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Category:Omkar G. Karhade of Chandler AZ (US)
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Pages in category "Omkar G. Karhade of Chandler AZ (US)"
The following 8 pages are in this category, out of 8 total.
1
- 17846086. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17846109. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES AND MULTI-SIDE ROUTING simplified abstract (Intel Corporation)
- 17846129. PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17846173. PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 18400761. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation)
- 18462600. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation)
