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Category:H01L25/04
Subcategories
This category has the following 11 subcategories, out of 11 total.
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Pages in category "H01L25/04"
The following 39 pages are in this category, out of 39 total.
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- 17892846. INTEGRATION OF SOLAR CELL AND IMAGE SENSOR simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18166116. BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18433047. PROXIMITY SENSOR simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18586407. ELECTRONIC DEVICE WITH MICRO-PHOTOELECTRIC UNITS simplified abstract (LG Display Co., Ltd.)
- 18596076. Asic Package With Photonics And Vertical Power Delivery simplified abstract (Google LLC)
- 18596488. ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract (Intel Corporation)
- 18666589. OPTICAL SENSOR AND DISPLAY APPARATUS simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18694732. IMAGING DEVICE (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18897125. RADIATION DETECTOR (Japan Display Inc.)
- 18964984. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 19001405. ELECTRONIC DEVICE WITH MICRO-PHOTOELECTRIC UNITS (LG Display Co., Ltd.)
- 19014249. ELECTRONIC DEVICE (InnoLux Corporation)
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- Samsung electronics co., ltd. (20240260485). QUANTUM PROCESSING ARCHITECTURE
- Samsung Electronics Co., Ltd. (20240260485). QUANTUM PROCESSING ARCHITECTURE
- Samsung electronics co., ltd. (20240260485). QUANTUM PROCESSING ARCHITECTURE simplified abstract
- Samsung Electronics Co., Ltd. (20240260485). QUANTUM PROCESSING ARCHITECTURE simplified abstract
- Samsung electronics co., ltd. (20250096061). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
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- Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Texas instruments incorporated (20240178184). PROXIMITY SENSOR simplified abstract
- TEXAS INSTRUMENTS INCORPORATED patent applications on May 30th, 2024