18537574. METHOD FOR CMP TEMPERATURE CONTROL simplified abstract (Applied Materials, Inc.)

METHOD FOR CMP TEMPERATURE CONTROL

Organization Name

Applied Materials, Inc.

Inventor(s)

Haosheng Wu of San Jose CA (US)

Shou-Sung Chang of Mountain View CA (US)

Chih Chung Chou of San Jose CA (US)

Jianshe Tang of San Jose CA (US)

Hui Chen of San Jose CA (US)

Hari Soundararajan of Sunnyvale CA (US)

Brian J. Brown of Palo Alto CA (US)

METHOD FOR CMP TEMPERATURE CONTROL - A simplified explanation of the abstract

This abstract first appeared for US patent application 18537574 titled 'METHOD FOR CMP TEMPERATURE CONTROL

Simplified Explanation

The abstract describes a chemical mechanical polishing system that includes a platen, a conduit with an inlet connected to a gas source, and a dispenser with a convergent-divergent nozzle to direct gas onto the polishing surface of a polishing pad.

• The system consists of a platen to support a polishing pad with a polishing surface.
• A conduit is connected to a gas source to supply gas to the system.
• A dispenser with a convergent-divergent nozzle is used to direct the gas onto the polishing surface of the pad.

Potential Applications

This technology could be used in semiconductor manufacturing processes, optical component fabrication, and precision engineering industries.

Problems Solved

This system helps improve the efficiency and effectiveness of chemical mechanical polishing processes by providing a controlled gas flow onto the polishing surface, resulting in better polishing outcomes.

Benefits

The system allows for precise control of gas flow, leading to improved polishing results, reduced defects, and increased productivity in manufacturing processes.

Potential Commercial Applications

"Gas-Assisted Chemical Mechanical Polishing System for Semiconductor Manufacturing"

Possible Prior Art

One possible prior art could be the use of gas-assisted polishing systems in other manufacturing processes such as metal polishing or glass grinding.

Unanswered Questions

How does the system handle different types of polishing pads or surfaces?

The article does not provide information on the adaptability of the system to various polishing pad materials or surface types.

What is the maintenance required for the dispenser and nozzle components?

The maintenance procedures and frequency for the dispenser and nozzle components are not discussed in the article.

Original Abstract Submitted

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.