MULTIPLE CHIP MODULE DIRECT ATTACH COOLING

Abstract: an apparatus includes a manifold body including a plurality of heat transfer structures therein. the plurality of heat transfer structures are configured to be thermally coupled to a plurality of heat generating components. the apparatus further includes a plurality of flow directing structures within the manifold body. the plurality of flow directing structures configured to direct a first portion of a fluid flow within the manifold body to a first heat transfer structure of the plurality of heat transfer structures and a second portion of the fluid flow within the manifold body to a second heat transfer structure of the plurality of heat transfer structures.

Inventor(s): MARK D. SCHULTZ

CPC Classification: H01L23/46 (involving the transfer of heat by flowing fluids (, take precedence))

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