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Category:Brian Moody of Peoria AZ US

From WikiPatents

Brian Moody

Brian Moody from Peoria AZ US has applied for patents in technology areas such as H05K1/11, H01L23/00 with intel corporation.

Patents

THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES (20250106994)

Pages in category "Brian Moody of Peoria AZ US"

The following 2 pages are in this category, out of 2 total.

1

18373883. THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES (Intel Corporation)

I

Intel corporation (20250106994). THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES

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