Category:C23C14/34
- Section C: Chemistry; Metallurgy
- Class C23: Coating Metallic Material; Coating Material With Metallic Material
- Subclass C23C: Coating Metallic Material
- Main Group C23C14/00: Coating by vacuum evaporation, by sputtering, or by ion implantation of the coating forming material
- Subgroup C23C14/34: Coating on selected surface areas, e.g., using masks
Classification "C23C14/34" relates to methods and processes in the field of chemistry and metallurgy, specifically focusing on coating metallic materials. This subgroup pertains to the techniques of vacuum evaporation, sputtering, or ion implantation for depositing coating material, with a particular emphasis on applying coatings to selected areas of a surface, often using masks. This technique is crucial in various industrial applications, including the manufacture of semiconductor devices, where precise and selective coating is essential for functionality. The use of masks in these processes allows for selective deposition, enabling intricate patterns and structures essential for modern electronic components and other advanced material applications.
Pages in category "C23C14/34"
The following 59 pages are in this category, out of 59 total.
1
- 17384310. DEPOSITION SYSTEM AND METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17662107. SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17950046. Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) Chamber simplified abstract (Applied Materials, Inc.)
- 18091552. Methods and Apparatus for Processing a Substrate simplified abstract (Applied Materials, Inc.)
- 18093138. Programmable Electrostatic Chuck to Enhance Aluminum Film Morphology simplified abstract (Applied Materials, Inc.)
- 18093141. Programmable ESC to Enhance Aluminum Film Morphology simplified abstract (Applied Materials, Inc.)
- 18124495. MULTIWALLED CARBON NANOTUBES BASED FLEXIBLE AND BINDER--FREE ANODE FOR LI-ION BATTERIES simplified abstract (KING FAISAL UNIVERSITY)
- 18132420. SPUTTERING TARGET AND SPUTTERING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18223804. MULTIWALLED CARBON NANOTUBES BASED FLEXIBLE AND BINDER-FREE ANODE FOR LI-ION BATTERIES simplified abstract (KING FAISAL UNIVERSITY)
- 18235056. CURRENT COLLECTOR FOR ANODE-FREE ALL-SOLID-STATE BATTERY AND ANODE-FREE ALL-SOLID-STATE BATTERY INCLUDING THE SAME simplified abstract (HYUNDAI MOTOR COMPANY)
- 18237934. METHODS AND APPARATUS FOR CONTROLLING ION FRACTION IN PHYSICAL VAPOR DEPOSITION PROCESSES simplified abstract (Applied Materials, Inc.)
- 18272438. Deposition Of Piezoelectric Films simplified abstract (Applied Materials, Inc.)
- 18278795. SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, APPARATUS FOR MANUFACTURING THE SAME, AND TEMPLATE SUBSTRATE simplified abstract (KYOCERA Corporation)
- 18281456. SPUTTER DEPOSITION SOURCE, MAGNETRON SPUTTER CATHODE, AND METHOD OF DEPOSITING A MATERIAL ON A SUBSTRATE simplified abstract (Applied Materials, Inc.)
- 18418930. METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER simplified abstract (Applied Materials, Inc.)
- 18464273. PIEZOELECTRIC ELEMENT, PIEZOELECTRIC FILM, AND MANUFACTURING METHOD FOR PIEZOELECTRIC FILM simplified abstract (FUJIFILM Corporation)
- 18477060. FILM FORMING APPARATUS AND FILM FORMING METHOD simplified abstract (Tokyo Electron Limited)
- 18511890. SUBSTRATE PROCESSING APPARATUS AND CLEANING METHOD simplified abstract (Tokyo Electron Limited)
- 18512324. CONSUMABLE COMPONENT TREATING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SEMES CO., LTD.)
- 18513448. SEALING ARTICLE COMPRISING METAL COATING, METHOD OF MAKING AND METHOD OF USING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18514111. ECG Electrode, Fabrication Method Thereof, and Electronic Device simplified abstract (Huawei Technologies Co., Ltd.)
- 18515842. Semiconductor Device, Method and Machine of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18521446. SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING simplified abstract (Applied Materials, Inc.)
- 18531641. DIFFUSION BONDED TUNGSTEN CONTAINING TARGET TO COPPER ALLOY BACKING PLATE simplified abstract (Honeywell International Inc.)
- 18645905. COPPER ALLOY FILM WITH HIGH STRENGTH AND HIGH CONDUCTIVITY simplified abstract (Apple Inc.)
- 18666251. REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING simplified abstract (Applied Materials, Inc.)
- 18668768. METAL OXIDE FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR EVALUATING METAL OXIDE FILM simplified abstract (Semiconductor Energy Laboratory Co., Ltd.)
- 18706426. FOLDABLE SUBSTRATES AND METHODS OF MAKING (Corning Incorporated)
- 18706465. COATING SYSTEM, ELECTRODE PLATE WITH A COATING SYSTEM OF THIS TYPE, METHOD FOR THE PRODUCTION THEREOF, AND FUEL CELL, ELECTROLYZER OR REDOX FLOW CELL (Schaeffler Technologies AG & Co. KG)
A
- Apple inc. (20240279777). COPPER ALLOY FILM WITH HIGH STRENGTH AND HIGH CONDUCTIVITY simplified abstract
- Apple Inc. patent applications on August 22nd, 2024
- Apple Inc. patent applications on January 25th, 2024
- Applied materials, inc. (20240301546). SPUTTER DEPOSITION SOURCE, MAGNETRON SPUTTER CATHODE, AND METHOD OF DEPOSITING A MATERIAL ON A SUBSTRATE simplified abstract
- Applied materials, inc. (20240304430). REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING simplified abstract
- Applied Materials, Inc. patent applications on September 12th, 2024
H
- Huawei Technologies Co., Ltd. patent applications on March 14th, 2024
- Hyundai motor company (20240204201). CURRENT COLLECTOR FOR ANODE-FREE ALL-SOLID-STATE BATTERY AND ANODE-FREE ALL-SOLID-STATE BATTERY INCLUDING THE SAME simplified abstract
- HYUNDAI MOTOR COMPANY patent applications on June 20th, 2024
I
S
- Samsung Display Co., Ltd. patent applications on March 14th, 2024
- Samsung electronics co., ltd. (20240287668). DLC FILM DEPOSITION APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM INCLUDING THE DLC FILM DEPOSITION APPARATUS, AND SEMICONDUCOR MANUFACTURING METHOD USING THE DLC FILM DEPOSITION APPARATUS simplified abstract
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- Semiconductor energy laboratory co., ltd. (20240254616). SPUTTERING TARGET, METHOD FOR MANUFACTURING SPUTTERING TARGET, AND METHOD FOR FORMING THIN FILM simplified abstract
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD. patent applications on August 1st, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240093357). Semiconductor Device, Method and Machine of Manufacture simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240183025). FILM FORMING APPARATUS AND METHOD FOR REDUCING ARCING simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240381787). TARGET FOR MRAM simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
U
- US Patent Application 18230669. IN SITU AND TUNABLE DEPOSITION OF A FILM simplified abstract
- US Patent Application 18360667. PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME simplified abstract
- US Patent Application 18361729. DEPOSITION SYSTEM AND METHOD simplified abstract
- US Patent Application 18447543. SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL simplified abstract
- US Patent Application 18447911. DEPOSITION SYSTEM AND METHOD simplified abstract