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Category:CPC B24B37/32
Pages in category "CPC B24B37/32"
The following 20 pages are in this category, out of 20 total.
1
- 18210819. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF CONTROLLING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18376356. POLISHING HEAD WITH FLEXURE EXTENDING THROUGH PRESSURE CHAMBER (Applied Materials, Inc.)
- 18736281. RETAINING RING HAVING INNER SURFACES WITH FEATURES simplified abstract (Applied Materials, Inc.)
A
- Applied materials, inc. (20240253179). POLISHING HEAD WITH LOCAL WAFER PRESSURE simplified abstract
- Applied materials, inc. (20250108479). POLISHING HEAD WITH FLEXURE EXTENDING THROUGH PRESSURE CHAMBER
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Applied Materials, Inc. patent applications on April 3rd, 2025
- Applied Materials, Inc. patent applications on August 1st, 2024
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240217059). CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF CONTROLLING THE SAME simplified abstract
- Samsung electronics co., ltd. (20250073843). RETAINER RING MODULE AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
