18965717. MICROELECTRONIC ASSEMBLIES (Intel Corporation)
MICROELECTRONIC ASSEMBLIES
Organization Name
Inventor(s)
Shawna M. Liff of Scottsdale AZ US
Adel A. Elsherbini of Tempe AZ US
Johanna M. Swan of Scottsdale AZ US
Arun Chandrasekhar of Chandler AZ US
MICROELECTRONIC ASSEMBLIES
This abstract first appeared for US patent application 18965717 titled 'MICROELECTRONIC ASSEMBLIES
Original Abstract Submitted
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.
