18373883. THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES (Intel Corporation)
THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES
Organization Name
Inventor(s)
Mukund Ayalasomayajula of Chandler AZ US
Andrew W. Carlson of Chandler AZ US
Matthew Magnavita of Chandler AZ US
George Robinson of Chandler AZ US
Fatemeh Rahimi of Chandler AZ US
Chase Williams Challe of Gilbert AZ US
Prince Shiva Chaudhary of Chandler AZ US
Dhruv Kishor Malde of Queen Creek AZ US
Mohamed Elhebeary of Chandler AZ US
THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES
This abstract first appeared for US patent application 18373883 titled 'THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES
Original Abstract Submitted
Embodiments include an apparatus with interconnects that have different structures. In an embodiment, the apparatus comprises a substrate and a first interconnect on the substrate, a second interconnect on the substrate, and a third interconnect on the substrate. In an embodiment, the first interconnect, the second interconnect, and the third interconnect are all different from each other.
- Intel Corporation
- Mukund Ayalasomayajula of Chandler AZ US
- Jiaqi Wu of Chandler AZ US
- Andrew W. Carlson of Chandler AZ US
- Matthew Magnavita of Chandler AZ US
- Zewei Wang of Chandler AZ US
- Xiao Lu of Chandler AZ US
- George Robinson of Chandler AZ US
- Brian Moody of Peoria AZ US
- Fatemeh Rahimi of Chandler AZ US
- Chase Williams Challe of Gilbert AZ US
- Prince Shiva Chaudhary of Chandler AZ US
- Dhruv Kishor Malde of Queen Creek AZ US
- Mohamed Elhebeary of Chandler AZ US
- H05K1/11
- H01L23/00
- CPC H05K1/11