Intel corporation (20250022845). MICROELECTRONIC ASSEMBLIES
MICROELECTRONIC ASSEMBLIES
Organization Name
Inventor(s)
Adel A. Elsherbini of Tempe AZ US
Johanna M. Swan of Scottsdale AZ US
Shawna M. Liff of Scottsdale AZ US
MICROELECTRONIC ASSEMBLIES
This abstract first appeared for US patent application 20250022845 titled 'MICROELECTRONIC ASSEMBLIES
Original Abstract Submitted
microelectronic assemblies, related devices and methods, are disclosed herein. in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a first die having a first surface and an opposing second surface embedded in a first dielectric layer, where the first surface of the first die is coupled to the second surface of the package substrate by first interconnects; a second die having a first surface and an opposing second surface embedded in a second dielectric layer, where the first surface of the second die is coupled to the second surface of the first die by second interconnects; and a third die having a first surface and an opposing second surface embedded in a third dielectric layer, where the first surface of the third die is coupled to the second surface of the second die by third interconnects.
