Category:Xiao Lu of Chandler AZ US
Xiao Lu
Xiao Lu from Chandler AZ US has applied for patents in technology areas such as H05K1/11, H01L23/00 with intel corporation.
Patents
Pages in category "Xiao Lu of Chandler AZ US"
The following 9 pages are in this category, out of 9 total.
1
- 18373883. THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES (Intel Corporation)
- 18375337. FLEXIBLE THERMAL INTERPOSER FOR BACKSIDE COOLING OF DOUBLE-SIDED PACKAGES (INTEL CORPORATION)
- 18477966. SELF-DIFFUSING LIQUID METAL INTERCONNECT ARCHITECTURES ENABLING SNAP-ON ROOM TEMPERATURE ASSEMBLY (INTEL CORPORATION)
- 18492371. MICROMETER METAL PARTICLE REINFORCED TIN-BISMUTH LOW TEMPERATURE SOLDER MATERIALS (Intel Corporation)
I
- Intel corporation (20250106994). THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES
- Intel corporation (20250112106). FLEXIBLE THERMAL INTERPOSER FOR BACKSIDE COOLING OF DOUBLE-SIDED PACKAGES
- Intel corporation (20250112190). SELF-DIFFUSING LIQUID METAL INTERCONNECT ARCHITECTURES ENABLING SNAP-ON ROOM TEMPERATURE ASSEMBLY
- Intel corporation (20250128362). MICROMETER METAL PARTICLE REINFORCED TIN-BISMUTH LOW TEMPERATURE SOLDER MATERIALS