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Category:H01L49/02
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A
Pages in category "H01L49/02"
The following 95 pages are in this category, out of 95 total.
1
- 17412622. DOUBLE-SIDED STACKED DTC STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17446405. RESISTOR WITHIN A VIA simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17457667. HIGH-DENSITY METAL-INSULATOR-METAL CAPACITOR INTEGRATION WTH NANOSHEET STACK TECHNOLOGY simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17457747. METAL-INSULATOR-METAL CAPACITOR STRUCTURE WITH ENLARGED CAPACITOR AREA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17458573. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17491012. TWO-TERMINAL MEMORY DEVICE, A METHOD FOR MANUFACTURING THE SAME, AND A SEMICONDUCTOR DEVICE INCLUDING A TWO-TERMINAL MEMORY DEVICE simplified abstract (Hyundai Motor Company)
- 17491012. TWO-TERMINAL MEMORY DEVICE, A METHOD FOR MANUFACTURING THE SAME, AND A SEMICONDUCTOR DEVICE INCLUDING A TWO-TERMINAL MEMORY DEVICE simplified abstract (Kia Corporation)
- 17540389. UNIFORMLY PATTERNED TWO-TERMINAL DEVICES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17547093. METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE FOR LAYER COUNT REDUCTION AND LOWER CAPACITANCE VARIATION simplified abstract (QUALCOMM Incorporated)
- 17547700. INTEGRATED CIRCUIT DEVICES INCLUDING A METAL RESISTOR AND METHODS OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17564699. CAPACITOR, ELECTRONIC DEVICE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17569279. CAPACITOR DEVICE WITH MULTI-LAYER DIELECTRIC STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17575145. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17674459. Semiconductor Device with Integrated Metal-Insulator-Metal Capacitors simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17702155. ANTI-FERROELECTRIC THIN-FILM STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17715389. CAPACITOR AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17715473. CAPACITOR, MEMORY DEVICE INCLUDING THE CAPACITOR, AND METHOD OF MANUFACTURING THE CAPACITOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17717731. SEMICONDUCTOR DEVICE WITH INTEGRATED METAL-INSULATOR-METAL CAPACITORS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17724344. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 17726370. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17748869. METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH SINGLE SIDE CAPACITOR simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 17805702. INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 17808178. DECOUPLING CAPACITOR INSIDE GATE CUT TRENCH simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17815784. INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17835854. HIGH DENSITY METAL LAYERS IN ELECTRODE STACKS FOR TRANSITION METAL OXIDE DIELECTRIC CAPACITORS simplified abstract (Intel Corporation)
- 17836579. CAPACITOR STRUCTURE AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 17837732. TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS simplified abstract (Intel Corporation)
- 17849930. MIM CAPACITOR AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17851290. Ferroelectric Film with Buffer Layers for Improved Reliability of Metal-Insulator-Metal Capacitor simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17856394. PLANAR T-COIL AND INTEGRATED CIRCUIT INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17861577. CAPACITOR, METHOD OF FABRICATING THE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE CAPACITOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17862482. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17867011. SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17878758. PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED STACKED TRENCH CAPACITOR DEVICES simplified abstract (QUALCOMM Incorporated)
- 17886278. ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 17887194. DEEP TRENCH CAPACITOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17901386. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17930825. FULL WAFER DEVICE WITH FRONT SIDE PASSIVE ELECTRONIC COMPONENTS simplified abstract (Intel Corporation)
- 17932182. Structure and Method of Fabrication for High Performance Integrated Passive Device simplified abstract (Apple Inc.)
- 17936990. CAPACITOR STRUCTURE EMBEDDED WITHIN SOURCE OR DRAIN REGION simplified abstract (Intel Corporation)
- 17941688. SEMICONDUCTOR DEVICE INCLUDING CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17943354. TECHNOLOGIES FOR GLASS CORE INDUCTOR simplified abstract (Intel Corporation)
- 17944649. OVER-SCULPTED STORAGE NODE simplified abstract (Micron Technology, Inc.)
- 17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)
- 17957003. HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract (Intel Corporation)
- 17957591. SELECTIVE FERROELECTRIC DEPLOYMENT FOR SINGLE-TRANSISTOR, MULTIPLE-CAPACITOR DEVICES simplified abstract (Intel Corporation)
- 17957983. THIN FILM RESISTOR MISMATCH IMPROVEMENT USING A SELF-ALIGNED DOUBLE PATTERN (SADP) TECHNIQUE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17961774. HIGH DENSITY TRENCH CAPACITOR simplified abstract (International Business Machines Corporation)
- 17972975. INTEGRATED INDUCTOR OVER TRANSISTOR LAYER simplified abstract (Intel Corporation)
- 17984417. INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17988642. PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK simplified abstract (QUALCOMM Incorporated)
- 17989633. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (UNITED MICROELECTRONICS CORP.)
- 18047978. MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONIC SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
2
- 20240014254. TRENCH CAPACITOR FILM SCHEME TO REDUCE SUBSTRATE WARPAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 20240047383. SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF MANUFACTURING THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 20240088032.Structure and Method of Fabrication for High Performance Integrated Passive Device simplified abstract (apple inc.)
B
D
I
- Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract
- Intel corporation (20240113101). CAPACITOR STRUCTURE EMBEDDED WITHIN SOURCE OR DRAIN REGION simplified abstract
- Intel corporation (20240113158). HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract
- Intel corporation (20240136279). INTEGRATED INDUCTOR OVER TRANSISTOR LAYER simplified abstract
- Intel corporation (20240234303). INTEGRATED INDUCTOR OVER TRANSISTOR LAYER simplified abstract
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on July 11th, 2024
- Intel Corporation patent applications on March 14th, 2024
- International business machines corporation (20240120369). HIGH DENSITY TRENCH CAPACITOR simplified abstract
- International Business Machines Corporation patent applications on April 11th, 2024
M
- Micron technology, inc. (20240234482). MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONIC SYSTEMS AND METHODS simplified abstract
- Micron Technology, Inc. patent applications on January 18th, 2024
- Micron Technology, Inc. patent applications on July 11th, 2024
- Micron Technology, Inc. patent applications on March 14th, 2024
Q
- Qualcomm incorporated (20240105760). INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD simplified abstract
- Qualcomm incorporated (20240162155). PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK simplified abstract
- QUALCOMM Incorporated patent applications on February 1st, 2024
- QUALCOMM Incorporated patent applications on March 28th, 2024
- QUALCOMM Incorporated patent applications on May 16th, 2024
T
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- Texas instruments incorporated (20240113156). THIN FILM RESISTOR MISMATCH IMPROVEMENT USING A SELF-ALIGNED DOUBLE PATTERN (SADP) TECHNIQUE simplified abstract
- TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024
U
- US Patent Application 17751936. STORAGE CAPACITOR WITH MULTIPLE DIELECTRICS simplified abstract
- US Patent Application 17752638. METHOD OF FABRICATING STORAGE CAPACITOR WITH MULTIPLE DIELECTRICS simplified abstract
- US Patent Application 17824436. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 17824924. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- US Patent Application 17827006. NANO THROUGH SUBSTRATE VIAS FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS simplified abstract
- US Patent Application 17827251. SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS simplified abstract
- US Patent Application 17827837. MULTILAYER STRUCTURE, CAPACITOR STRUCTURE AND ELECTRONIC DEVICE simplified abstract
