Category:Ziyin Lin of Chandler AZ US
Ziyin Lin
Ziyin Lin from Chandler AZ US has applied for patents in technology areas such as G02B6/42 with intel corporation.
Patents
Pages in category "Ziyin Lin of Chandler AZ US"
The following 16 pages are in this category, out of 16 total.
1
- 18373457. STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION (Intel Corporation)
- 18374932. CONTROLLING SUBSTRATE BUMP HEIGHT (INTEL CORPORATION)
- 18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION)
- 18375244. APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (INTEL CORPORATION)
- 18476089. TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS (Intel Corporation)
- 18478077. POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE (INTEL CORPORATION)
- 18478538. METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES (INTEL CORPORATION)
- 18977572. GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS (Intel Corporation)
I
- Intel corporation (20250102744). TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS
- Intel corporation (20250105074). GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS
- Intel corporation (20250106983). STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Intel corporation (20250110295). POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE
- Intel corporation (20250112085). APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Intel corporation (20250112136). GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Intel corporation (20250112161). METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES
- Intel corporation (20250112164). CONTROLLING SUBSTRATE BUMP HEIGHT