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Category:Zhiguo Qian of Chandler AZ (US)
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Pages in category "Zhiguo Qian of Chandler AZ (US)"
The following 7 pages are in this category, out of 7 total.
1
- 17847257. PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17847282. PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17851957. INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER simplified abstract (Intel Corporation)
- 17937474. PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract (Intel Corporation)
I
- Intel corporation (20240105572). GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION simplified abstract
- Intel corporation (20240105577). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES WITH GROUNDING MEMBERS simplified abstract
- Intel corporation (20240113049). PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract