18526098. ELECTRICAL AND/OR ELECTRONIC DEVICE simplified abstract (Robert Bosch GmbH)
Contents
ELECTRICAL AND/OR ELECTRONIC DEVICE
Organization Name
Inventor(s)
Daniel Stehlik of Moessingen (DE)
Valentin Ruedenauer of Reutlingen (DE)
ELECTRICAL AND/OR ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18526098 titled 'ELECTRICAL AND/OR ELECTRONIC DEVICE
Simplified Explanation: The patent application describes an electrical or electronic device with a cooling device that has a coating on its top side. The coating includes at least one recess where the contact surface of the electrical assembly is in direct contact with the cooling device.
- The innovation involves a cooling device with a flat coating on its top side.
- The coating includes at least one recess where the contact surface of the electrical assembly is exposed.
- The contact surface is attached to the cooling device within the recess.
Potential Applications: This technology could be applied in various electronic devices such as computers, servers, and other devices that require efficient cooling systems.
Problems Solved: This technology addresses the issue of heat dissipation in electronic devices by providing a direct contact surface between the electrical assembly and the cooling device.
Benefits: The direct contact between the electrical assembly and the cooling device improves heat transfer efficiency and overall device performance. It also helps in preventing overheating and potential damage to electronic components.
Commercial Applications: Title: Enhanced Cooling System for Electronic Devices This technology could be utilized in the manufacturing of electronic devices to improve their performance and reliability. It has implications for the market of electronic components and devices where efficient cooling systems are crucial.
Prior Art: Readers can explore prior patents related to cooling systems for electronic devices to understand the evolution of this technology.
Frequently Updated Research: Researchers are constantly working on improving cooling systems for electronic devices to enhance their performance and longevity.
Questions about Enhanced Cooling System for Electronic Devices: 1. How does the direct contact between the electrical assembly and the cooling device improve heat dissipation? 2. What are the potential long-term benefits of implementing this technology in electronic devices?
Original Abstract Submitted
For an electrical and/or electronic device, comprising at least one cooling device having a top side, an electrical and/or electronic assembly arranged on the top side of the cooling device having a contact surface, wherein the contact surface faces the top side of the cooling device and is attached to the top side of the cooling device by means of an intermediate layer arranged between the cooling device and the contact surface of the electrical and/or electronic assembly, it is proposed that a coating extending flat is arranged on the top side of the cooling device, wherein the coating on the top side of the cooling device comprises at least one recess, in which the top side of the cooling device is not coated, wherein the contact surface of the electrical and/or electronic assembly in the recess is in contact with the cooling device and attached to the cooling device.
