17876813. Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC)

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Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages

Organization Name

GOOGLE LLC

Inventor(s)

Yingshi Tang of Danville CA (US)

Yingying Wang of Sunnyvale CA (US)

Padam Jain of San Jose CA (US)

Emad Samadiani of Cypress CA (US)

Sudharshan Sugavanesh Udhayakumar of San Jose CA (US)

Madhusudan K. Iyengar of Foster City CA (US)

Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages - A simplified explanation of the abstract

This abstract first appeared for US patent application 17876813 titled 'Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages

Simplified Explanation

The abstract describes a patent application for a pin fin placement assembly used to create pin fins in a thermal dissipating feature. The assembly is designed to place the pin fins on an IC die within an IC package, allowing for precise placement and desired profiles and numbers of pin fins. The pin fins are formed in a plurality of apertures in the assembly and then soldered onto the IC die through a thermal process.

  • The pin fin placement assembly is used to create pin fins in a thermal dissipating feature.
  • It assists in placing the pin fins with desired profiles and numbers on specific locations of an IC die.
  • The assembly has a plurality of apertures where the pin fins are formed.
  • A thermal process is performed to solder the pin fins onto the IC die.

Potential Applications

  • This technology can be used in electronic devices and systems that require efficient thermal management, such as computer processors, power electronics, and LED lighting.
  • It can be applied in industries where heat dissipation is crucial, such as automotive electronics, aerospace, and telecommunications.

Problems Solved

  • The pin fin placement assembly solves the problem of precise and efficient placement of pin fins on an IC die.
  • It eliminates the need for manual placement of pin fins, reducing human error and increasing productivity.
  • The assembly ensures consistent and uniform placement of pin fins, improving the thermal performance of the IC package.

Benefits

  • The pin fin placement assembly allows for mass production of IC packages with pin fins, reducing manufacturing time and costs.
  • It enables customization of pin fin profiles and numbers to meet specific thermal requirements.
  • The thermal process used to solder the pin fins ensures a secure and reliable attachment, enhancing the overall reliability and lifespan of the IC package.


Original Abstract Submitted

A pin fin placement assembly utilized to form pin fins in a thermal dissipating feature is provided. The pin fin placement assembly may place the pin fins on an IC die disposed in the IC package. The pin fin placement assembly may assist massively placing the pin fins with desired profiles and numbers on desired locations of the IC die. The plurality of pin fins is formed in a first plurality of apertures in the pin fin placement assembly. A thermal process is then performed to solder the plurality of pin fins on the IC die.

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