LAM RESEARCH CORPORATION Patent Application Trends in 2025
LAM RESEARCH CORPORATION Patent Filing Activity
LAM RESEARCH CORPORATION patent applications in 2025
Top 10 Technology Areas
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- C23C16/52 (Controlling or regulating the coating process {()
- Count: 26 patents
- Example: 20240234091. DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF (Lam Research Corporation)
- C23C16/45565 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion)
- Count: 23 patents
- Example: 20240234106. TRIPOLAR ELECTRODE ARRANGEMENT FOR ELECTROSTATIC CHUCKS (LAM RESEARCH CORPORATION)
- H01J37/32715 (Gas-filled discharge tubes (heating by discharge)
- Count: 22 patents
- Example: 20240234106. TRIPOLAR ELECTRODE ARRANGEMENT FOR ELECTROSTATIC CHUCKS (LAM RESEARCH CORPORATION)
- H01L21/67069 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se)
- Count: 21 patents
- Example: 20240234104. MULTI-SECTIONAL PLASMA CONFINEMENT RING STRUCTURE (Lam Research Corporation)
- H01L21/6833 (for supporting or gripping (for conveying)
- Count: 18 patents
- Example: 20240234106. TRIPOLAR ELECTRODE ARRANGEMENT FOR ELECTROSTATIC CHUCKS (LAM RESEARCH CORPORATION)
- H01J37/32183 ({Matching circuits})
- H01J37/3244 (Gas-filled discharge tubes (heating by discharge)
- Count: 14 patents
- Example: 20240234106. TRIPOLAR ELECTRODE ARRANGEMENT FOR ELECTROSTATIC CHUCKS (LAM RESEARCH CORPORATION)
- H01J37/32449 (Gas-filled discharge tubes (heating by discharge)
- Count: 14 patents
- Example: 20240234208. VOID FREE LOW STRESS FILL (Lam Research Corporation)
- H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se)
- Count: 13 patents
- Example: 20240234112. IMAGE ANALYSIS OF PLASMA CONDITIONS (Lam Research Corporation)
- C23C16/45544 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion)
- Count: 13 patents
- Example: 20240234152. NON-METAL INCORPORATION IN MOLYBDENUM ON DIELECTRIC SURFACES (Lam Research Corporation)
Emerging Technology Areas
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- H01L21/76865 ({Selective removal of parts of the layer ()
- Count: 1 patents
- Example: 20240047269. MOLYBDENUM DEPOSITION IN FEATURES (Lam Research Corporation)
- G05B19/418 (CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables)
- Count: 1 patents
- Example: 20240047183. REAL-TIME CONTROL OF TEMPERATURE IN A PLASMA CHAMBER (Lam Research Corporation)
- G03F7/707 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices)
- Count: 1 patents
- Example: 20240045344. PROTECTIVE COATING FOR ELECTROSTATIC CHUCKS (Lam Research Corporation)
- F16K99/0059 (Subject matter not provided for in other groups of this subclass)
- F16K99/0028 (Subject matter not provided for in other groups of this subclass)
- F16K99/0015 (Subject matter not provided for in other groups of this subclass)
- H01J37/3211 (Gas-filled discharge tubes (heating by discharge)
- H01L23/53295 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- B05D1/60 ({Deposition of organic layers from vapour phase (vapour phase deposition in general)
- H01L21/76834 ({formation of thin insulating films on the sidewalls or on top of conductors ()
Top Inventors
- Samantha SiamHwa TAN of Newark CA (US) (12 patents)
- Karl Frederick Leeser of West Linn OR (US) (11 patents)
- Yang PAN of Los Altos CA (US) (11 patents)
- Sunil Kapoor of Vancouver WA (US) (8 patents)
- Samantha S.H. Tan of Newark CA (US) (7 patents)
- Jeffrey MARKS of Saratoga CA (US) (7 patents)
- David French of Fort Myers FL (US) (6 patents)
- Jengyi Yu of San Ramon CA (US) (6 patents)
- Karl Frederick LEESER of West Linn OR (US) (5 patents)
- Michal Danek of Cupertino CA (US) (5 patents)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- LAM RESEARCH CORPORATION
- Companies
- CPC B25J15/08
- CPC B25J17/02
- CPC G03F7/0043
- CPC G03F7/095
- CPC G03F7/167
- CPC G03F7/2006
- CPC G03F7/30
- CPC G03F7/36
- CPC H01J37/32146
- CPC C23C16/517
- CPC C23C16/52
- CPC H01J37/32174
- CPC H01L21/0272
- CPC H01L21/31144
- CPC H01L21/32139
- CPC H01J2237/3321
- CPC H01J37/32642
- CPC H01J37/32568
- CPC H01J2237/3343
- CPC H01L21/67069
- CPC H01J37/32715
- CPC C23C16/45565
- CPC C23C16/4583
- CPC C23C16/50
- CPC H01J37/3244
- CPC H01J37/32541
- CPC H01L21/6833
- CPC H01J2237/2007
- CPC H01J2237/20207
- CPC H01J37/32972
- CPC G06T7/0004
- CPC H01J37/32926
- CPC H01J37/32981
- CPC H01J37/3299
- CPC H01L21/67248
- CPC H01L21/67253
- CPC H01J37/32944
- CPC H01J2237/221
- CPC H01J2237/3341
- CPC H01L21/28568
- CPC C23C16/02
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- CPC C23C16/46
- CPC H01L21/68785
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- CPC H01L21/68735
- CPC H01L21/76879
- CPC C23C16/04
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- CPC C23C16/45534
- CPC H01J37/32449
- CPC H01L21/76843
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- CPC H10B69/00
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- CPC H01L21/6715
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- CPC H01L29/41775
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- CPC H01L29/6656
- CPC H01L29/66795
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- CPC H01J37/32724
- CPC C23C16/4581
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- CPC H01J37/32807
- CPC G01F25/15
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- CPC H01J37/32091
- CPC H01J2237/24585
- CPC G03F7/094
- CPC C23C16/047
- CPC G03F1/22
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- CPC G03F7/2004
- CPC G03F7/70033
- CPC H01L21/0274
- CPC H01L21/0332
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- CPC G03F7/70504
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- CPC H03H7/40
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- CPC H01L21/31138
- CPC B08B5/023
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- CPC C23C16/4557
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- CPC C23C16/56
- CPC H01J37/32834
- CPC H01J2237/2001
- CPC H01J2237/332
- CPC H01L21/76864
- CPC C23C18/08
- CPC H01L21/28562
- CPC H01L21/76876
- CPC H01L21/76877
- CPC H01L23/5226
- CPC H01L23/53266
- CPC H10B12/488
- CPC H10B41/27
- CPC H10B43/27
- CPC G01B7/14
- CPC C23C16/507
- CPC F04D19/042
- CPC H01J37/32513
- CPC H01L21/68792
- CPC H01J37/32633
- CPC H01L21/6831
- CPC H01J37/32862
- CPC H01L21/32136
- CPC H01J37/32165
- CPC H01L21/0337
- CPC C23C16/26
- CPC C23C16/401
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- CPC H01L21/31111
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- CPC H01J37/3266
- CPC H01J2237/24564
- CPC G03F7/0042
- CPC C11D7/08
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- CPC C11D7/3218
- CPC C11D7/5013
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- CPC H01L21/67161
- CPC H01L21/68
- CPC C23C16/45572
- CPC C23C16/505
- CPC G01K7/00
- CPC H01L21/67103
- CPC H05B3/02
- CPC F16K11/105
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- CPC F16M13/02
- CPC G03F7/168
- CPC G03F7/40
- CPC H01L21/02115
- CPC H01L21/31053
- CPC H01J37/32128
- CPC H01J37/32816
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- CPC H01J37/32477
- CPC B05D1/02
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- CPC H01L21/32137
- CPC H01J2237/327
- CPC C23C16/045
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- CPC C23C16/45553
- CPC H01L21/67023
- CPC H01L21/76808
- CPC H01J37/32357
- CPC H01J37/32467
- CPC H01J37/32697
- CPC H01L21/68757
- CPC H01J37/32577
- CPC B25J11/0085
- CPC B25J5/007
- CPC B25J9/162
- CPC H01J37/32495
- CPC C23C16/45536
- CPC C23C16/4408
- CPC C23C16/45519
- CPC C23C16/45574
- CPC H01J37/32155
- CPC G01J5/485
- CPC C23C16/0227
- CPC G01J5/0066
- CPC G01J5/0859
- CPC G01M3/38
- CPC G06T7/001
- CPC G06T7/13
- CPC G01J2005/0077
- CPC G06T2207/10048
- CPC G06T2207/20084
- CPC G06T2207/30148
- CPC H04N23/23
- CPC H01J2237/002
- CPC H01L21/67772
- CPC H01L21/67775
- CPC H01J37/32238
- CPC H01J37/32119
- CPC H01J37/3255
- CPC C23C16/45561
- CPC C23C16/45597
- CPC H01L22/12
- CPC H01L23/562
- CPC H01L21/28079
- CPC C23C16/0272
- CPC C23C16/45525
- CPC C04B41/0072
- CPC B24C1/003
- CPC H01L21/0217
- CPC H01L21/02216
- CPC H01L21/0262
- CPC H01L21/68771
- CPC H01L21/02532
- CPC H01L21/02595
- CPC H01J37/32522
- CPC G01M3/165
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- CPC G08B21/20
- CPC H01J37/3288
- CPC H01L21/02334
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- CPC H01L21/6838
- CPC H01L21/68728
- CPC H10N50/01
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- CPC H01J2237/24495
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- CPC H02N13/00
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- CPC B65G1/1371
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- CPC B65G2203/0216
- CPC B65G2203/041
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- CPC H01L21/02205
- CPC H01L21/76831
- CPC H01L21/76805
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- CPC H01L2224/40225
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- CPC H01L2224/48647
- CPC H01L2224/49175
- CPC C23C16/4405
- CPC H01L21/67
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- CPC H01L21/2885
- CPC C25D17/008
- CPC C25D5/54
- CPC H01L21/67225
- CPC G03F7/16
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- CPC H01L21/67167
- CPC H01L21/67207
- CPC G01B11/0683
- CPC C23C14/547
- CPC G01B11/0625
- CPC G01B11/14
- CPC B05D2202/25
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- CPC H01L21/68764
- CPC G05B2219/45031
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- CPC H01J37/32376
- CPC H01J37/32825
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- CPC H01L21/67745
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- CPC H01L21/7685
- CPC H01L23/53238
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- CPC H01L21/02087
- CPC H01J37/32385
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- CPC H01L21/02244
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- CPC H05B3/283
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- CPC C04B2235/386
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- CPC H01L21/67201
- CPC H01L21/68721
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- CPC H01J2237/3348
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- CPC H01L21/0214
- CPC H01L21/02167
- CPC C23C16/45512
- CPC C23C16/042
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- CPC C23C16/509
- CPC H01L21/67196
- CPC H10B12/053
- CPC H10B12/34
- CPC B05B1/14
- CPC B05B1/30
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- CPC G01N21/9505
- CPC G01B11/06
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- CPC G06F30/337
- CPC G01N21/9501
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- CPC G01R27/2605
- CPC H01L23/642
- CPC H01L21/67028
- CPC H01L2223/6655
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- CPC H01L21/02131
- CPC F16K27/003
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- CPC H05B1/0202
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- CPC G03F7/70925
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- CPC H01L21/32051
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- CPC C23C16/402
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- CPC H01L21/67706
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- CPC B05C13/02
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- CPC H01J2237/3342
- CPC H01L21/76834
- CPC B05D1/60
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- CPC H01J37/3211
- CPC F16K99/0015
- CPC F16K99/0028
- CPC F16K99/0059
- CPC G03F7/707
- CPC G05B19/418
- CPC H01L21/76865
- Patent Trends by Company in 2024