Apple inc. (20250157991). WAFER RECONSTITUTION AND DIE-STITCHING
WAFER RECONSTITUTION AND DIE-STITCHING
Organization Name
Inventor(s)
Sanjay Dabral of Cupertino CA US
Kunzhong Hu of Cupertino CA US
Vidhya Ramachandran of Cupertino CA US
WAFER RECONSTITUTION AND DIE-STITCHING
This abstract first appeared for US patent application 20250157991 titled 'WAFER RECONSTITUTION AND DIE-STITCHING
Original Abstract Submitted
stitched die packaging techniques and structures are described in which reconstituted chips are formed using wafer reconstitution and die-stitching techniques. in an embodiment, a chip includes a reconstituted chip-level back end of the line (beol) build-up structure to connect a die set embedded in an inorganic gap fill material.