There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:CPC H01L23/367
Jump to navigation
Jump to search
Pages in category "CPC H01L23/367"
The following 91 pages are in this category, out of 91 total.
1
- 18065365. HEATSINK PEDESTALS FOR THERMAL INTERFACE MATERIAL FILL simplified abstract (International Business Machines Corporation)
- 18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation)
- 18088360. CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract (Intel Corporation)
- 18090883. PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract (Intel Corporation)
- 18357646. SEMICONDUCTOR POWER MODULE simplified abstract (Mitsubishi Electric Corporation)
- 18380854. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18402558. STACKED SEMICONDUCTOR PACKAGE AND LOWER SEMICONDUCTOR PACKAGE USED FOR THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18438450. INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY simplified abstract (Intel Corporation)
- 18467581. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18467581. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18526098. ELECTRICAL AND/OR ELECTRONIC DEVICE simplified abstract (Robert Bosch GmbH)
- 18583411. THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18674006. THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING simplified abstract (Texas Instruments Incorporated)
- 18747798. SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18955613. IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SPREADER (Intel Corporation)
- 18964984. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
C
H
I
- Industrial Technology Research Institute Patent Application Trends in 2024
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patent Application Trends in 2024
- Intel corporation (20240213111). CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract
- Intel corporation (20240222219). PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract
- Intel corporation (20240234234). COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE simplified abstract
- Intel corporation (20240290680). LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIONS AND METHOD FOR MAKING SAME simplified abstract
- Intel corporation (20250087548). IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SPREADER
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation patent applications on August 29th, 2024
- Intel Corporation patent applications on July 11th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on March 13th, 2025
- International business machines corporation (20240194558). HEATSINK PEDESTALS FOR THERMAL INTERFACE MATERIAL FILL simplified abstract
- International business machines corporation (20240203816). HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract
- International Business Machines Corporation patent applications on June 13th, 2024
- International Business Machines Corporation patent applications on June 20th, 2024
K
M
- MEDIATEK Inc. Patent Application Trends in 2024
- MEDIATEK INC. Patent Application Trends in 2024
- Micron Technology, Inc. Patent Application Trends in 2024
- Mitsubishi electric corporation (20240339373). SEMICONDUCTOR POWER MODULE simplified abstract
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on October 10th, 2024
R
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240321669). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240347409). SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract
- Samsung electronics co., ltd. (20240413038). STACKED SEMICONDUCTOR PACKAGE AND LOWER SEMICONDUCTOR PACKAGE USED FOR THE SAME
- Samsung electronics co., ltd. (20250096061). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 23rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 23rd, 2025
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on October 17th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on October 17th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240194559). THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan semiconductor manufacturing company, ltd. (20240379486). INTEGRATED CHIP WITH GOOD THERMAL DISSIPATION PERFORMANCE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379488). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240413039). HEAT SINK FOR STACKED MULTI-GATE DEVICE
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on December 12th, 2024
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Tesla Patent Application Trends in 2024
- Texas instruments incorporated (20240312862). THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING simplified abstract
- Texas Instruments Incorporated patent applications on September 19th, 2024
