Apple inc. (20250014960). MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES
MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Kunzhong Hu of Cupertino CA US
MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES
This abstract first appeared for US patent application 20250014960 titled 'MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES
Original Abstract Submitted
various embodiments of an integrated circuit (ic) die package are disclosed. an ic die package includes an ic die, an interposer structure electrically connected to the ic die, a first bonding structure, a second bonding structure, and a molding compound layer. the first bonding structure includes a first dielectric layer disposed on the ic die and a first conductive plug disposed in the first dielectric layer. the second bonding structure includes a second dielectric layer disposed on the interposer structure and a second conductive plug disposed in the second dielectric layer. the molding compound layer includes a mold region and a mold cavity.