Pages that link to "Category:Bhaskar Jyoti Krishnatreya of Hillsboro OR US"
The following pages link to Category:Bhaskar Jyoti Krishnatreya of Hillsboro OR US:
Displaying 9 items.
- Intel corporation (20250006651). SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT (â links)
- Intel corporation (20250006652). FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT (â links)
- Intel corporation (20250006653). FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES (â links)
- Intel corporation (20250006678). PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING (â links)
- Intel corporation (20250006695). PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING (â links)
- Intel corporation (20250109221). CROSS-LINKED HYDROPHOBIC COATING WITH PLASMA RESISTANCE FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY (â links)
- Intel corporation (20250112200). HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY (â links)
- 18374530. CROSS-LINKED HYDROPHOBIC COATING WITH PLASMA RESISTANCE FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION) (â links)
- 18374559. HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION) (â links)
