US Patent Application 18124576. SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES simplified abstract

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SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES

Organization Name

MEDIATEK INC.

Inventor(s)

Bo-Yun Lin of Hsinchu City (TW)

Fan-Wei Liao of Hsinchu City (TW)

Tai-Ying Jiang of Hsinchu City (TW)

Ko-Ching Su of Hsinchu City (TW)

Chun-Yueh Kuo of Hsinchu City (TW)

SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18124576 titled 'SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES

Simplified Explanation

The patent application describes a semiconductor die that includes an on-die power switch and a target device. The power switch has multiple power input nodes, a power output node, and a switch circuit. It receives operation voltages from different power sources and selects one as the target operation voltage for the target device. The switch circuit connects one of the power input nodes to the power output node. The target device operates using the selected target operation voltage. The power switch and target device are separate circuit blocks on the semiconductor die.

  • Semiconductor die includes an on-die power switch and a target device
  • Power switch has multiple power input nodes, a power output node, and a switch circuit
  • Power input nodes receive operation voltages from different power sources
  • Power output node outputs a selected target operation voltage
  • Switch circuit connects one power input node to the power output node
  • Target device operates using the selected target operation voltage
  • Power switch and target device are separate circuit blocks on the semiconductor die


Original Abstract Submitted

A semiconductor die includes an on-die power switch and a target device. The on-die power switch includes a plurality of power input nodes, a power output node, and a switch circuit. The power input nodes receive a plurality of operation voltages from a plurality of different power sources, respectively. The power output node outputs a target operation voltage selected from the operation voltages. The switch circuit selectively couples one of the power input nodes to the power output node. The target device operates according to the target operation voltage supplied from the on-die power switch. The on-die power switch and the target device are separate circuit blocks of the semiconductor die.