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Category:H01L23/36
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This category has the following 27 subcategories, out of 27 total.
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Pages in category "H01L23/36"
The following 89 pages are in this category, out of 89 total.
1
- 17535664. MULTIPLE DIE ASSEMBLY simplified abstract (International Business Machines Corporation)
- 17676866. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18047670. SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR simplified abstract (NXP B.V.)
- 18091943. EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (NVIDIA Corporation)
- 18125928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18151629. INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18230768. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18243437. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18264833. PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD simplified abstract (RESONAC CORPORATION)
- 18399105. SEMICONDUCTOR POWER MODULE simplified abstract (ROHM CO., LTD.)
- 18402755. APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURING THE SAME simplified abstract (Micron Technology, Inc.)
- 18403462. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (SAMSUNG ELECTRONICS CO., LTD.)
- 18404431. DIE STRUCTURES AND METHODS OF FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18474158. THERMALLY AWARE STACKING TOPOLOGY simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18498031. DUMMY DIES AND METHOD OF FORMING THE SAME (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18579634. SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND WIRELESS COMMUNICATION APPARATUS simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18641782. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18672001. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674903. PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18735475. Packaged Device, Power Module, and Electronic Apparatus simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18735789. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18818203. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
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- Mitsubishi electric corporation (20240347403). SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation patent applications on October 17th, 2024
- Murata manufacturing co., ltd. (20240413036). SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Murata Manufacturing Co., Ltd. patent applications on December 12th, 2024
N
S
- Samsung electronics co., ltd. (20240105636). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240113077). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240290720). INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240429066). METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20240429111). SEMICONDUCTOR MEMORY MODULE INCLUDING FIXING STRUCTURE
- Samsung electronics co., ltd. (20250006582). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Samsung electronics co., ltd. (20250062257). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Samsung electronics co., ltd. (20250079319). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Samsung electronics co., ltd. (20250079338). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250087596). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250087647). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250105158). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 23rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 23rd, 2025
- Samsung Electronics Co., Ltd. patent applications on January 2nd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 2nd, 2025
- Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
- Sony semiconductor solutions corporation (20240322028). SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND WIRELESS COMMUNICATION APPARATUS simplified abstract
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION patent applications on September 26th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240312859). PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312904). METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250087555). DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105530). Integrated Circuit Packages, Devices Using the Same, and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240213236). INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379601). INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250015050). DUMMY DIES AND METHOD OF FORMING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250062179). METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 9th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 27th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Tesla, inc. (20250006583). SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME
- Tesla, inc. (20250006600). SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE
- Tesla, Inc. patent applications on January 2nd, 2025
U
- US Patent Application 18363363. INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract
- US Patent Application 18446076. STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE simplified abstract
- US Patent Application 18447927. SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT AND METHOD OF MAKING simplified abstract
