US Patent Application 18359396. Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen simplified abstract

Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Ting-Hsun Chang of Kaohsiung City (TW)

Hung Yen of Hsinchu (TW)

Chi-Hsiang Shen of Tainan City (TW)

Fu-Ming Huang of Shengang Township (TW)

Chun-Chieh Lin of Hsinchu (TW)

Tsung Hsien Chang of Shalu Township (TW)

Ji Cui of Bolingbrook IL (US)

Liang-Guang Chen of Hsinchu (TW)

Chih Hung Chen of Hsinchu (TW)

Kei-Wei Chen of Tainan City (TW)

Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen - A simplified explanation of the abstract

This abstract first appeared for US patent application 18359396 titled 'Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen

Simplified Explanation

The abstract describes a chemical mechanical planarization apparatus that has a multi-zone platen with individually controlled concentric toroids. Each toroid can be controlled for rotation direction, speed, applied force, relative height, and temperature. The apparatus also includes concentric polishing pads attached to each toroid and can have a single central slurry source or individual slurry sources for each toroid.

• Chemical mechanical planarization apparatus with multi-zone platen
• Platen has individually controlled concentric toroids
• Each toroid can be controlled for rotation direction, speed, applied force, relative height, and temperature
• Concentric polishing pads are affixed to each toroid
• Apparatus can have a single central slurry source or individual slurry sources for each toroid.

Original Abstract Submitted

A chemical mechanical planarization apparatus includes a multi-zone platen comprising a plurality of individually controlled concentric toroids. The rotation direction, rotation speed, applied force, relative height, and temperature of each concentric toroid is individually controlled. Concentric polishing pads are affixed to an upper surface of each of the individually controlled concentric toroids. The chemical mechanical planarization apparatus includes a single central slurry source or includes individual slurry sources for each individually controlled concentric toroid.