Mollie A. Stewart

Mollie A. Stewart from Lake Oswego OR US has applied for patents in technology areas such as [[:Category:{Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads ( takes precedence)}|{Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads ( takes precedence)}]] with Intel Corporation.

Patents

• IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS (20250218910)

[[Category:{Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads ( takes precedence)}]]