Category:Tarek A. Ibrahim of Mesa AZ US
Tarek A. Ibrahim
Tarek A. Ibrahim from Mesa AZ US has applied for patents in technology areas such as H01L23/15, H01L23/498, H01L23/522 with intel corporation.
Patents
Pages in category "Tarek A. Ibrahim of Mesa AZ US"
The following 9 pages are in this category, out of 9 total.
1
- 18371294. INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES (Intel Corporation)
- 18470645. MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH (Intel Corporation)
- 18470668. MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATION LAYERS (Intel Corporation)
- 18477098. TECHNOLOGIES FOR A COAXIAL INDUCTOR IN A GLASS CORE (INTEL CORPORATION)
I
- Intel corporation (20250004225). TECHNOLOGIES FOR SUBSTRATE FEATURES FOR A PLUGGABLE OPTICAL CONNECTOR
- Intel corporation (20250096053). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH
- Intel corporation (20250096143). MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATION LAYERS
- Intel corporation (20250107112). INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
- Intel corporation (20250112179). TECHNOLOGIES FOR A COAXIAL INDUCTOR IN A GLASS CORE