Category:Jiaqi Wu of Chandler AZ US
Jiaqi Wu
Jiaqi Wu from Chandler AZ US has applied for patents in technology areas such as H01L23/498 with intel corporation.
Patents
Pages in category "Jiaqi Wu of Chandler AZ US"
The following 9 pages are in this category, out of 9 total.
1
- 18373879. N-BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURE (Intel Corporation)
- 18373883. THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES (Intel Corporation)
- 18477966. SELF-DIFFUSING LIQUID METAL INTERCONNECT ARCHITECTURES ENABLING SNAP-ON ROOM TEMPERATURE ASSEMBLY (INTEL CORPORATION)
- 18492371. MICROMETER METAL PARTICLE REINFORCED TIN-BISMUTH LOW TEMPERATURE SOLDER MATERIALS (Intel Corporation)
I
- Intel corporation (20250105114). N-BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURE
- Intel corporation (20250106994). THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES
- Intel corporation (20250112190). SELF-DIFFUSING LIQUID METAL INTERCONNECT ARCHITECTURES ENABLING SNAP-ON ROOM TEMPERATURE ASSEMBLY
- Intel corporation (20250128362). MICROMETER METAL PARTICLE REINFORCED TIN-BISMUTH LOW TEMPERATURE SOLDER MATERIALS