MEDIATEK INC. patent applications published on November 30th, 2023

Summary of the patent applications from MEDIATEK INC. on November 30th, 2023

MEDIATEK INC. has recently filed several patents related to wireless communication, video encoding, latency reduction in mobile networks, adjusting transmitting power ratio, semiconductor packaging, and voice wakeup detection.

In the field of wireless communication, one patent application describes a method for transmitting baseband data signals from a user equipment (UE) to a base station via repeaters. The UE generates multiple layers of baseband data signals and maps them to antennas in transmission time intervals. Another patent application focuses on a wireless device that receives a time domain signal from a UE and generates a second time domain signal to be transmitted to a base station on a different frequency band.

For video encoding, a patent application describes a system that uses shared transform circuits to process input residual signals and generate transform coefficients. This system allows for the reuse of computation resources and implements a hierarchical design for block size grouping.

In the mobile communication network domain, one patent application presents a method to reduce latency in reporting measurements for positioning. The method avoids triggering additional procedures, resulting in faster and more efficient reporting of measurement results.

Another patent application focuses on adjusting the transmitting power ratio of a radio module by separating modules into different groups and adjusting the transmitting power limit based on RF exposure limits.

In terms of semiconductor packaging, one patent application describes a package with multiple semiconductor structures on an interposer over a substrate, while another patent application discusses a semiconductor device with multiple layers and integrated circuits connected through a bridge die. Additionally, there is a patent application for a wafer level chip scale package with a bare silicon die and a backside tape that wraps around the die's corner.

Lastly, a patent application presents a semiconductor die with an on-die power switch and a target device, where the power switch selects the target operation voltage for the target device.

Notable Applications:

• Method for transmitting baseband data signals via repeaters in wireless communication.
• System for video encoding using shared transform circuits and hierarchical design.
• Method to reduce latency in reporting measurements for positioning in mobile networks.
• Method for adjusting the transmitting power ratio of a radio module based on RF exposure limits.
• Semiconductor packaging with multiple structures and integrated circuits.
• Semiconductor device with multiple layers and integrated circuits connected through a bridge die.
• Wafer level chip scale package with a bare silicon die and backside tape.
• Semiconductor die with an on-die power switch and a target device.

Patent applications for MEDIATEK INC. on November 30th, 2023

METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES ([[US Patent Application 18142568. METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES simplified abstract (MEDIATEK INC.)|18142568]])

Main Inventor

Kun-Tso Chen

VOICE WAKEUP DETECTING DEVICE AND METHOD (17825250)

Main Inventor

Liang-Che SUN

SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES (18124576)

Main Inventor

Bo-Yun Lin

WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION (18132437)

Main Inventor

Yu-Tung Chen

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18191092)

Main Inventor

Tai-Hao PENG

SEMICONDUCTOR PACKAGE (18303693)

Main Inventor

Yi-Lin TSAI

METHOD FOR ADJUSTING TRANSMITTING POWER RATIO OF RADIO MODULE AND ASSOCIATED RADIO SYSTEM (18136333)

Main Inventor

Fu-Tse Kao

METHODS OF LATENCY REDUCTION FOR POSITIONING-SPECIFIC MEASUREMENT REPORTING (18248911)

Main Inventor

Guan-Yu LIN

COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-REPEATER BEHAVIOR (18141494)

Main Inventor

Lung-Sheng Tsai

Transform Architecture in Video Encoding Systems (17825269)

Main Inventor

Chih-Hsuan LO

COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-UE BEHAVIOR (18141498)

Main Inventor

Lung-Sheng Tsai