Category:David French of Fort Myers FL (US)

David French of Fort Myers FL (US)

Executive Summary

David French of Fort Myers FL (US) is an inventor who has filed 6 patents. Their primary areas of innovation include Gas-filled discharge tubes (heating by discharge (3 patents), ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps (3 patents), {Matching circuits} (3 patents), and they have worked with companies such as Lam Research Corporation (6 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01J37/32174 (Gas-filled discharge tubes (heating by discharge): 3 patents
• H01J2237/3321 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 3 patents
• H01J37/32183 ({Matching circuits}): 3 patents
• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 3 patents
• H01J37/32146 (Gas-filled discharge tubes (heating by discharge): 2 patents
• C23C16/517 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 2 patents
• C23C16/52 (Controlling or regulating the coating process {(): 2 patents
• H01L21/0272 (Making masks on semiconductor bodies for further photolithographic processing not provided for in group): 2 patents
• H01L21/31144 ({using masks}): 2 patents
• H01L21/32139 ({using masks}): 2 patents
• G01R19/2509 (using digital measurement techniques): 2 patents
• G01R15/16 (using capacitive devices): 2 patents
• H01L21/67161 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 2 patents
• H01J37/32935 (Gas-filled discharge tubes (heating by discharge): 2 patents
• G01R15/18 (using inductive devices, e.g. transformers): 1 patents
• H01J37/32899 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J2237/24495 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 1 patents
• H01J2237/24564 (Measurements of electric or magnetic variables, e.g. voltage, current, frequency): 1 patents
• G01R15/183 (using inductive devices, e.g. transformers): 1 patents
• G01R19/16528 (Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values): 1 patents
• G01R25/00 (Arrangements for measuring phase angle between a voltage and a current or between voltages or currents): 1 patents
• G01R35/007 ({Standards or reference devices, e.g. voltage or resistance standards, "golden references"}): 1 patents
• H01J37/32926 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/3244 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32642 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01L21/67288 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67259 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67207 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67069 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67167 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/68771 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01J37/32385 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32577 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01L21/67201 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01J37/32715 (Gas-filled discharge tubes (heating by discharge): 1 patents

Companies

List of Companies

• Lam Research Corporation: 6 patents

Collaborators

• Sunil Kapoor of Vancouver WA (US) (3 collaborations)
• Matthew Scott Weimer of Portland OR (US) (2 collaborations)
• Pramod Subramonium of Portland OR (US) (2 collaborations)
• Ragesh Puthenkovilakam of Portland OR (US) (2 collaborations)
• Rujun Bai of King City OR (US) (2 collaborations)
• Gary Lemson of San Jose CA (US) (1 collaborations)
• Liang Meng of Sherwood OR (US) (1 collaborations)
• Sam Jafarian Tehrani of Fremont CA (US) (1 collaborations)
• Karl Frederick Leeser of West Linn OR (US) (1 collaborations)
• John Michael Wiltse of Lake Oswego OR (US) (1 collaborations)
• Edward Augustyniak of Tualatin OR (US) (1 collaborations)
• Yukinori Sakiyama of West Linn OR (US) (1 collaborations)
• George Thomas of Fremont CA (US) (1 collaborations)