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Category:Brian Balch of Chandler AZ US

From WikiPatents

Brian Balch

Brian Balch from Chandler AZ US has applied for patents in technology areas such as H01L23/538, H01L21/48, H01L23/00 with intel corporation.

Patents

THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVICE PACKAGES (20250006646)

Pages in category "Brian Balch of Chandler AZ US"

The following 3 pages are in this category, out of 3 total.

1

18375203. THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES (INTEL CORPORATION)

I

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