18476089. TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS (Intel Corporation)
TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS
Organization Name
Inventor(s)
Feifei Cheng of Chandler AZ US
Kumar Abhishek Singh of Phoenix AZ US
Peter A. Williams of Phoenix AZ US
Saikumar Jayaraman of Chandler AZ US
Anurag Tripathi of Gilbert AZ US
Divya Pratap of Hillsboro OR US
Stephanie J. Arouh of Phoenix AZ US
TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS
This abstract first appeared for US patent application 18476089 titled 'TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS
Original Abstract Submitted
Technologies for fiber array unit (FAU) lid designs are disclosed. In one embodiment, channels in the lid allow for suction to be applied to fibers that the lid covers, pulling the fibers into place in a V-groove. The suction can hold the fibers in place as the fiber array unit is mated with a photonic integrated circuit (PIC) die. Additionally or alternatively, channels can be on pitch, allowing for pulling the FAU towards a PIC die as well as sensing the position and alignment of the FAU to the PIC die. In another embodiment, a warpage amount of a PIC die is characterized, and a FAU lid with a similar warpage is fabricated, allowing for the FAU to position fibers correctly relative to waveguides in the PIC die. In another embodiment, a FAU has an extended lid, which can provide fiber protection as well as position and parallelism tolerance control.
- Intel Corporation
- Feifei Cheng of Chandler AZ US
- Kumar Abhishek Singh of Phoenix AZ US
- Peter A. Williams of Phoenix AZ US
- Ziyin Lin of Chandler AZ US
- Fan Fan of Chandler AZ US
- Yang Wu of Chandler AZ US
- Saikumar Jayaraman of Chandler AZ US
- Baris Bicen of Chandler AZ US
- Darren Vance of Gilbert AZ US
- Anurag Tripathi of Gilbert AZ US
- Divya Pratap of Hillsboro OR US
- Stephanie J. Arouh of Phoenix AZ US
- G02B6/42
- CPC G02B6/423