US Patent Application 17663793. SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chien Hung Chen of Taipei (TW)
Chin-Hua Wang of New Taipei City (TW)
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17663793 titled 'SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
Simplified Explanation
- The patent application describes a ring structure on a package substrate that is divided into multiple components to reduce flexibility and stress on a molding compound. - This division of the ring structure helps to reduce molding cracking, which in turn reduces defect rates and increases yield. - By reducing defect rates, the application conserves raw materials, power, and processing resources that would otherwise be used in manufacturing additional packages. - The division of the ring structure into at least four different components helps to achieve a reduction in stress on the molding compound, typically ranging from approximately 1% to approximately 10%.
Original Abstract Submitted
A ring structure on a package substrate is divided into at least four different components, including a plurality of first pieces and a plurality of second pieces. By dividing the ring structure into at least four different components, the ring structure reduces flexibility of the package substrate, which thus reduces stress on a molding compound (e.g., in a range from approximately 1% to approximately 10%). As a result, molding cracking is reduced, which reduces defect rates and increases yield. Accordingly, raw materials, power, and processing resources are conserved that would otherwise be consumed with manufacturing additional packages when defect rates are higher.
