Category:Johanna M. Swan of Scottsdale AZ US
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Johanna M. Swan
Johanna M. Swan from Scottsdale AZ US has applied for patents in technology areas such as H01L23/00, H01L25/00, H01L25/18 with intel corporation.
Patents
Pages in category "Johanna M. Swan of Scottsdale AZ US"
The following 5 pages are in this category, out of 5 total.
I
- Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES
- Intel corporation (20250006695). PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING
- Intel corporation (20250022845). MICROELECTRONIC ASSEMBLIES
- Intel corporation (20250096194). MICROELECTRONIC ASSEMBLIES