Category:Jun Zhai of Cupertino CA US
Jun Zhai
Jun Zhai from Cupertino CA US has applied for patents in technology areas such as H01L23/31, H01L21/56, H01L23/00 with apple inc..
Patents
Pages in category "Jun Zhai of Cupertino CA US"
The following 6 pages are in this category, out of 6 total.
A
- Apple inc. (20250014960). MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES
- Apple inc. (20250112154). Power, Signaling and Thermal Path Co-optimization
- Apple inc. (20250157939). HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Apple inc. (20250157940). SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Apple inc. (20250157991). WAFER RECONSTITUTION AND DIE-STITCHING