986384. COOLER AND COOLING STRUCTURE FOR SEMICONDUCTOR DEVICE (ROHM CO., LTD.)
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240321681). HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- SEG Automotive Germany GmbH Patent Application Trends in 2025