Category:Yi Shi of Chandler AZ US
Yi Shi
Yi Shi from Chandler AZ US has applied for patents in technology areas such as H01L23/00, H01L23/31 with intel corporation.
Patents
Pages in category "Yi Shi of Chandler AZ US"
The following 12 pages are in this category, out of 12 total.
1
- 18374515. SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS (INTEL CORPORATION)
- 18374516. SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS (INTEL CORPORATION)
- 18374520. SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES (INTEL CORPORATION)
- 18374522. BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS (INTEL CORPORATION)
- 18374559. HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION)
- 18374577. PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES (INTEL CORPORATION)
I
- Intel corporation (20250112173). PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
- Intel corporation (20250112177). SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS
- Intel corporation (20250112181). BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS
- Intel corporation (20250112185). SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS
- Intel corporation (20250112199). SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
- Intel corporation (20250112200). HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY