18400761. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation)
Contents
- 1 MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MICROELECTRONIC STRUCTURES INCLUDING BRIDGES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Organization Name
Inventor(s)
Omkar G. Karhade of Chandler AZ (US)
Edvin Cetegen of Chandler AZ (US)
Anurag Tripathi of Gilbert AZ (US)
Nitin A. Deshpande of Chandler AZ (US)
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18400761 titled 'MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Simplified Explanation
The patent application describes microelectronic structures with bridges, related assemblies, and methods. A microelectronic structure may consist of a substrate and a bridge.
- Microelectronic structures with bridges
- Assemblies incorporating the described structures
- Methods for manufacturing and utilizing these structures
Potential Applications
The technology could be applied in:
- Microelectronics
- Nanotechnology
- Semiconductor industry
Problems Solved
The technology addresses:
- Improved structural integrity
- Enhanced electrical connectivity
- Miniaturization of electronic devices
Benefits
The technology offers:
- Increased efficiency in electronic components
- Enhanced performance in microelectronic devices
- Potential for smaller and more powerful devices
Potential Commercial Applications
The technology could be utilized in:
- Consumer electronics
- Medical devices
- Aerospace industry
Possible Prior Art
Prior art in microelectronic structures with bridges may include:
- Existing patents on similar structures
- Research papers on bridge structures in microelectronics
Unanswered Questions
How does the technology compare to existing bridge structures in microelectronics?
The article does not provide a direct comparison to other bridge structures in the field.
What are the specific manufacturing methods used to create the bridges in the microelectronic structures?
The article does not delve into the detailed manufacturing processes involved in creating the bridges.
Original Abstract Submitted
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
