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Category:CPC H01L27/1464
Pages in category "CPC H01L27/1464"
The following 45 pages are in this category, out of 45 total.
1
- 18155096. HIGH ASPECT RATIO BACK SIDE DEEP TRENCH ISOLATON STRUCTURE WITH SUBSTRATE-EMBEDDED METAL GRID AND NO PINCH OFF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18164823. STEPPED BACK SIDE DEEP TRENCH ISOLATON STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18545488. PIXEL OF IMAGE SENSOR AND IMAGE SENSOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18623593. IMAGE SENSOR AND IMAGE CAPTURING DEVICE simplified abstract (Nikon Corporation)
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240204031). PIXEL OF IMAGE SENSOR AND IMAGE SENSOR simplified abstract
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD. Patent Application Trends in 2025
- Semiconductor Energy Laboratory Co., Ltd. Patent Application Trends in 2025
- SiOnyx, LLC Patent Application Trends in 2024
- SONY GROUP CORPORATION Patent Application Trends in 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION Patent Application Trends in 2025
- Sony Semiconductor Solutions Corporation Patent Application Trends in 2025
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240204032). IMAGE SENSOR WITH IMPROVED LIGHT CONVERSION EFFICIENCY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240243156). HIGH ASPECT RATIO BACK SIDE DEEP TRENCH ISOLATON STRUCTURE WITH SUBSTRATE-EMBEDDED METAL GRID AND NO PINCH OFF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266380). STEPPED BACK SIDE DEEP TRENCH ISOLATON STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379721). HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250063834). FULL BACKSIDE DEEP TRENCH ISOLATION STRUCTURE FOR A SEMICONDUCTOR PIXEL SENSOR ARRAY
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 20th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024