MEDIATEK INC. patent applications published on November 30th, 2023

Summary of the patent applications from MEDIATEK INC. on November 30th, 2023

MEDIATEK INC. has recently filed several patents related to wireless communication, video encoding, latency reduction in mobile networks, adjusting transmitting power ratio, semiconductor packaging, and voice wakeup detection.

In the field of wireless communication, one patent application describes a method for transmitting baseband data signals from a user equipment (UE) to a base station via repeaters. The UE generates multiple layers of baseband data signals and maps them to antennas in transmission time intervals. Another patent application focuses on a wireless device that receives a time domain signal from a UE and generates a second time domain signal to be transmitted to a base station on a different frequency band.

For video encoding, a patent application describes a system that uses shared transform circuits to process input residual signals and generate transform coefficients. This system allows for the reuse of computation resources and implements a hierarchical design for block size grouping.

In the mobile communication network domain, one patent application presents a method to reduce latency in reporting measurements for positioning. The method avoids triggering additional procedures, resulting in faster and more efficient reporting of measurement results.

Another patent application focuses on adjusting the transmitting power ratio of a radio module by separating modules into different groups and adjusting the transmitting power limit based on RF exposure limits.

In terms of semiconductor packaging, one patent application describes a package with multiple semiconductor structures on an interposer over a substrate, while another patent application discusses a semiconductor device with multiple layers and integrated circuits connected through a bridge die. Additionally, there is a patent application for a wafer level chip scale package with a bare silicon die and a backside tape that wraps around the die's corner.

Lastly, a patent application presents a semiconductor die with an on-die power switch and a target device, where the power switch selects the target operation voltage for the target device.

Notable Applications:

• Method for transmitting baseband data signals via repeaters in wireless communication.
• System for video encoding using shared transform circuits and hierarchical design.
• Method to reduce latency in reporting measurements for positioning in mobile networks.
• Method for adjusting the transmitting power ratio of a radio module based on RF exposure limits.
• Semiconductor packaging with multiple structures and integrated circuits.
• Semiconductor device with multiple layers and integrated circuits connected through a bridge die.
• Wafer level chip scale package with a bare silicon die and backside tape.
• Semiconductor die with an on-die power switch and a target device.

Patent applications for MEDIATEK INC. on November 30th, 2023

METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES ([[US Patent Application 18142568. METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES simplified abstract|18142568]])

Main Inventor

Kun-Tso Chen

Brief explanation

The patent application describes a method for computing correlations between code sequences and data sequences. Here are the key points:

• The method involves obtaining multiple code sequences.
• A transformation circuit performs a bit-wise combination with transformation on the code sequences.
• This generates a composite code sequence.
• The method then calculates a correlation value between a data sequence and the composite code sequence.

Abstract

A correlation computation method includes: obtaining a plurality of code sequences; performing, by a transformation circuit, a bit-wise combination with transformation upon the plurality of code sequences to generate a composite code sequence; and generating a correlation value between a data sequence and the composite code sequence.

VOICE WAKEUP DETECTING DEVICE AND METHOD (17825250)

Main Inventor

Liang-Che SUN

Brief explanation

The patent application describes devices and methods for detecting voice wakeups.

• A microphone receives an audio input signal containing both a voice signal and ambient noise.
• The audio input signal is converted into two separate signals using different gains.
• The first signal is multiplied by a first weight, and the second signal is multiplied by a second weight.
• The first and second signals are then merged into a third signal.
• The first and second weights are adjusted based on the volume value.
• The second gain is lower than the first gain.
• The first weight is different from the second weight.

Abstract

Voice wakeup detecting devices and methods are provided. A microphone is configured to receive an audio input signal. The audio input signal includes a voice signal and an ambient voice signal. A first analog-to-digital converter is configured to convert the audio input signal into a first signal according to a first gain. A second analog-to-digital converter is configured to convert the audio input signal into a second signal according to a second gain. A control module is configured to merge the first signal multiplied by first weight and the second signal multiplied by second weight into a third signal and to adjust the first weight and the second weight in response to a volume value. The second gain is less than the first gain, and the first weight is different than the second weight.

SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES (18124576)

Main Inventor

Bo-Yun Lin

Brief explanation

The patent application describes a semiconductor die that includes an on-die power switch and a target device. The power switch has multiple power input nodes, a power output node, and a switch circuit. It receives operation voltages from different power sources and selects one as the target operation voltage for the target device. The switch circuit connects one of the power input nodes to the power output node. The target device operates using the selected target operation voltage. The power switch and target device are separate circuit blocks on the semiconductor die.

• Semiconductor die includes an on-die power switch and a target device
• Power switch has multiple power input nodes, a power output node, and a switch circuit
• Power input nodes receive operation voltages from different power sources
• Power output node outputs a selected target operation voltage
• Switch circuit connects one power input node to the power output node
• Target device operates using the selected target operation voltage
• Power switch and target device are separate circuit blocks on the semiconductor die

Abstract

A semiconductor die includes an on-die power switch and a target device. The on-die power switch includes a plurality of power input nodes, a power output node, and a switch circuit. The power input nodes receive a plurality of operation voltages from a plurality of different power sources, respectively. The power output node outputs a target operation voltage selected from the operation voltages. The switch circuit selectively couples one of the power input nodes to the power output node. The target device operates according to the target operation voltage supplied from the on-die power switch. The on-die power switch and the target device are separate circuit blocks of the semiconductor die.

WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION (18132437)

Main Inventor

Yu-Tung Chen

Brief explanation

The patent application describes a wafer level chip scale package that includes a bare silicon die with an active surface, a rear surface, and a sidewall surface.

• The bare silicon die has a backside corner between the rear surface and the sidewall surface.
• The active surface has multiple pads, and each pad has a conductive element.
• A backside tape is attached to the rear surface using an adhesive layer.
• The adhesive layer and backside tape extend beyond the sidewall surfaces of the bare silicon die.
• The adhesive layer wraps around the backside corner of the bare silicon die.

Abstract

A wafer level chip scale package includes a bare silicon die having an active surface, a rear surface opposite to the active surface, and a sidewall surface between the active surface and the rear surface. The bare silicon die includes a backside corner between the rear surface and the sidewall surface. A plurality of pads is disposed on the active surface. A plurality of conductive elements is disposed on the plurality of pads, respectively. A backside tape is adhered to the rear surface by using an adhesive layer. The adhesive layer and the backside tape protrude beyond the sidewall surfaces of the bare silicon die. The adhesive layer extends along the sidewall surface and wraps around the backside corner.

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18191092)

Main Inventor

Tai-Hao PENG

Brief explanation

The patent application describes a semiconductor device with multiple layers and integrated circuits (SoCs) connected through a bridge die.

• The device consists of a first layer structure and a second layer structure.
• A bridge die is placed between the first and second layer structures.
• The second layer structure houses the first SoC and the second SoC.
• The first SoC and the second SoC are connected electrically through the bridge die.

Abstract

A semiconductor device includes a first layer structure, a second layer structure, a bridge die, a first SoC and a second SoC. The bridge die is disposed between the first layer structure and the second layer structure. The first SoC and the second SoC are disposed on the second layer structure. The first SoC and the second SoC are electrically connected through the bridge die.

SEMICONDUCTOR PACKAGE (18303693)

Main Inventor

Yi-Lin TSAI

Brief explanation

The patent application describes a semiconductor package that includes multiple semiconductor structures on an interposer over a substrate.

• The package includes interconnect traces, a redistribution structure, and three semiconductor structures.
• The first semiconductor structure consists of a semiconductor die and an encapsulant that surrounds it.
• The second semiconductor structure also consists of a semiconductor die and an encapsulant.
• The third semiconductor structure is located near a corner or edge of the substrate and includes a semiconductor die and an encapsulant.
• The third semiconductor structure is electrically insulated from the substrate and the other semiconductor structures.

Abstract

A semiconductor package includes an interposer over a substrate that includes interconnect traces, a redistribution structure on the interposer, a first semiconductor structure, a second semiconductor structure and a third semiconductor structure on the redistribution structure. The first semiconductor structure includes a first semiconductor die and a first encapsulant that encapsulates the first semiconductor die. The second semiconductor structure includes a second semiconductor die and a second encapsulant that encapsulates the second semiconductor die. The third semiconductor structure is disposed adjacent to a corner or an edge of the substrate in a top plan view of the substrate. The third semiconductor structure includes a third semiconductor die and a third encapsulant that encapsulates the third semiconductor die. The third semiconductor structure is electrically insulated from the substrate, the first semiconductor structure and the second semiconductor structure.

METHOD FOR ADJUSTING TRANSMITTING POWER RATIO OF RADIO MODULE AND ASSOCIATED RADIO SYSTEM (18136333)

Main Inventor

Fu-Tse Kao

Brief explanation

The abstract describes a method for adjusting the transmitting power ratio of a radio module. Here are the key points:

• The method involves separating multiple radio modules into different groups based on radiofrequency regulations.
• An RF exposure limit is mapped to a transmitting power limit.
• The radio module interacts with other modules in the same group to adjust the transmitting power ratio.
• The adjusted transmitting power ratio is used to adjust the transmitting power limit of the radio module.

Abstract

A method for adjusting a transmitting (TX) power ratio of a radio module includes: separating multiple radio modules into multiple radio groups according to a radiofrequency (RF) regulation, wherein the multiple radio modules comprise the radio module; mapping an RF exposure limit to a TX power limit; interacting with at least one other radio module for adjusting the TX power ratio, to obtain at least one adjusted TX power ratio, wherein the radio module and the at least one other radio module are comprised in a same radio group of the multiple radio groups; and adjusting the TX power limit according to the at least one adjusted TX power ratio, to generate an adjusted TX power limit of the radio module.

METHODS OF LATENCY REDUCTION FOR POSITIONING-SPECIFIC MEASUREMENT REPORTING (18248911)

Main Inventor

Guan-Yu LIN

Brief explanation

- This patent application describes a method to reduce latency in reporting measurements for positioning in a mobile communication network.

- When a User Equipment (UE) receives a location information request from the network, it performs first measurements on Positioning Reference Signals (PRSs) and obtains first measurement results. - The UE then uses a configured grant to transmit a first measurement report to the network, including the first measurement results. - In response to the same location information request, the UE performs second measurements on PRSs and obtains second measurement results. - The UE uses the same configured grant to transmit a second measurement report to the network, including the second measurement results. - Importantly, this method avoids triggering a Scheduling Request (SR) procedure or a Buffer Status Report (BSR) procedure, which helps in reducing latency. - The innovation allows for faster and more efficient reporting of measurement results for positioning in a mobile communication network.

Abstract

A method of latency reduction for positioning-specific measurement reporting is provided. A User Equipment (UE) performs first measurements on Positioning Reference Signals (PRSs) to obtain first measurement results in response to receiving a location information request from a mobile communication network. The UE uses a first configured grant to transmit a first measurement report including the first measurement results to the mobile communication network. The UE performs second measurements on PRSs to obtain second measurement results in response to the same location information request. The UE uses the first configured grant to transmit a second measurement report including the second measurement results to the mobile communication network, without triggering a Scheduling Request (SR) procedure or a Buffer Status Report (BSR) procedure.

COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-REPEATER BEHAVIOR (18141494)

Main Inventor

Lung-Sheng Tsai

Brief explanation

The patent application describes a method, computer-readable medium, and apparatus for wireless communication.

• The apparatus is a wireless device that is part of a group of wireless devices.
• The wireless device receives a time domain signal from a user equipment (UE) on a specific frequency band.
• The received signal occupies a transmission time interval (TTI) and consists of multiple OFDM symbols.
• Each OFDM symbol represents a set of modulation symbols on subcarriers using a specific subcarrier spacing.
• The wireless device generates a second time domain signal that corresponds to the received signal.
• The second time domain signal occupies a different TTI and is transmitted to a base station on a different frequency band.
• The transmission is done through a transmitting antenna.

Abstract

In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a first wireless device of a group of M wireless devices. The first wireless device receives a first time domain signal from a user equipment (UE) on a first frequency band through each receiving antenna. This first time domain signal occupies a first transmission time interval (TTI) and includes K first OFDM symbols corresponding to a first subcarrier spacing. Each first OFDM symbol represents a set of Nmodulation symbols on Nsubcarriers using the first subcarrier spacing. The first wireless device generates a second time domain signal that occupies a second transmission time interval (TTI) and corresponds to the first time domain signal. The first wireless device transmits each second time domain signal to a base station on a second frequency band through a transmitting antenna, respectively.

Transform Architecture in Video Encoding Systems (17825269)

Main Inventor

Chih-Hsuan LO

Brief explanation

- The patent application describes a video encoding system that uses shared transform circuits to process input residual signals and generate transform coefficients.

- The system applies horizontal and vertical transforms to the input residual signal to generate transform coefficients. - Quantization and inverse quantization are then applied to the transform coefficients to generate recovered transform coefficients. - The system further applies inverse vertical and horizontal transforms to the recovered transform coefficients to generate a reconstructed residual signal for the current block. - The current block is then encoded based on the quantized levels of the block. - The shared transform circuit and a coefficient buffer in the folded 4-time transform architecture allow for the reuse of computation resources in each transform stage. - The folded 4-time transform architecture also implements a hierarchical design for block size grouping, ensuring a fixed throughput for uniform hardware scheduling.

Abstract

Video encoding methods and apparatuses in a video encoding system receive an input residual signal of a current block by a shared transform circuit, apply horizontal transform and vertical transform by a shared transform circuit to generate transform coefficients, apply quantization and inverse quantization to generate recovered transform coefficients, apply inverse vertical transform and inverse horizontal transform to the recovered transform coefficients by the shared transform circuit to generate a reconstructed residual signal for the current block, and encode the current block based on quantized levels of the current block. The shared transform circuit and a coefficient buffer in the folded 4-time transform architecture reuse computation resources in each transform stage. In some embodiments of the folded 4-time transform architecture, a hierarchical design for block size grouping is implemented with fixed throughput for uniform hardware scheduling.

COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-UE BEHAVIOR (18141498)

Main Inventor

Lung-Sheng Tsai

Brief explanation

The patent application describes a method, computer-readable medium, and apparatus for transmitting baseband data signals from a user equipment (UE) to a base station via repeaters. 

• The UE generates R layers of baseband data signals to be carried on N subcarriers.
• The UE maps each of the R layers of baseband data signals to N antennas in some or all of L first transmission time intervals.
• Each precoder used for mapping contains L*N elements.
• The UE transmits a first OFDM-based time-domain signal corresponding to the mapped baseband data signals across the L first transmission time intervals.
• The transmission is done via one or more repeaters.
• The L first transmission time intervals correspond to one second transmission time interval.

Abstract

In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. The UE generates R layers of baseband data signals to be carried on Nsubcarriers, where Nand R are positive integers. The UE maps each of the R layers of baseband data signals to Nantennas in some or all of L first transmission time intervals using R precoders, with each precoder containing L·Nelements, and Nand L being positive integers. The UE transmits a first OFDM-based time-domain signal corresponding to the mapped baseband data signals across the L first transmission time intervals to a base station via one or more repeaters, where the L first transmission time intervals correspond to one second transmission time interval.