Category:Susmit Singha Roy of Campbell CA (US)
Susmit Singha Roy
Susmit Singha Roy from Campbell CA (US) has applied for patents in technology areas such as C23C16/455, C23C16/40, H01J37/32 with applied materials, inc..
Patents
Subcategories
This category has only the following subcategory.
N
Pages in category "Susmit Singha Roy of Campbell CA (US)"
The following 15 pages are in this category, out of 15 total.
1
- 17839809. METHOD OF FORMING CARBON-BASED SPACER FOR EUV PHOTORESIST PATTERNS simplified abstract (Applied Materials, Inc.)
- 17960569. CARBON REPLENISHMENT OF SILICON-CONTAINING MATERIAL simplified abstract (Applied Materials, Inc.)
- 17991931. AREA SELECTIVE DEPOSITION THROUGH SURFACE SILYLATION simplified abstract (Applied Materials, Inc.)
- 18109365. ELECTRONIC DEVICE FABRICATION USING AREA-SELECTIVE DEPOSITION simplified abstract (Applied Materials, Inc.)
- 18209700. NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION (Applied Materials, Inc.)
- 18209711. IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION (Applied Materials, Inc.)
- 18383182. MULTILAYER INNER SPACER FOR GATE-ALL-AROUND DEVICE simplified abstract (Applied Materials, Inc.)
- 18455508. SEAM PERFORMANCE IMPROVEMENT USING HYDROXYLATION FOR GAPFILL (Applied Materials, Inc.)
- 18538273. INNER SPACER LINER FOR GATE-ALL-AROUND DEVICE simplified abstract (Applied Materials, Inc.)
- 18581598. METAL BASED HYDROGEN BARRIER simplified abstract (Applied Materials, Inc.)
- 18615539. AREA SELECTIVE CARBON-BASED FILM DEPOSITION simplified abstract (Applied Materials, Inc.)
A
- Applied materials, inc. (20240282632). ELECTRONIC DEVICE FABRICATION USING AREA-SELECTIVE DEPOSITION simplified abstract
- Applied materials, inc. (20240420934). IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Applied materials, inc. (20240420952). NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Applied materials, inc. (20250066913). SEAM PERFORMANCE IMPROVEMENT USING HYDROXYLATION FOR GAPFILL