RETAINER RING FOR CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME

Abstract: the present disclosure relates to a retainer ring for a chemical mechanical polishing apparatus and a chemical mechanical polishing apparatus including the same, and the retainer ring of a head portion in a chemical mechanical polishing apparatus includes: an inner ring configured to surround a circumference edge of a wafer; an outer ring surrounding the inner ring; and a fluid flow path formed between the inner ring and the outer ring, the fluid flow path defined by an outward-facing surface of the inner ring and an inward-facing surface of the outer ring. the inward-facing surface of the outer ring includes at least one lower curved portion.

Inventor(s): Hyungjoo Lee, HYEONDONG SONG, KYUMIN SIM, JOONSUK JEONG, SU-YONG HEO

CPC Classification: B24B37/32 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth , of screw-threads ; by electro-erosion ; abrasive or related blasting ; tools for grinding, buffing or sharpening ; polishing compositions ; abrasives ; electrolytic etching or polishing ; grinding arrangements for use on assembled railway tracks ); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS)

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