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Category:B24B57/02
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Pages in category "B24B57/02"
The following 15 pages are in this category, out of 15 total.
1
- 17704676. SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17887718. ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17940403. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17966021. MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING simplified abstract (Intel Corporation)
- 18229026. RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18455192. ABRASIVE SLURRY REGENERATION METHOD AND ABRASIVE SLURRY REGENERATION SYSTEM simplified abstract (Konica Minolta, Inc.)
- 18537574. METHOD FOR CMP TEMPERATURE CONTROL simplified abstract (Applied Materials, Inc.)
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- US Patent Application 17974280. GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES simplified abstract
- US Patent Application 18359396. Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen simplified abstract
- US Patent Application 18447211. SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION simplified abstract