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Category:H01L23/467
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Pages in category "H01L23/467"
The following 13 pages are in this category, out of 13 total.
1
- 17876813. Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC)
- 18149990. HEAT SINK WITH TURBULENT STRUCTURES simplified abstract (Google LLC)
- 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)