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• Taiwan semiconductor manufacturing company, ltd. (20240413101). SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD
  ...ung-Pin Chang of New Taipei (TW)]][[Category:Hung-Pin Chang of New Taipei (TW)]] ...-Hsien Hsieh of Kaohsiung (TW)]][[Category:Cheng-Hsien Hsieh of Kaohsiung (TW)]]
  2 KB (247 words) - 00:57, 13 December 2024
• Taiwan semiconductor manufacturing company, ltd. (20240413097). STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD
  ...ung-Pin Chang of New Taipei (TW)]][[Category:Hung-Pin Chang of New Taipei (TW)]] ...-Hsien Hsieh of Kaohsiung (TW)]][[Category:Cheng-Hsien Hsieh of Kaohsiung (TW)]]
  2 KB (258 words) - 00:57, 13 December 2024
• US Patent Application 17747939. LITHOGRAPHY SYSTEM AND METHODS simplified abstract
  ...hang-Chieh Chien of Hsinchu (TW)]][[Category:Shang-Chieh Chien of Hsinchu (TW)]] ...chu (TW)|Hung-Wen Cho of Hsinchu (TW)]][[Category:Hung-Wen Cho of Hsinchu (TW)]]
  2 KB (349 words) - 15:23, 6 December 2023
• US Patent Application 17750151. SYSTEM AND METHOD FOR DETECTING DEBRIS IN A PHOTOLITHOGRAPHY SYSTEM simplified abstract
  ...hang-Chieh Chien of Hsinchu (TW)]][[Category:Shang-Chieh Chien of Hsinchu (TW)]] ...chu (TW)|Tzu-Jung Pan of Hsinchu (TW)]][[Category:Tzu-Jung Pan of Hsinchu (TW)]]
  2 KB (318 words) - 15:23, 6 December 2023
• 17847787. METHOD FOR FORMING DUAL SILICIDE IN MANUFACTURING PROCESS OF SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
  =METHOD FOR FORMING DUAL SILICIDE IN MANUFACTURING PROCESS OF SEMICONDUCTOR STRUCTURE= ...inchu (TW)|Ying-Chi Su of Hsinchu (TW)]][[Category:Ying-Chi Su of Hsinchu (TW)]]
  3 KB (422 words) - 17:37, 1 January 2024
• Taiwan semiconductor manufacturing company, ltd. (20240413102). FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF
  ...ang of New Taipei City (TW)]][[Category:Hung-Pin Chang of New Taipei City (TW)]] ...eh of Kaohsiung City (TW)]][[Category:Cheng-Hsien Hsieh of Kaohsiung City (TW)]]
  2 KB (318 words) - 00:57, 13 December 2024
• 17823157. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
  ...chu (TW)|Yu-Ling Tsai of Hsinchu (TW)]][[Category:Yu-Ling Tsai of Hsinchu (TW)]] ...chu (TW)|Lai Wei Chih of Hsinchu (TW)]][[Category:Lai Wei Chih of Hsinchu (TW)]]
  3 KB (471 words) - 05:46, 4 March 2024
• 17900151. LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
  ...W)|Chin-Lung Chung of Hsinchu (TW)]][[Category:Chin-Lung Chung of Hsinchu (TW)]] ...chu (TW)|Shin-Yi Yang of Hsinchu (TW)]][[Category:Shin-Yi Yang of Hsinchu (TW)]]
  3 KB (431 words) - 05:44, 4 March 2024
• US Patent Application 18227231. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
  =METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE= ...inchu (TW)|Jia-Lin Wei of Hsinchu (TW)]][[Category:Jia-Lin Wei of Hsinchu (TW)]]
  4 KB (519 words) - 04:03, 4 December 2023
• Taiwan semiconductor manufacturing company, ltd. (20240412991). MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME
  =MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME= ...|Tsung-En Lee of Taipei City (TW)]][[Category:Tsung-En Lee of Taipei City (TW)]]
  2 KB (242 words) - 00:56, 13 December 2024
• 18366885. INTEGRATED CIRCUIT DEVICE, MEMORY CELL AND METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
  ...u (TW)|Yen Lin Chung of Hsinchu (TW)]][[Category:Yen Lin Chung of Hsinchu (TW)]] ...u (TW)|Kao-Cheng Lin of Hsinchu (TW)]][[Category:Kao-Cheng Lin of Hsinchu (TW)]]
  4 KB (636 words) - 09:55, 19 September 2024
• US Patent Application 18365995. NANO TRANSISTORS WITH SOURCE/DRAIN HAVING SIDE CONTACTS TO 2-D MATERIAL simplified abstract
  ...|Chao-Ching Cheng of Hsinchu (TW)]][[Category:Chao-Ching Cheng of Hsinchu (TW)]] ...inchu (TW)|Yi-Tse Hung of Hsinchu (TW)]][[Category:Yi-Tse Hung of Hsinchu (TW)]]
  3 KB (374 words) - 08:43, 6 December 2023
• US Patent Application 17825516. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
  ...:[[:Category:Shuen-Shin Liang of Hsinchu (TW)|Shuen-Shin Liang of Hsinchu (TW)]]]] ...[:Category:Min-Chiang Chuang of Hsinchu (TW)|Min-Chiang Chuang of Hsinchu (TW)]]]]
  4 KB (506 words) - 10:19, 1 December 2023
• US Patent Application 18446541. SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MAKING THE SAME simplified abstract
  =SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MAKING THE SAME= ...inchu (TW)|Hung Wei Li of Hsinchu (TW)]][[Category:Hung Wei Li of Hsinchu (TW)]]
  2 KB (322 words) - 10:01, 4 December 2023
• US Patent Application 18230062. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
  =METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE= ...Weng of New Taipei City (TW)]][[Category:Ming-Hui Weng of New Taipei City (TW)]]
  3 KB (462 words) - 03:57, 4 December 2023
• MediaTek Inc. (20240291524). Trigger-Based Implicit Feedback For Implicit Beamforming In Wireless Communications simplified abstract
  ...-En Hsieh of Hsinchu City (TW)]][[Category:Cheng-En Hsieh of Hsinchu City (TW)]] ...Tseng of Hsinchu City (TW)]][[Category:Ming-Hsiang Tseng of Hsinchu City (TW)]]
  4 KB (500 words) - 08:05, 29 August 2024
• 17836781. SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
  =SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE= ...|Shuen-Shin Liang of Hsinchu (TW)]][[Category:Shuen-Shin Liang of Hsinchu (TW)]]
  5 KB (689 words) - 12:41, 14 December 2023
• Taiwan semiconductor manufacturing co., ltd. (20240312492). INTEGRATED CIRCUIT DEVICE, MEMORY CELL AND METHOD simplified abstract
  ...u (TW)|Yen Lin Chung of Hsinchu (TW)]][[Category:Yen Lin Chung of Hsinchu (TW)]] ...u (TW)|Kao-Cheng Lin of Hsinchu (TW)]][[Category:Kao-Cheng Lin of Hsinchu (TW)]]
  4 KB (669 words) - 06:52, 19 September 2024
• 17655645. Staggered Metal Mesh on Backside of Device Die and Method Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
  =Staggered Metal Mesh on Backside of Device Die and Method Forming Same= ...-Sung Huang of Tainan City (TW)]][[Category:Tzu-Sung Huang of Tainan City (TW)]]
  4 KB (622 words) - 02:00, 4 January 2024
• 18296498. METHOD AND ELECTRONIC SYSTEM FOR HIGH DYNAMIC RANGE (HDR) IMAGING simplified abstract (MEDIATEK INC.)
  ...in-Wei Chen of Hsinchu City (TW)]][[Category:Pin-Wei Chen of Hsinchu City (TW)]] ...eh-Tsong Li of Hsinchu City (TW)]][[Category:Keh-Tsong Li of Hsinchu City (TW)]]
  4 KB (598 words) - 04:35, 18 October 2024

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