Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
Patent Applications by Samsung Electronics Co., Ltd. on February 20th, 2025
Samsung Electronics Co., Ltd.: 168 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (32), H01L23/498 (19), H01L23/31 (18), H01L25/065 (13), H01L25/18 (11) H01L23/49838 (5), H01L23/5386 (4), H10B12/482 (3), H04W24/10 (3), H01L23/5283 (2)
With keywords such as: layer, semiconductor, device, data, structure, substrate, including, based, surface, and upper in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Jongjin KO of Suwon-si (KR) for samsung electronics co., ltd., Heejun KANG of Suwon-si (KR) for samsung electronics co., ltd., Jongwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Sunghoon BYEON of Suwon-si (KR) for samsung electronics co., ltd., Jaegeun SON of Suwon-si (KR) for samsung electronics co., ltd., Donghoon SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jaechan LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L11/40, A47L11/24, H04W4/33, H04W4/80, H04W76/10
CPC Code(s): A47L11/4011
Abstract: a robot cleaner having a function of performing a wireless connection with a home appliance in an insufficient wireless coverage area inside a home includes a brush for performing cleaning to suck in dust while the robot cleaner is moving, a driving unit configured to move the robot cleaner to perform cleaning through the brush, a processor configured to, based on determining that the wireless connection with a first home appliance inside the home is unavailable, drive and control the driving unit to move within a predetermined distance from the first home appliance to establish the wireless connection with the first home appliance, and a communication interface configured to receive a connection request signal from the first home appliance, and upon receiving the connection request signal, establish the wireless connection based on the connection request signal.
Inventor(s): Johannes BÜSING of Suwon-si (KR) for samsung electronics co., ltd., Jongwook KWON of Suwon-si (KR) for samsung electronics co., ltd., Sojeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Changhyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunjoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Woojin SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L15/42, A47L15/48
CPC Code(s): A47L15/4287
Abstract: a dishwasher including a tub provided in the cabinet to form a washing chamber, and a drying apparatus arranged on a side wall of the tub and including a flow path provided to allow air sucked from the washing chamber to flow, a heater arranged in the flow path to heat air in the flow path, and a switch arranged upstream of the heater to turn off the heater in response to air, which is adjacent to the heater, reaching a predetermined temperature.
Inventor(s): Jung Wook LIM of Hwaseong-si (KR) for samsung electronics co., ltd., Young Gu Jin of Osan-si (KR) for samsung electronics co., ltd.
IPC Code(s): B60R1/22, H01L27/146
CPC Code(s): B60R1/22
Abstract: a unit pixel includes a first photoelectric converter, a first transfer transistor disposed between to the first photoelectric converter and a first node, a connection transistor disposed between and connected to a second node and the first node, a second transfer transistor disposed between and connected to a third node and the second node, a second photoelectric converter connected to the third node, and a storage metal-oxide semiconductor (mos) capacitor connected to the third node. the storage mos capacitor stores charges from the second photoelectric converter. for a first time period, first charges accumulated in the first photoelectric converter are transferred to the first node, for a second time period, second charges accumulated in the first photoelectric converter are transferred to the first node and the second node, and for a third time period, third charges accumulated in the second photoelectric converter are transferred to the first to third nodes.
Inventor(s): Jinhyuk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Woo Jung PARK of Suwon-si (KR) for samsung electronics co., ltd., Moonsub BYEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B60W30/165, G06V10/70, G06V20/56, G06V20/58, G08G1/056
CPC Code(s): B60W30/165
Abstract: a method is performed by an electronic device of an ego vehicle that includes a camera, and the method includes: determining, from an image frame of a target vehicle captured by the camera, a rear box of the target vehicle, which is located in front of the ego vehicle, the rear box corresponding to a rear of the target vehicle; and determining a heading direction of the target vehicle based on the rear box and a vanishing point detected in the image frame.
Inventor(s): Minji KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyeongcheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Eunsuk BANG of Suwon-si (KR) for samsung electronics co., ltd., Jiyu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F33/38, D06F23/02, D06F33/37, D06F33/58, D06F35/00, D06F39/02, D06F39/08, D06F101/20, D06F103/20, D06F105/02, D06F105/06, D06F105/08, D06F105/42
CPC Code(s): D06F33/38
Abstract: a control method of a washing machine which includes a tub, a drum, a detergent supplier including a detergent storage space to store detergent and a softener storage space to store a softener, a water supplier to supply water to the tub, a turbidity sensor to detect turbidity of water in the tub, and a bubble circulator to perform a circulation operation of circulating water or a bubble supply operation of generating bubbles and supplying the generated bubbles to the tub, includes detecting, by the turbidity sensor, the turbidity of water in the tub, and in response to the detected turbidity of the water in the tub being lower than a first reference value, controlling the water supplier to supply water containing the softener to the tub and controlling the bubble circulator to perform a second rinsing cycle by alternately performing the circulation operation and the bubble supply operation.
Inventor(s): Hyeonkyu LIM of Suwon-si (KR) for samsung electronics co., ltd., Byoungyull YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/22, B01D46/681
CPC Code(s): D06F58/22
Abstract: a clothing treatment device including a lint cleaning device including a rotatable brush including a tip portion, a lint chamber, a chamber door that is rotatable to open and close the lint chamber, a driver to rotate the brush, and an operation assembly to rotate the chamber door. the lint cleaning device is configured so that a filter member is couplable to the lint cleaning device, the driver is operable to rotate the brush from a first position to a second position so that the tip portion of the brush is moved along, and in contact with, the filter member to remove lint from the filter member, and, while the driver rotates the brush from the first to the second position, the driver actuates the operation assembly to rotate the chamber door to open the lint chamber so that lint moved by the brush is receivable in the lint chamber.
Inventor(s): Kangrim LEE of Suwon-si (KR) for samsung electronics co., ltd., Jin JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jungwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Yongsun Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25C1/24, F25C5/08
CPC Code(s): F25C1/24
Abstract: a refrigerator includes an ice making tray in which ice making water to be supplied, an ice making device configured to generate ice by using the ice making water supplied to the ice making tray, an ice making heater configured to heat the ice making tray, a sensor configured to detect a temperature of the ice making tray, a memory that stores at least one instruction, and a processor that is connected with the memory and controls the refrigerator, wherein the processor is configured to detect a temperature change of the ice making tray during a cooling time corresponding to whether the ice making heater operates within a predetermined time after a start of ice making driving, and based on the magnitude of the temperature change of the ice making tray being greater than or equal to a value corresponding to the cooling time, stop of the ice making driving.
Inventor(s): Sookang KIM of Suwon-si (KR) for samsung electronics co., ltd., Ganghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D29/00
CPC Code(s): F25D29/005
Abstract: a refrigerator including an output interface; a user interface including at least one key mapped to a predefined operation to be performed when the refrigerator is in a normal state, the user interface being configured to receive a user input via the at least one key; and at least one processor configured to identify whether the refrigerator is in an abnormal state, based on identifying the refrigerator as being in an abnormal state, control the output interface to output a notification of the abnormal state of the refrigerator, and, based on a user input received via the at least one key while the refrigerator is identified as being in the abnormal state, control the output interface to turn off the notification of the abnormal state of the refrigerator.
Inventor(s): Yeeun Park of Suwon-si (KR) for samsung electronics co., ltd., Seungwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Taejoong Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo Ahn of Suwon-si (KR) for samsung electronics co., ltd., Seoyeon Jeong of Suwon-si (KR) for samsung electronics co., ltd., Taeyong Jo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01M11/02
CPC Code(s): G01M11/0257
Abstract: an optical measurement system includes a hemispherical mirror including a planar portion and a spherical portion having a hemispherical recessed shape in the planar portion. in the spherical portion are latitude markers formed with a different reflectance from the rest of the spherical portion. the system includes an optical unit with an objective lens and at least one beam splitter. the optical unit transmits light reflected from the hemispherical mirror through the objective lens to a first sensor. a controller measures a numerical aperture of the objective lens by aligning the hemispherical mirror to be at the focus of the objective lens, detecting a back focal image of the objective lens in which the latitude markers appear as darker circular lines, and performing calculations on the image.
Inventor(s): Rebal Al Jurdi of Allen TX (US) for samsung electronics co., ltd., Yuming Zhu of Plano TX (US) for samsung electronics co., ltd., Kyu-Hui Johnny Han of Suwon (KR) for samsung electronics co., ltd.
IPC Code(s): G01S5/14, G01S5/02
CPC Code(s): G01S5/145
Abstract: a method for estimating a position of a moving object comprises receiving one or more ranging measurements for distances between an object and one or more anchor points from a ranging device, receiving sensing data from one or more sensors, determining a distance and a heading direction of the object relative to a position of the one or more anchor points based on the one or more ranging measurements and the sensing data, applying a mapping using the distance and the heading direction of the object to correct the ranging measurements, and determining a position of the object based on the corrected ranging measurements.
Inventor(s): Seokho YUN of Seoul (KR) for samsung electronics co., ltd., Sookyoung Roh of Yongin-si (KR) for samsung electronics co., ltd., Sangyun Lee of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B3/00, G02B27/10, H04N23/60, H04N25/11
CPC Code(s): G02B3/0006
Abstract: provided is an image sensor including a color separating lens array. the image sensor includes a sensor substrate including a first pixel configured to sense first wavelength light, and a second pixel configured to sense second wavelength light; and a color separating lens array including a first wavelength light condensing region in which the first wavelength light is condensed onto the first pixel, wherein an area of the first wavelength light condensing region is greater than an area of the first pixel, and a distance between the sensor substrate and the color separating lens array is less than a focal distance of the first wavelength light condensing region with respect to the first wavelength light.
Inventor(s): Kyeongeun LEE of Suwon-si (KR) for samsung electronics co., ltd., Cheongsoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B7/02, G03B17/12, H04N23/55, H04N23/57
CPC Code(s): G02B7/021
Abstract: a camera includes a plurality of lenses, a lens housing, and an image sensor. the plurality of lenses may include an effective region and a non-effective region. a first lens may include a first protrusion protruding in an optical axis direction. the first protrusion may face a non-effective region of a second lens.
Inventor(s): Youngmo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jongchul CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B27/01
CPC Code(s): G02B27/0172
Abstract: a head-mounted display includes: a camera configured to obtain an image by capturing a scene; at least one display configured to display the image obtained by the camera; and a lens comprising a plurality of lens elements arranged between an eye of a user and the at least one display. the lens includes an aperture stop area configured to be at least a portion of an area for facing the eye of the user. the aperture stop area includes a plurality of sub-stop areas corresponding to a plurality of gaze directions by eye rotation, respectively. the modulation values of the lens at sub-fields of 0 degrees of sub-stop areas, from the plurality of sub-stop areas, corresponding to gaze directions of 0, 10, and 20 degrees are greater than 0.7. the modulation values of the lens are measured at a spatial frequency between 15 to 20 cycles/mm.
20250060618. WEARABLE ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seunghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Soonwoong YANG of Suwon-si (KR) for samsung electronics co., ltd., Jongkyun IM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02C13/00, G02B27/01, G06F1/16
CPC Code(s): G02C13/001
Abstract: a wearable electronic device according to an embodiment may include: a first member including at least one display and at least one first gear part; and a second member including at least one second gear part at least partially coupled to the at least one first gear part and at least one prescription lens disposed between the at least one display and a body of a user, wherein the second member is disposed such that a distance between the at least one display and the at least one prescription lens is adjustable according to a position at which the at least one second gear part is coupled to the at least one first gear part. various embodiments recognized through the specification are also possible.
Inventor(s): Sangyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Junghyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Byunghoon KO of Suwon-si (KR) for samsung electronics co., ltd., Sungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungwoo NOH of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F9/00, H01L23/544
CPC Code(s): G03F9/7076
Abstract: a wafer alignment system includes a wafer sensor including a wafer substrate and a phase change material layer provided on the wafer substrate, a support member to support and heat the wafer sensor, a transfer device to transfer the wafer sensor to the support member, and a measurement device to analyze crystal information of the phase change material layer of the wafer sensor and control the transfer device.
Inventor(s): Osvaldo Garcia Contreras of Vancouver (CA) for samsung electronics co., ltd., Davinder Pal Singh of Coquitlam (CA) for samsung electronics co., ltd.
IPC Code(s): G05B15/02, H04L12/28
CPC Code(s): G05B15/02
Abstract: in one embodiment, a method includes determining an edge device has entered a control area containing smart appliance(s), accessing sensor data and relative displacement data via sensors of the edge device from the edge device responsive to determining the edge device has entered the control area, wherein the relative displacement data indicates a distance of the edge device from each smart appliance in the control area and is calculated by the edge device based on the sensor data, determining environmental parameters in the control area are not satisfied based on the sensor data, determining modifications to operating parameters of a first smart appliance responsive to determining that the environmental parameters are not satisfied, wherein the first smart appliance is selected based on the relative displacement data, and sending instructions for modifying the operating parameters based on the modifications to the first smart appliance.
Inventor(s): Changho HA of Suwon-si (KR) for samsung electronics co., ltd., Shin KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangsik YOON of Suwon-si (KR) for samsung electronics co., ltd., Donghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeyoung JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jaeyoon JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/622, G05D1/246, G05D111/10, G06T7/521
CPC Code(s): G05D1/622
Abstract: a robot includes a 2d camera, a 1d distance sensor, a driving module configured to move the robot, and at least one processor. the at least one processor is configured to: obtain a 2d image by controlling the 2d camera; calculate relative depths of actual regions indicated by pixels in the 2d image, based on the obtained 2d image; obtain a reference distance to a point to which a laser output from the 1d distance sensor is irradiated; determine a distance from the robot to the object in the 2d image based on the obtained reference distance and a relative depth of a reference point corresponding to the point to which the laser is irradiated among the pixels in the 2d image; and travel based on the determined distance to the object.
Inventor(s): Junhan Choi of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myoungbo Kwak of Suwon-si (KR) for samsung electronics co., ltd., Jinook Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05F1/575, G05F1/565, G11C5/14
CPC Code(s): G05F1/575
Abstract: an example low dropout (ldo) regulator includes a voltage regulating circuit and an adaptive biasing circuit. the voltage regulating circuit is configured to regulate an output voltage of an output node connected with a load by using the output voltage as first feedback. the adaptive biasing circuit is configured to generate a biasing signal that supports regulation of the output voltage by using a sensing signal in an internal node of the voltage regulating circuit as second feedback, and to provide the biasing signal to the voltage regulating circuit.
20250060771. LOW DROPOUT REGULATORS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junhan Choi of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myoungbo Kwak of Suwon-si (KR) for samsung electronics co., ltd., Jinook Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05F1/59, G11C5/14
CPC Code(s): G05F1/59
Abstract: provided are a low dropout (ldo) regulator controlling operation biasing of a transistor connected to an output node to have a wide bandwidth and provide a stable voltage at a fast speed, and a memory device including the ldo regulator. the ldo regulator includes a first low voltage transistor in which a first terminal thereof is connected to an output node configured to provide an output voltage to a load and a second terminal thereof is connected to a first node, an operational amplifier configured to compare a reference voltage with the output voltage and output the comparison result to a gate terminal of a first low voltage transistor, and an operation biasing control circuit connected to the output node and the first node, and including at least one high voltage transistor.
20250060781. WEARABLE ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jonghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Taiyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonju SEO of Suwon-si (KR) for samsung electronics co., ltd., Hakhoon SONG of Suwon-si (KR) for samsung electronics co., ltd., Yonghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeock LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G06F3/16
CPC Code(s): G06F1/163
Abstract: a wearable electronic device including a housing forming an exterior of the wearable electronic device, a first sound conduit and a second sound conduit disposed in an internal space of the housing, a nozzle part through which the audio signals transmit both into and out of the housing, the nozzle part including an end surface of the housing, a partition wall in the internal space of the housing and spatially separating the internal space into the first sound conduit and the second sound conduit, a speaker disposed to correspond to the first sound conduit in the internal space of the housing, and a microphone disposed to correspond to the second sound conduit in the internal space of the housing.
Inventor(s): Kyungho LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngsun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jiwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwanghee RYU of Suwon-si (KR) for samsung electronics co., ltd., Jungchul AN of Suwon-si (KR) for samsung electronics co., ltd., Chulhyo YOON of Suwon-si (KR) for samsung electronics co., ltd., Seungki CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G06F3/0354, G06F3/041, H04M1/02
CPC Code(s): G06F1/1652
Abstract: an electronic device may include: a first housing; a second housing; a hinge structure; a display; and a sensor panel, wherein the sensor panel comprises: a support layer which comprises a polymer inclusive material and is in contact with an adhesive material arranged on at least one of a first surface of the first housing and a third surface of the second housing; a shielding layer arranged on the support layer; a first insulating layer arranged on the shielding layer; a first conductive pattern arranged on the first insulating layer; a second insulating layer arranged on the first conductive pattern; a second conductive pattern arranged on the second insulating layer; and a third insulating layer arranged on the second conductive pattern and facing one surface of the display, wherein the thickness of at least one of the first insulating layer and the third insulating layer is greater than the thickness of the second insulating layer.
Inventor(s): Jungchul AN of Suwon-si (KR) for samsung electronics co., ltd., Seonghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, H04M1/02
CPC Code(s): G06F1/1652
Abstract: an electronic device is provided. the electronic device includes a first housing, a second housing rotatably coupled to the first housing, a display panel a portion of which is transformed by rotation of the second housing relative to the first housing, a support plate disposed below the display panel to support the display panel and including a region where the display panel is transformed, wherein the support plate includes a first portion including multiple openings which are arranged at predetermined intervals, and a second portion excluding the first portion, a first reinforcement plate disposed below the support plate and disposed in the first housing such that at least a portion thereof is located in the first portion, and a second reinforcement plate disposed below the support plate and disposed in the second housing such that at least a portion thereof is located in the first portion, wherein the first portion of the support plate includes a first region in which a width between the openings in a first direction is a first width, and a second region in which a width between the openings in a first direction is a second width greater than the first width, wherein at least a portion of the second region is located between the first reinforcement plate and the second reinforcement plate.
Inventor(s): Moonchul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Youngmin KANG of Suwon-si (KR) for samsung electronics co., ltd., Yeonggyu YOON of Suwon-si (KR) for samsung electronics co., ltd., Seungjoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Joongyeon CHO of Suwon-si (KR) for samsung electronics co., ltd., Jungyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Myunghoon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Byounguk YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, H01Q1/24
CPC Code(s): G06F1/1656
Abstract: an electronic device may include a first housing including an antenna provided on a side surface thereof, a second housing configured to slide in a first direction to be drawn out of the first housing and to slide in a direction opposite to the first direction to be drawn into the first housing, a flexible display including a first side comprising a fixed portion and a second side provided to be drawn out of an inside of the first housing or drawn into the inside of the first housing according to an operation of the second housing, and a protective cover provided between the fixed portion and the first housing to contact at least a portion of an upper portion of the fixed portion. a first space may be provided between the protective cover and a side portion of the fixed portion.
Inventor(s): Kun WANG of Jiangsu (CN) for samsung electronics co., ltd., Jichun LI of Jiangsu (CN) for samsung electronics co., ltd., Mengze WANG of Jiangsu (CN) for samsung electronics co., ltd., Youxin CHEN of Jiangsu (CN) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06T7/11, G06T15/20
CPC Code(s): G06F3/013
Abstract: a method and a system for rendering video images in virtual reality (vr) scenes are provided. the method includes providing a video image at a current time point, dividing the video image at the current time point into a plurality of sub-regions, inputting image feature information of the sub-regions and acquired user viewpoint feature information into a trained attention model for processing to obtain attention coefficients of the sub-regions indicating probability values at which user viewpoints at a next time point fall into the sub-regions, rendering the sub-regions based on the attention coefficients of the sub-regions to obtain a rendered video image at the current time point, inputting the attention coefficients of the sub-regions and the image feature information of the sub-regions into a trained user eyes trajectory prediction model for processing, obtaining user eyes trajectory information in a current time period, dividing, for video images at subsequent time points within the current time period, the video images at the subsequent time points into a plurality of sub-regions, calculating attention coefficients of the sub-regions in a video image at each of the subsequent time points within the current time period respectively based on the user eyes trajectory information in the current time period, and rendering the corresponding sub-regions based on the attention coefficients of the sub-regions to obtain a rendered video image at each of the subsequent time points.
Inventor(s): CHADONG KIM of SEOUL (KR) for samsung electronics co., ltd., BUMSOO KIM of SEOUL (KR) for samsung electronics co., ltd., JONGMIN BAEK of HWASEONG-SI (KR) for samsung electronics co., ltd., GYEONGGON LEE of HWASEONG-SI (KR) for samsung electronics co., ltd., JINCHUL LEE of SEOUL (KR) for samsung electronics co., ltd., CHOONGHOON LEE of SEOUL (KR) for samsung electronics co., ltd., YUNRAE JO of YONGIN-SI (KR) for samsung electronics co., ltd., YOONKYUNG CHOI of SEOUL (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/044
CPC Code(s): G06F3/044
Abstract: a sensing device includes a touch panel including first and second sensor electrodes, and a touch panel controller acquiring a sensing signal from the touch panel and detecting a user input based on the sensing signal. the touch panel controller acquires the sensing signal from at least one of the first sensor electrodes and the second sensor electrodes in a first mode operating at a first power. the touch panel controller selects a first transmitting electrode, a second transmitting electrode, and receiving electrodes from one of the first sensor electrodes and the second sensor electrodes, inputs a first driving signal to the first transmitting electrode, and inputs a second driving signal having a phase difference of 180 degrees with respect to the first driving signal to the second transmitting electrode in a second mode operating at a second power and a third mode in which a sensing operation is performed.
Inventor(s): Woohyun KANG of Suwon-si (KR) for samsung electronics co., ltd., Garam KIM of Suwon-si (KR) for samsung electronics co., ltd., Jisoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangkwon MOON of Suwon-si (KR) for samsung electronics co., ltd., Hyunkyo HO of Suwon-si (KR) for samsung electronics co., ltd., Jin Gu JEONG of Suwon-si (KR) for samsung electronics co., ltd., Youngjun HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0619
Abstract: a storage device according to an embodiment includes a memory device configured to apply a first program voltage and a first verification voltage to a first word line and output, based on a program state of each of a plurality of memory cells connected to the first word line, a speed information representing a speed characteristic of each of the plurality of memory cells; and a memory controller configured to determine at least one memory cell to be programmed into a predetermined program state; determine, among the at least one memory cell, at least one target memory cell having a first speed characteristic based on the speed information; and perform a state-shaping operation to convert a data corresponding to the predetermined program state for the at least one target memory cell into a value corresponding to a program state different from the predetermined program state.
20250060886. MEMORY DEVICE AND MEMORY SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ki-Heung Kim of Suwon-si (KR) for samsung electronics co., ltd., ChangSik Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jeongdon Ihm of Suwon-si (KR) for samsung electronics co., ltd., Hyongryol Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0619
Abstract: a memory device includes at least one bank including at least a first sub-bank and a second sub-bank disposed in a wordline direction. the first sub-bank may include a normal data region connected to a plurality of first wordlines and storing normal data, the second sub-bank may include a metadata region connected to a plurality of second wordlines and storing metadata corresponding to the normal data, the plurality of first wordlines may match the plurality of second wordlines to form a plurality of wordline pairs, and the first sub-bank and the second sub-bank may share a row hammer region storing a number of access times to the plurality of wordline pairs.
Inventor(s): Sunghwan SIM of Suwon-si (KR) for samsung electronics co., ltd., Yonghwan KWAK of Suwon-si (KR) for samsung electronics co., ltd., Jongsung NA of Suwon-si (KR) for samsung electronics co., ltd., Joonyeop PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/064
Abstract: a method of operating a storage device including a plurality of meta blocks that store a plurality of metadata includes: receiving a first command from a host device; obtaining a plurality of characteristic values including first to fourth characteristic values, and a degradation index for each of the plurality of meta blocks based on the first command; and outputting a first response corresponding to the first command. the first command is for detecting an abnormal state of the storage device, the first characteristic value is related to an endurance characteristic, the second characteristic value is related to a data retention characteristic, the third characteristic value is related to a read disturbance characteristic, the fourth characteristic value is related to a temperature characteristic, the degradation index is calculated from the plurality of characteristic values, and the first response is generated based on at least one of the first characteristic value or the degradation index.
20250060905. INLINE COMPUTATIONAL STORAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jonghyeon KIM of San Jose CA (US) for samsung electronics co., ltd., Soogil JEONG of Pleasanton CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: a computational storage unit is disclosed. the computational storage unit may include a storage for a data and a controller to read the data from the storage. the computational storage unit may also include a computational engine to implement a function to process the data and generate a result. the computational storage unit may receive a command from a host processor and read the data from the storage, execute the function to process the data and generate the result, and return the result to the host processor based at least in part on the command.
Inventor(s): DEOKHO SEO of SUWON-SI (KR) for samsung electronics co., ltd., TAEKYEONG KO of HWASEONG-SI (KR) for samsung electronics co., ltd., NAMHYUNG KIM of SEOUL (KR) for samsung electronics co., ltd., DAEJEONG KIM of SEOUL (KR) for samsung electronics co., ltd., DOHAN KIM of HWASEONG-SI (KR) for samsung electronics co., ltd., HOYOUNG LEE of OSAN-SI (KR) for samsung electronics co., ltd., INSU CHOI of HWASEONG-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, H03M13/00, H03M13/11
CPC Code(s): G06F3/0659
Abstract: a memory device includes a memory cell array including a normal region in which first data is stored and a parity region in which a parity bit for the data is stored, and an error correction code (ecc) engine. the ecc engine is configured to determine whether there is an error in the first data based on the first data and the parity bit, and to output, in response to receiving an uncorrected read command from a memory controller, second data in a state in which an error bit in the first data is not corrected.
Inventor(s): Suntae JOO of Suwon-si (KR) for samsung electronics co., ltd., Taehwan SON of Suwon-si (KR) for samsung electronics co., ltd., Sunghee JUNG of Suwon-si (KR) for samsung electronics co., ltd., Daesung CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F3/01
CPC Code(s): G06F3/1454
Abstract: according to an embodiment, an electronic device includes: at least one sensor configured to detect health information of a user, a communication circuit configured to perform communication with an external device, memory including one or more storage mediums storing instructions, and at least one processor comprising processing circuitry, wherein the instructions, when being executed by the at least one processor individually or collectively, cause the electronic device to: identify first level information of the health information of the user obtained based on the at least one sensor of the electronic device, based on establishing a connection with a first external electronic device, identify second level information related to the first external electronic device, and based on the first level information and the second level information, transmit a first signal for controlling to display a first screen representing the health information of the user through a display of the first external electronic device.
Inventor(s): Younghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinin SO of Suwon-si (KR) for samsung electronics co., ltd., Kyungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangsu PARK of Suwon-si (KR) for samsung electronics co., ltd., Jin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jeonghyeon CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/30, G06F9/48, G06F17/16
CPC Code(s): G06F9/3836
Abstract: various example embodiments may include methods of operating a network device, non-transitory computer readable media including computer readable instructions for operating a network device, systems including a network device, and/or a compute express link (cxl) switching device for synchronizing data. a cxl-based system includes a plurality of cxl processing devices configured to perform matrix multiplication calculation based on input vector data and a partial matrix, and output at least one interrupt signal and at least one packet based on results of the matrix multiplication calculation, the at least one packet including output vector data and characteristic data associated with the output vector data, and a cxl switching device configured to, synchronize the output vector data, the synchronizing including performing a calculation operation on the output vector data based on the interrupt signal and the packet, and provide the synchronized vector data to the plurality of cxl processing devices.
Inventor(s): Wondeuk Yoon of Suwon-si (KR) for samsung electronics co., ltd., WOONKI LEE of Suwon-si (KR) for samsung electronics co., ltd., Junhwan Choi of Suwon-si (KR) for samsung electronics co., ltd., SANGHO LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/14
CPC Code(s): G06F11/1448
Abstract: an embodiment of the present disclosure provides an operation method of an electronic device that stores a first setup value for a first function of an external device that stores setup backup data may include establishing a connection to the external device, receiving, in response to the establishing of the connection to the external device, a first setup backup value included in the setup backup data from the external device, and updating the first setup value based on the first setup backup value.
Inventor(s): JUNGHO YEOM of Suwon-si (KR) for samsung electronics co., ltd., EUNYOUNG KWON of Suwon-si (KR) for samsung electronics co., ltd., DO KYUN KIM of Suwon-si (KR) for samsung electronics co., ltd., SANGHOAN CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02, G06F13/42
CPC Code(s): G06F12/0246
Abstract: a computing system according to some embodiments includes a host configured to distribute and allocate process data associated with a plurality of processes to a plurality of logic addresses, determine a valid bit corresponding to a logic address among a plurality of logic addresses, whether a process among the plurality of the processes corresponding to the logic address is executing, and generate an update information including the valid bit and the logic address corresponding to the valid bit, and a storage device that receives the update information from the host.
20250061061. STATUS REPORTING FOR STORAGE DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daniel Lee HELMICK of Thornton CO (US) for samsung electronics co., ltd., Jiwon CHANG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/0873, G06F12/0804
CPC Code(s): G06F12/0873
Abstract: a system and method for status reporting for a storage device. in some embodiments, the method includes: receiving, by a persistent storage device, a command, the command requesting a status associated with a first logical block address; determining the status; and sending a response to the command, the response including the status.
Inventor(s): Luis Vitorio CARGNINI of San Jose CA (US) for samsung electronics co., ltd., Andrew Zhenwen CHANG of San Mateo CA (US) for samsung electronics co., ltd., Yitu WANG of Durham NC (US) for samsung electronics co., ltd., Mohammadreza SOLTANIYEH of Sunnyvale CA (US) for samsung electronics co., ltd., Dongyang LI of Milpitas CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/12
CPC Code(s): G06F12/12
Abstract: a device may include memory media configured as cache media; and one or more circuits configured to perform operations including receiving memory access information, performing a mixture model analysis based on the memory access information to produce one or more scores, and updating the memory media based on the one or more scores. the memory media may include determining that at least one of the one or more scores is above a threshold and loading a portion of memory corresponding to the at least one of the one or more scores to the memory media. updating the memory media may include determining that at least one of the one or more scores is below a threshold and removing a portion of memory corresponding to the at least one of the one or more scores from the memory media.
Inventor(s): Oscar P. Pinto of San Jose CA (US) for samsung electronics co., ltd., Robert Brennan of Santa Clara CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F13/16
CPC Code(s): G06F13/1668
Abstract: embodiments of the present invention include a drive-to-drive storage system comprising a host server having a host cpu and a host storage drive, one or more remote storage drives, and a peer-to-peer link connecting the host storage drive to the one or more remote storage drives. the host storage drive includes a processor and a memory, wherein the memory has stored thereon instructions that, when executed by the processor, causes the processor to transfer data from the host storage drive via the peer-to-peer link to the one or more remote storage drives when the host cpu issues a write command.
Inventor(s): Sungjoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Mincheol KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/28, G06F3/06
CPC Code(s): G06F13/28
Abstract: a computer networking device includes a plurality of ports, a memory, and a computing unit. the computing unit receives source information and destination information for a snapshot from the host; obtains a read-value of a memory area corresponding to the source information in a memory device through a port identified based on mapping information and the source information; and transmit, to a storage device, the read-value based on peer-to-peer communication for a write operation of writing in a memory area corresponding to the destination information in the storage device through a port identified based on the mapping information and the destination information.
Inventor(s): Michael WASEF of San Jose CA (US) for samsung electronics co., ltd., Andrew Zhenwen CHANG of Los Altos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F16/2457, G06F16/22, G06F16/2453
CPC Code(s): G06F16/24573
Abstract: an accelerator is disclosed. the accelerator may include a connection to a first storage, which may store a database. the database may include four columns. the accelerator may also include a second storage to store information about the columns of the database. the accelerator may also include a circuit to process the information about the columns and a query to generate a skip information.
Inventor(s): Sewon KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyung-Woo NOH of Suwon-si (KR) for samsung electronics co., ltd., Subin seo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/57, H04L9/06, H04L9/08
CPC Code(s): G06F21/572
Abstract: a method for updating firmware of an electronic device includes verifying a first firmware certificate using a first public key, based on at least one of the electronic device being supplied power or the electronic device being reset, verifying a first firmware code included in the first firmware image based on a first hash value included in the first firmware certificate, and operating the electronic device using the first firmware code, based on the verifying of the first firmware certificate and the verifying of the first firmware code being successful. the first firmware certificate being included in a first firmware image stored in a memory of the electronic device.
Inventor(s): Joonnyung LEE of Seoul (KR) for samsung electronics co., ltd., Yeongjun KWON of Seoul (KR) for samsung electronics co., ltd., Jaeyong SHIN of Hwaseong-si (KR) for samsung electronics co., ltd., Jeonghoon AHN of Seongnam-si (KR) for samsung electronics co., ltd., Yunki CHOI of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/3953, H01L23/528
CPC Code(s): G06F30/3953
Abstract: a method of designing an interconnect structure of a semiconductor apparatus is provided. the interconnect structure includes interconnection layers sequentially stacked on a semiconductor substrate, and each of the interconnection includes dummy metal patterns and main metal patterns. the method includes: determining a layout of the main metal patterns included in each of the plurality of interconnection layers; determining a number of interconnection layers in the plurality of interconnection layers; and determining a layout of the dummy metal patterns included in each of the plurality of interconnection layers based on the determined layout of the main metal patterns and the determined number of interconnection layers.
Inventor(s): Sujin JANG of Hwaseong-si (KR) for samsung electronics co., ltd., Joohan NA of Suwon-si (KR) for samsung electronics co., ltd., Dokwan OH of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/80, G06N3/088, G06T5/50
CPC Code(s): G06T5/80
Abstract: a processor-implemented method with data processing using a neural network includes: determining a first translated image by translating a first image based on a second image, the first image and a second image that having different distortions, such that a distortion of the first image corresponds to a distortion of the second image; determining a first retranslated image by translating the first translated image such that a distortion of the first translated image corresponds to a distortion of the first image; and training a first deformation field generator configured to determine a first relative deformation field that represents a relative deformation from the first image to the second image and a second deformation field generator configured to determine a second relative deformation field that represents a relative deformation from the second image to the first image, based on a loss between the first retranslated image and the first image.
Inventor(s): Yubin LEE of Suwon-si (KR) for samsung electronics co., ltd., Dayun LEE of Suwon-si (KR) for samsung electronics co., ltd., Kundong KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongkoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06V10/764, G06V10/82
CPC Code(s): G06T7/0004
Abstract: a system for testing whether or not an image sensor included in an image frame is defective includes including a processor configured to execute machine-readable instructions that, when executed by the processor, cause the test device to generate a test image by performing one or more preprocessing operations on a raw image output from an image sensor, and to classify an image pattern of the test image as any one of patterns included in a first data set by using a first deep learning neural network trained based on the first data set and to determine, based on a classifying result, whether or not the image sensor is defective. the first data set comprises a data set for each pattern, classified to correspond to each of one or more defect patterns and to a normal pattern of an image.
Inventor(s): Minsu Kang of Suwon-si (KR) for samsung electronics co., ltd., Kwang-Eun Kim of Suwon-si (KR) for samsung electronics co., ltd., HuiSoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Seum Seo of Suwon-si (KR) for samsung electronics co., ltd., Jeongho Ahn of Suwon-si (KR) for samsung electronics co., ltd., Sungeun Lee of Suwon-si (KR) for samsung electronics co., ltd., Chaeyoung Lee of Suwon-si (KR) for samsung electronics co., ltd., Choonshik Leem of Suwon-si (KR) for samsung electronics co., ltd., Woojin Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06T5/30, G06T5/70, G06V10/60, G06V10/762, G06V20/70
CPC Code(s): G06T7/0008
Abstract: a parameter optimization method includes receiving a plurality of sem images respectively corresponding to a plurality of positions on a semiconductor wafer in which a first pattern and a second pattern are disposed based on overlay settings, determining a primary optimization parameter set based on the plurality of sem images, clustering the plurality of sem images to a plurality of clusters based on image attributes, and determining a secondary optimization parameter set corresponding to each of the plurality of clusters based on sem images included in each of the plurality of clusters from among the plurality of sem images and the primary optimization parameters.
Inventor(s): Jiman KIM of Suwon-si (KR) for samsung electronics co., ltd., Yehoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Chanwon Seo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/70, G06V10/774, G06V10/776, G06V10/82
CPC Code(s): G06T7/70
Abstract: an electronic device includes: one or more processors; and memory, storing: a first training data set including pieces of 2d pose data and pieces of 3d pose data; and instructions that, when executed by the one or more processors, cause the electronic device to: train a neural network model to estimate 3d poses based on the first training data set; obtain an augmented data set by augmenting the first training data set; based on at least one of similarity or reliability of 3d pose augmented data in the augmented data set; select at least one piece of 3d pose augmented data among pieces of 3d pose augmented data in the augmented data set; obtain a second training data set including the 3d pose augmented data and 2d pose augmented data corresponding to the 3d pose augmented data; and retrain the neural network model based on the second training data set.
Inventor(s): Zhuoxin GAN of Beijing (CN) for samsung electronics co., ltd., Yingying Jiang of Beijing (CN) for samsung electronics co., ltd., Inho Choi of Suwon-si (KR) for samsung electronics co., ltd., Weihua Zhang of Beijing (CN) for samsung electronics co., ltd., Yong A of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): G06V20/70, G06V10/26, G06V10/74, G06V10/77, G06V10/82
CPC Code(s): G06V20/70
Abstract: an image processing method includes obtaining a target image; splitting the target image into at least one sub-image based on a similarity of complexity in the target image; processing the at least one sub-image by at least one decoder corresponding to the at least one sub-image; and obtaining an output image based on the processed at least one sub-image. the splitting of the target image into the at least one sub image includes: splitting the target image into at least one grid of equal size; determining a similarity of complexity between adjacent grids in the at least one grid; and grouping the at least one grid into the at least one sub-image based on the similarity of the complexity between the adjacent grids.
Inventor(s): Aditya Dave of Plano TX (US) for samsung electronics co., ltd., Indranil Sinharoy of Richardson TX (US) for samsung electronics co., ltd., Lianjun Li of McKinney TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Vutha Va of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): G06V40/20, G01S13/50
CPC Code(s): G06V40/20
Abstract: an electronic device includes a transceiver. the transceiver is configured to transmit and receive a plurality of radar signals corresponding with a gesture. the electronic device further includes a processor operatively coupled to the transceiver. the processor is configured to obtain a range doppler map associated with the plurality of radar signals, and determine a plurality of detection thresholds, each detection threshold corresponding with a range-bin value of the range doppler map. the processor is further configured to generate, based on the determined plurality of detection thresholds, a time velocity diagram (tvd) and a time angle diagram (tad) corresponding with the gesture.
Inventor(s): Indranil Sinharoy of Richardson TX (US) for samsung electronics co., ltd., Aditya Dave of Plano TX (US) for samsung electronics co., ltd., Vutha Va of Plano TX (US) for samsung electronics co., ltd., Lianjun Li of McKinney TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Gaurav Duggal of Blacksburg VA (US) for samsung electronics co., ltd.
IPC Code(s): G06V40/20, G01S13/62, G06T7/246, G06V10/774
CPC Code(s): G06V40/28
Abstract: methods and systems for human gesture recognition and activity detection using augmented data. a computer-implemented method includes receiving motion capture data of a target from a camera, generating a first set of motion trajectories from the motion capture data, generating a first set of augmented motion trajectories using a set of data augmentation functions on the first set of motion trajectories, generating a radar cross-section of the target using the motion capture data to perform at least one of gesture recognition or activity detection, generating one or more synthetic electromagnetic (em) signatures of one or more activities of the target using the first set of augmented motion trajectories and the radar cross-section, and training a machine learning model configured for em signature-based gesture recognition or activity detection with a domain adaptation process using the one or more synthetic em signatures.
Inventor(s): Changmin HAN of Suwon-si (KR) for samsung electronics co., ltd., Minjae SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hyeonggwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyeong NAMKOONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20, G06F1/16, H04R1/02, H04R1/40, H04R3/12, H05K5/02
CPC Code(s): G09G3/20
Abstract: a display apparatus including: a first display; a second display disposed adjacent to the first display; a hinge rotatably coupling the first display and the second display, the hinge including a first hinge portion at a side of the first display and a second hinge portion rotatably coupled to the first hinge portion and at a side of the second display; a light emitter on the first hinge portion; a light receiver on the second hinge portion; and a controller configured to control the first display and the second display based on an intensity of light received by the light receiver while the light emitter outputs the light.
Inventor(s): Junsik HWANG of Suwon-si (KR) for samsung electronics co., ltd., Geonwood YOO of Suwon-si (KR) for samsung electronics co., ltd., Hojin LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungwook HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/32
CPC Code(s): G09G3/32
Abstract: a driving circuit board includes a driving circuit board includes: a plurality of driving electrode regions on a surface of the driving circuit board; a plurality of driving electrodes symmetrically arranged on the plurality of driving electrode regions; and a driving circuit electrically connected to at least one of the plurality of driving electrodes, wherein the plurality of driving electrodes include at least one dummy electrode that is not connected to the driving circuit.
Inventor(s): Yongkoo HER of Suwon-si (KR) for samsung electronics co., ltd., Kiwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Seoungyong PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/32, G09G3/20, G09G3/3233
CPC Code(s): G09G3/32
Abstract: an electronic device is provided. the electronic device includes a display including a plurality of pixels including a light-emitting element and a pixel drive circuit for the light emission of the light-emitting element, a display driver integrated circuit (ddi) for driving the display, memory storing one or more computer programs, and one or more processors communicatively coupled to the memory and the ddi wherein each of the plurality of pixels includes a first pixel drive circuit block for generating a pulse width modulation (pwm) signal configured to control the drive timing of the light-emitting device, and a second pixel drive circuit block configured to adjust the intensity of current supplied to the light-emitting element, wherein the first pixel drive circuit block includes a plurality of transistors and a first capacitor, and wherein the second pixel drive circuit block includes a plurality of transistors and a second capacitor.
Inventor(s): Su Chang JEON of Suwon-si (KR) for samsung electronics co., ltd., Woohyun KANG of Suwon-si (KR) for samsung electronics co., ltd., Seungkyung RO of Suwon-si (KR) for samsung electronics co., ltd., Sangkwon MOON of Suwon-si (KR) for samsung electronics co., ltd., Heewon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/408, G06F3/06
CPC Code(s): G11C11/4085
Abstract: disclosed is a nonvolatile memory device which include a memory cell array including a plurality of memory cells connected to a plurality of word lines, an address decoder that controls a selected word line among the plurality of word lines based on an address received from an external device including a first temperature sensor, a second temperature sensor that measures a read temperature of first memory cells connected to the selected word line from among the plurality of memory cells, and a temperature compensation circuit that calculates a read level offset based on the read temperature and a program temperature of the first memory cells measured by the first temperature sensor and generates a compensation read voltage based on the read level offset. the address decoder is further configured to provide the compensation read voltage to the selected word line.
Inventor(s): Changyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Young Seok PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4091, G11C11/4096, G11C29/52
CPC Code(s): G11C11/4091
Abstract: a memory device includes a memory cell array including memory cells, a single-ended bitline sense amplifier connected to the memory cells through a bitline and a complementary bitline, and electrically connected through one of the bitline or the complementary bitline in response to the memory cells being activated. a dsi circuit is configured to conditionally transmit complementary input data generated by inverting input data to the single-ended bitline sense amplifier in response to a first number of bits included in the input data having a first level greater than a second number of bits included in the input data having a second level, and a data inversion flag indicating that the input data is inverted, to the sense amplifier. the sense amplifier stores the complementary input data in the memory cell array and the data inversion flag in a specified partial area of the memory cell array.
20250061939. MEMORY DEVICE AND MEMORY SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ki-Heung Kim of Suwon-si (KR) for samsung electronics co., ltd., ChangSik Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jeongdon Ihm of Suwon-si (KR) for samsung electronics co., ltd., Hyongryol Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4096, G11C11/408
CPC Code(s): G11C11/4096
Abstract: a memory device includes at least one bank including a first sub-bank and a second sub-bank disposed in a wordline direction. the first sub-bank may store normal data and may be connected to a plurality of first wordlines, the second sub-bank may store metadata corresponding to the normal data and may be connected to a plurality of second wordlines, and metadata for normal data corresponding to each of the first wordlines may be stored in each of second wordlines, respectively corresponding to the first wordlines.
Inventor(s): Seokwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., HOONJIN BANG of Suwon-si (KR) for samsung electronics co., ltd., SEEUN OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/12
CPC Code(s): G11C29/12
Abstract: a memory device according to embodiments of the present disclosure includes a first memory cell including a first electrical fuse and a first program transistor connected in series between a first bitline and a ground voltage node, a second memory cell including a second electrical fuse and a second program transistor connected in series between the first bitline and the ground voltage node, and a first test cell including a first test transistor connected between the first bitline and the ground voltage node.
Inventor(s): Taegeon Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/673, H01L21/67
CPC Code(s): H01L21/67386
Abstract: a module tray cover includes a cover structure configured to cover a module tray that accommodates a plurality of semiconductor devices; a card accommodation portion provided on an upper surface of the cover structure and configured to accommodate a card, the card accommodation portion providing a first accommodation space and a second accommodation space partially overlapped with the first accommodation space; and an upper reinforcement structure including a first plurality of upper reinforcement structures and a second plurality of upper reinforcement structures, the first and second pluralities of upper reinforcement structures being spaced apart from each other in the first and second accommodation spaces, respectively, wherein the first and second pluralities of upper reinforcement structures respectively include first and second pluralities of upper reinforcement ribs sequentially disposed from open side portions of the first and second accommodation spaces.
Inventor(s): Hyungjun Kim of Suwon-si (KR) for samsung electronics co., ltd., Cheol-Hee Ahn of Seoul (KR) for samsung electronics co., ltd., Yooseon Hong of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/683, C09J4/00, C09J7/38, H01L23/00
CPC Code(s): H01L21/6836
Abstract: in a dicing film, an adhesive strength of an adhesive layer constituting the dicing film may sufficiently decrease after heat treatment, and a semiconductor die may be easily separated from the dicing film. accordingly, the effect of improving pickup performance of the semiconductor die may be obtained.
Inventor(s): Hansae Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/13, H01L23/00, H01L23/16, H01L23/31, H01L23/498
CPC Code(s): H01L23/13
Abstract: a semiconductor package includes a substrate including lower pads and a vent hole, a semiconductor chip, an encapsulant including a through-portion filling the vent hole and an extension disposed adjacent to the through-portion, and a ground plate and a power plate disposed on a lower surface of the substrate. the lower surface of the substrate includes a first region including the vent hole, a pad region including the lower pads, and a second region between the first region and the pad region. the extension extends in a first horizontal direction in the first region. the ground plate and the power plate include at least one first protrusion disposed in the second region and extending in the first horizontal direction and at least one second protrusion extending in an opposite direction, respectively. the at least one first protrusion is disposed to engage with the at least one second protrusion.
20250062172. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongbo Shim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00, H01L23/538, H01L25/10, H10B80/00
CPC Code(s): H01L23/3107
Abstract: a semiconductor package includes a package substrate, a first semiconductor device on the package substrate, a second semiconductor device on the package substrate and spaced laterally from the first semiconductor device, and a package encapsulant including a first encapsulant and a second encapsulant. the first encapsulant is on the package substrate, is in contact with side surfaces of the first semiconductor device, and encloses the side surfaces of the first semiconductor device. the second encapsulant is on the package substrate and laterally spaced apart from some side surfaces of the second semiconductor device, wherein the first encapsulant and the second encapsulant are integrally provided, and some side surfaces of the package encapsulant are coplanar with an outer edge of the package substrate.
20250062177. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Han Min LEE of Suwon-si (KR) for samsung electronics co., ltd., Sang-Sick PARK of Suwon-si (KR) for samsung electronics co., ltd., Un-Byoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Ku Young KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L21/56, H01L23/00, H01L25/00, H01L25/065, H01L25/18
CPC Code(s): H01L23/3192
Abstract: a semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a second semiconductor chip on the first semiconductor chip, an upper pad on an upper surface of the first semiconductor chip, a lower pad on a lower surface of the second semiconductor chip that faces the upper surface of the first semiconductor chip, a connecting bump between the upper pad and the lower pad, a lower film on the upper surface of the first semiconductor chip, and on a side surface of the upper pad and an upper film between the lower film and the lower surface of the second semiconductor chip, and on a side surface of the lower pad, wherein the lower film includes a thermosetting material, the upper film includes a photocurable material, and a side surface of the lower film protrudes outward beyond a side surface of the first semiconductor chip.
Inventor(s): Sujung Hyung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L21/56, H01L23/00, H01L23/498, H01L25/18, H10B80/00
CPC Code(s): H01L23/3677
Abstract: a semiconductor package includes a first redistribution wiring layer including a chip mounting region and a connector region, and having first redistribution wirings, a plurality of first bonding pads and at least one heat dissipation pad disposed in the chip mounting region, and a plurality of second bonding pads disposed in the connector region, a semiconductor chip mounted in the chip mounting region such that a front surface on which chip pads are formed faces the first redistribution wiring layer, a molding member covering the semiconductor chip, a plurality of conductive through vias each penetrating the molding member and respectively disposed on a respective second bonding pad in the connector region, and a second redistribution wiring layer disposed on the molding member and having second redistribution wirings with at least one electrically connected to a conductive through via.
20250062186. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghoo Yun of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/42, H01L23/00, H01L23/31, H01L23/367, H01L23/373, H01L23/498, H01L23/538, H01L23/64, H01L25/10
CPC Code(s): H01L23/42
Abstract: a semiconductor package is provided. the semiconductor package includes a lower redistribution structure, a semiconductor chip on a top surface of the lower redistribution structure, a plurality of conductive posts on a top surface of the lower redistribution structure and spaced apart from the semiconductor chip in a direction parallel to the top surface of the lower redistribution structure, a plurality of capacitors arranged on the top surface of the lower redistribution structure, the plurality of capacitors being between the semiconductor chip and the plurality of conductive posts, and a plurality of thermal interface material layers between the semiconductor chip and the plurality of capacitors.
Inventor(s): JAEHONG LEE of Latham NY (US) for samsung electronics co., ltd., SOOYOUNG PARK of Clifton Park NY (US) for samsung electronics co., ltd., WONHYUK HONG of Clifton Park NY (US) for samsung electronics co., ltd., KANG-ILL SEO of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L21/8238, H01L27/07, H01L27/092, H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L23/481
Abstract: integrated circuit devices and methods of forming the same. as an example, an integrated circuit device may include a substrate; a first transistor structure on the substrate; a second transistor structure stacked in a vertical direction on the first transistor structure; an isolation layer between the first transistor structure and the second transistor structure in the vertical direction; and a diode structure on the substrate and adjacent to the first transistor structure in a horizontal direction. the diode structure may be part of a discharging path between a gate electrode of the second transistor structure and the substrate. the discharging path may extend through the isolation layer.
Inventor(s): Jeonil LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongmin LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Jimin CHOI of Seoul (KR) for samsung electronics co., ltd., Yeonjin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L21/768, H01L23/532, H01L23/535
CPC Code(s): H01L23/481
Abstract: a semiconductor device includes a substrate including a first surface, and a second surface opposing the first surface. a via insulating layer extending through the substrate is disposed. a through-silicon via extending through the via insulating layer is disposed. the center of the through-silicon via is misaligned from the center of the via insulating layer. a blocking layer is disposed on the first surface. a first insulating layer is disposed on the blocking layer. a contact plug contacting the through-silicon via and extending through the first insulating layer and the blocking layer is disposed.
Inventor(s): Kyoung Lim SUK of Suwon-si (KR) for samsung electronics co., ltd., Kyung Don MUN of Suwon-si (KR) for samsung electronics co., ltd., Inhyung SONG of Suwon-si (KR) for samsung electronics co., ltd., Yeonho JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L25/00, H01L25/18
CPC Code(s): H01L23/49833
Abstract: a semiconductor package may include a first redistribution layer structure, a chiplet structure on the first redistribution layer structure, a plurality of first connection members on the first redistribution layer structure, a first molding material on the first redistribution layer structure and molding the chiplet structure and the plurality of first connection members, and a second redistribution layer structure on the first molding material. the chiplet structure may include a third redistribution layer structure, a first chiplet and a second chiplet on the third redistribution layer structure, and a bridge die on a bottom surface of the third redistribution layer structure.
Inventor(s): Seongyo Kim of Suwon-si (KR) for samsung electronics co., ltd., Minsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Sang-Sick Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/48, H01L25/065
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes a first semiconductor die; a second semiconductor die on the first semiconductor die; and an underfill layer between the first semiconductor die and the second semiconductor die, where the first semiconductor die includes: a first substrate including a main region and first corner regions that are adjacent to respective corners of the second semiconductor die, and where the main region overlaps a center of the second semiconductor die; redistribution patterns that are on the first substrate and include dummy wirings and signal wirings; a redistribution insulating layer on the redistribution patterns; and conductive pads that are on the redistribution insulating layer and include dummy pads and signal pads, where a pattern density of a first set of the conductive pads on the first corner regions is greater than a pattern density of a second set of the conductive pads on the main region.
20250062211. DRIVING CIRCUIT MOUNTING FILM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JAE-MIN JUNG of Suwon-si (KR) for samsung electronics co., ltd., NARAE SHIN of Suwon-si (KR) for samsung electronics co., ltd., JEONG-KYU HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498
CPC Code(s): H01L23/49838
Abstract: a driving circuit mounting film according to an embodiment includes: a base film that has a first surface and a second surface facing each other with a thickness therebetween; a driving circuit portion that is on the first surface of the base film; a plurality of first signal lines that are on a first side region on one side of the driving circuit portion along a first direction; and a plurality of second signal lines that are on a second side region on the opposite side of the driving circuit portion along the first direction. a first width of the first side region and a second width of the second side region are different from each other, and the first signal line includes a first portion on the first surface of the base film and a second portion on the second surface of the base film.
Inventor(s): Ki Won BAEK of Suwon-si (KR) for samsung electronics co., ltd., Dong Ok KWAK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/48, H01L23/62, H01L25/18
CPC Code(s): H01L23/49838
Abstract: there is provided a semiconductor package comprising: a substrate that includes a first surface and a second surface, wherein the second surface is opposite to the first surface; a first connection member and a second connection member on the second surface of the substrate; an upper pad on the first surface of the substrate, wherein the upper pad is electrically connected to the first connection member; a circuit pattern on the first surface of the substrate, wherein the circuit pattern is electrically connected to the second connection member; an upper passivation film on the first surface of the substrate, wherein the upper passivation film at least partially exposes the upper pad and the circuit pattern; a bump on the upper pad; and a semiconductor chip on the bump, wherein the circuit pattern is electrically separated from the semiconductor chip.
Inventor(s): Gyuho Kang of Suwon-si (KR) for samsung electronics co., ltd., Hyungjun Park of Suwon-si (KR) for samsung electronics co., ltd., Kwangok Jeong of Suwon-si (KR) for samsung electronics co., ltd., Juil Choi of Suwon-si (KR) for samsung electronics co., ltd., Taeoh Ha of Suwon-si (KR) for samsung electronics co., ltd., Hongseo Heo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H01L23/00
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes a lower redistribution wiring layer that includes first redistribution wirings, a protective layer that defines openings, and bonding pads that are on the protective layer and are electrically connected to the first redistribution wirings through the openings; conductive bumps that are on first bonding pads of the bonding pads; and a semiconductor chip on the first bonding pads, where each of the bonding pads includes: a conductive pillar in a respective opening of the openings of the protective layer, where the conductive pillar includes a first diameter; and a pad pattern that is on the protective layer and an upper surface of the conductive pillar, where the pad pattern includes a second diameter that is greater than the first diameter.
Inventor(s): Junghoo YUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes: a lower redistribution layer; a semiconductor chip on an upper surface of the lower redistribution layer, the semiconductor chip having an area that is less than an area of the lower redistribution layer; at least one plate group on the upper surface of the lower redistribution layer, each of the at least one plate group including a plurality of conductive plates facing each other and extending in a same direction; and a molding layer covering the upper surface of the lower redistribution layer and surrounding the semiconductor chip and the at least one plate group, wherein the plurality of conductive plates extend along a plane on the upper surface of the lower redistribution layer in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction, and each of the plurality of conductive plates has a length in the first horizontal direction that is greater than a length in the second horizontal direction.
Inventor(s): MYUNGSAM KANG of HWASEONG-SI (KR) for samsung electronics co., ltd., Youngchan Ko of Seoul (KR) for samsung electronics co., ltd., Jeongseok Kim of Cheonan-si (KR) for samsung electronics co., ltd., Kyungdon Mun of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L21/48, H01L23/00, H01L23/498
CPC Code(s): H01L23/5223
Abstract: a semiconductor package includes a support substrate having connection wirings disposed therein. at least one capacitor is disposed on the support substrate. the capacitor has first and second electrodes that are exposed from an upper surface of the support substrate. a redistribution wiring layer covers the upper surface of the support substrate. the redistribution wiring layer has redistribution wirings electrically connected to the connection wirings and the first and second electrodes respectively. a semiconductor chip is disposed on the redistribution wiring layer. the semiconductor chip has chip pads that are electrically connected to the redistribution wirings and outer connectors disposed on a lower surface of the support substrate and electrically connected to the connection wirings.
20250062228. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sanghyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Gyuhee PARK of Suwon-si (KR) for samsung electronics co., ltd., Inji LEE of Suwon-si (KR) for samsung electronics co., ltd., Hase NAOKI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L23/532, H10B12/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device may include a substrate including devices; a lower insulating layer on the substrate; a lower wiring layer on the lower insulating layer and electrically connected to the devices; a first upper insulating layer on the lower insulating layer; an upper contact penetrating through the first upper insulating layer and connected to the lower wiring layer, an upper wiring layer on the first upper insulating layer and connected to the upper contact; and a second upper insulating layer on the first upper insulating layer and covering the upper wiring layer. the upper wiring layer may include an aluminum alloy and 0.01-3 wt % of the aluminum alloy may be at least one dopant among zn, ni, v, and cr. a balance of the aluminum alloy may include al.
Inventor(s): Changhee Lee of Suwon-si (KR) for samsung electronics co., ltd., Chulmin Choi of Suwon-si (KR) for samsung electronics co., ltd., Sangyong Park of Suwon-si (KR) for samsung electronics co., ltd., Dajin Kim of Suwon-si (KR) for samsung electronics co., ltd., Taeho Kim of Suwon-si (KR) for samsung electronics co., ltd., Gunwook Yoon of Suwon-si (KR) for samsung electronics co., ltd., Taehun Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungjae Baik of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device includes a first semiconductor structure that includes a first substrate, circuit devices on the first substrate, a lower interconnection structure, and a lower bonding structure; and a second semiconductor structure disposed on and connected to the first semiconductor structure the second semiconductor structure includes a stack structure; channel structures that including a first portion that penetrate through the stack structure in the vertical direction and a second portion that extends upward from the first portion; a first material layer disposed on the stack structure and the channel structure and having first conductivity; and a second material layer disposed between the first material layer and the stack structure and having second conductivity., the first material layer overlaps second portions of the channel structures in the vertical direction, and the second material layer does not overlap the second portions of the channel structures in the vertical direction.
20250062237. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kwangsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunsoo Chung of Suwon-si (KR) for samsung electronics co., ltd., Jungul Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/31, H01L23/498, H01L25/10
CPC Code(s): H01L23/5385
Abstract: provided is a semiconductor package including a first redistribution layer, a first semiconductor chip disposed on the first redistribution layer, a circuit board disposed between the first redistribution layer and the first semiconductor chip, bonding wires connecting the first semiconductor chip and the circuit board to each other, a second redistribution layer disposed on the first semiconductor chip, a second semiconductor chip disposed on the second redistribution layer, and conductive posts connecting the first redistribution layer and the second redistribution layer to each other.
Inventor(s): Bong Wee YU of Suwon-si (KR) for samsung electronics co., ltd., Chang Soo KIM of Suwon-si (KR) for samsung electronics co., ltd., Byung Chul JEON of Suwon-si (KR) for samsung electronics co., ltd., Jun Ho HUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/498, H01L25/065, H01L25/10, H01L25/16, H10B80/00
CPC Code(s): H01L23/5386
Abstract: a semiconductor package is provided. the semiconductor package comprises a package substrate, a first semiconductor chip on the package substrate, a second semiconductor chip spaced apart from the first semiconductor chip on the package substrate, and a bridge die placed below the first semiconductor chip and the second semiconductor chip on the package substrate, wherein the bridge die includes a first face that faces the first semiconductor chip and the second semiconductor chip, a second face that faces the package substrate, a connection wiring structure which is placed on the first face, and connects the first semiconductor chip and the second semiconductor chip, and a power wiring structure which is placed on the second face, and provides power to the first semiconductor chip and the second semiconductor chip.
Inventor(s): HYUN JUN PARK of Suwon-si (KR) for samsung electronics co., ltd., Woo-Seok Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L25/18, H10B80/00
CPC Code(s): H01L23/5386
Abstract: a signal channel according to embodiments of the present disclosure includes a plurality of signal lines disposed on a plurality of layers spaced apart from each other in a first direction and connecting first points and second points to each other. a plurality of sections are defined between the first points and the second points. a first signal line disposed on a first layer of the plurality of layers in a first section of the plurality of sections is electrically connected to a second signal line disposed on a second layer of the plurality of layers in a second section of the plurality of sections.
Inventor(s): MyungDo Cho of Suwon-si (KR) for samsung electronics co., ltd., Youngchan Ko of Suwon-si (KR) for samsung electronics co., ltd., Byung Ho Kim of Suwon-si (KR) for samsung electronics co., ltd., Yongkoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeongho Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/31, H01L23/498, H01L25/065
CPC Code(s): H01L23/5386
Abstract: an example semiconductor package includes a first redistribution layer, a bridge chip attached to a top surface of the first redistribution layer, a mold layer on the first redistribution layer and enclosing the bridge chip, a second redistribution layer disposed on the mold layer, a conductive post extending through the mold layer vertically and connecting the first redistribution layer and the second redistribution layer, and a first semiconductor chip mounted on the second redistribution layer. the first redistribution layer includes a pad layer and an interconnection layer disposed on the pad layer. the pad layer includes a first insulating layer and pads in the first insulating layer. top surfaces of the pads are exposed to an outside of a top surface of the first insulating layer, and bottom surfaces of the pads are exposed to an outside of a bottom surface of the first insulating layer.
Inventor(s): Kyungdon MUN of Suwon-si (KR) for samsung electronics co., ltd., Jihwang KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangjin BAEK of Suwon-si (KR) for samsung electronics co., ltd., Kuwon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/31, H01L23/367, H01L23/427, H01L25/18, H10B80/00
CPC Code(s): H01L23/5386
Abstract: a semiconductor package includes: a first substrate; a bridge chip disposed on the first substrate and having a first region and a second region; an upper semiconductor chip disposed on the first region of the bridge chip; and conductive posts disposed on the second region of the bridge chip and spaced apart from the upper semiconductor chip, wherein the upper semiconductor chip is electrically connected to the conductive posts through the bridge chip.
Inventor(s): KANG JOON LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/48, H01L23/00, H01L23/498
CPC Code(s): H01L23/5389
Abstract: a semiconductor package according to an embodiment includes a semiconductor chip, and a redistribution portion electrically connected to the semiconductor chip. the redistribution portion includes an inner insulation layer, an interconnection pad, and an outer insulation layer. the interconnection pad is on the inner insulation layer and includes a first region and a second region outside the first region and having an opening. the outer insulation layer includes a first portion on the second region of the interconnection pad and a second portion filling at least a part of the opening.
20250062248. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yeongkwon KO of Hwaseong-si (KR) for samsung electronics co., ltd., Un-Byoung KANG of Hwaseong-si (KR) for samsung electronics co., ltd., Jaekyung YOO of Seoul (KR) for samsung electronics co., ltd., Teak Hoon LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/13, H01L23/31, H01L23/498, H01L25/065
CPC Code(s): H01L23/562
Abstract: a semiconductor package including a package substrate, a connection substrate on the package substrate and having on a lower corner of the connection substrate a recession that faces a top surface of the package substrate, a semiconductor chip on the connection substrate, a plurality of first connection terminals connecting the connection substrate to the semiconductor chip, and a plurality of second connection terminals connecting the package substrate to the connection substrate. the recession is laterally spaced apart from the second connection terminals.
20250062252. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaeean Lee of Suwon-si (KR) for samsung electronics co., ltd., Dongwon Kang of Suwon-si (KR) for samsung electronics co., ltd., Changyeon Song of Suwon-si (KR) for samsung electronics co., ltd., Sunguk Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/58, H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L23/585
Abstract: a semiconductor package includes a redistribution insulation layer and a connection structure disposed on the redistribution insulation layer in a first direction and including a base layer, a metal pattern, and a cavity. a semiconductor chip is disposed on the redistribution insulation layer in the first direction. the semiconductor chip is spaced apart from the connection structure by a molding layer. the semiconductor chip and the molding layer are disposed in the cavity. the metal pattern is disposed on the redistribution insulation layer, at least partially between the base layer and the molding layer. the metal pattern includes a first metal pattern extending, in a second direction crossing the first direction, from an inner surface of the connection structure into the base layer and separating at least a portion of the base layer from at least a portion of the redistribution insulation layer.
Inventor(s): Gyuseong PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongmin Lee of Suwon-si (KR) for samsung electronics co., ltd., Nara Lee of Suwon-si (KR) for samsung electronics co., ltd., Juik Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065
CPC Code(s): H01L24/05
Abstract: a semiconductor chip includes a semiconductor substrate including an active surface and an inactive surface opposite to the active surface, a wiring layer on the active surface, a front connection pad on the wiring layer, a lower protective insulating layer at least partially covering the wiring layer and including a lower opening that exposes at least a portion of the front connection pad, an upper protective insulating layer including an upper opening communicatively coupled to the lower opening on the lower protective insulating layer, a connection terminal coupled to the front connection pad through the lower opening and the upper opening, and an upper cover insulating layer between the connection terminal and the upper protective insulating layer. the upper protective insulating layer includes an organic material. the upper cover insulating layer includes an inorganic material.
Inventor(s): Young-Deuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Heejung HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/36, H01L23/48, H01L25/065, H10B80/00
CPC Code(s): H01L24/06
Abstract: a semiconductor chip including a body that having a front surface and a rear surface; a wiring structure above the front surface of the body; a through via penetrating the body, and the through via is connected to the wiring structure; a heat dissipation structure above the rear surface of the body, and the heat dissipation structure includes a conductive layer connected to the through via; and a signal pad and a heat dissipation pad on the heat dissipation structure, and the signal pad and the heat dissipation pad are connected to the conductive layer.
Inventor(s): Hoonjoo NA of Seoul (KR) for samsung electronics co., ltd., Jungseob SO of Seoul (KR) for samsung electronics co., ltd., Taeseong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sohye CHO of Hwaseong-si (KR) for samsung electronics co., ltd., Sonkwan HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065, H01L25/18
CPC Code(s): H01L24/08
Abstract: the semiconductor device includes a lower chip structure including a peripheral circuit, a first memory chip structure on the lower chip structure, and a second memory chip structure on the first memory chip structure. the first memory chip structure includes a first stack structure and a first vertical memory structure. the first stack structure includes first gate lines stacked in a vertical direction and extending in a first horizontal direction. the first vertical memory structure penetrates through the first gate lines in the vertical direction. the second memory chip structure includes a second stack structure and a second vertical memory structure. the second stack structure includes second gate lines stacked in the vertical direction and extending in a second horizontal direction, perpendicular to the first horizontal direction. the second vertical memory structure penetrates through the second gate lines in the vertical direction.
20250062264. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jihyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Kang Joon LEE of Suwon-si (KR) for samsung electronics co., ltd., Seokwon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/498, H01L23/60
CPC Code(s): H01L24/16
Abstract: a semiconductor package including a first structure, a second structure, and an interconnect structure between the first structure and the second structure. the interconnect structure includes a first region extending from a center of the interconnect structure to a first distance, and a second region outside the first region. the interconnect structure includes a plurality of first connection members in the first region and a plurality of second connection members in the second region. the plurality of first connection members are arranged in a staggered form, and the plurality of second connection members are arranged in rows.
20250062266. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gyunghwan Oh of Suwon-si (KR) for samsung electronics co., ltd., Sangmin Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/498, H01L23/538, H01L25/10
CPC Code(s): H01L24/20
Abstract: a semiconductor package includes a redistribution substrate including a first surface and a second surface which are opposite to each other, a semiconductor chip on the first surface of the redistribution substrate, and a connection terminal on the second surface of the redistribution substrate. the redistribution substrate includes an insulating layer, a redistribution pattern in the insulating layer, and an under bump pattern between the redistribution pattern and the connection terminal. the under bump pattern includes a via portion penetrating the insulating layer and connected to the redistribution pattern, and a protrusion protruding into the insulating layer.
Inventor(s): Teageon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/538
CPC Code(s): H01L24/32
Abstract: a semiconductor package includes a substrate defining a first trench structure and a second trench structure in an upper surface of the substrate; a semiconductor chip on the substrate; and an underfill filling a space between the substrate and the semiconductor chip. the first trench structure and the second trench structure surround the semiconductor chip. the first trench structure includes at least one first line pattern extending along at least one side surface of the semiconductor chip. the second trench structure includes at least one second line pattern extending along at least one other side surface of the semiconductor chip. a horizontal width of the at least one first line pattern is greater than a horizontal width of the at least one second line pattern.
Inventor(s): Sunggu KANG of Suwon-si (KR) for samsung electronics co., ltd., Jae Choon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sung-Ho MUN of Suwon-si (KR) for samsung electronics co., ltd., Hwanjoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/13, H01L23/31, H01L23/48, H01L23/522, H01L25/18
CPC Code(s): H01L25/0652
Abstract: disclosed is a semiconductor package comprising an interposer, a first semiconductor die below the interposer, and a first dummy die, a second dummy die, and a second semiconductor die over the interposer. the first semiconductor die, the second semiconductor die, the first dummy die, and the second dummy die overlap the interposer. the first semiconductor die overlaps the second semiconductor die. the second semiconductor die is between the first dummy die and the second dummy die.
Inventor(s): Hyunsoo Chung of Suwon-si (KR) for samsung electronics co., ltd., Kwang-Soo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jun Gul Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L21/56, H01L23/00, H01L23/31, H01L23/48, H10B80/00
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a first semiconductor chip having a front side and a back side that is opposite to the front side, the first semiconductor chip includes a front side wiring structure disposed on the front side, a back side wiring structure disposed on the back side, and a first through via electrically connected to the front side wiring structure and the back side wiring structure, a second semiconductor chip disposed on the back side of the first semiconductor chip and including a second through via, and a third semiconductor chip disposed on the front side of the first semiconductor chip, wherein the first semiconductor chip receives power through the second through via, and wherein a thickness of the second semiconductor chip is greater than a thickness of the first semiconductor chip.
Inventor(s): Kwangyong Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a lower semiconductor die stack in which lower semiconductor dies are stacked vertically in a stepwise manner to extend in a first horizontal direction, an upper semiconductor die stack in which upper semiconductor dies are stacked vertically on the lower semiconductor die stack in a stepwise manner to extend in a first reverse horizontal direction, a wiring structure above the upper semiconductor die stack, and bonding wire groups connecting the lower semiconductor dies and the upper semiconductor dies to the wiring structure. the bonding wire groups include a first bonding wire group that includes bonding wires that connect a first plurality of semiconductor dies of the upper and lower semiconductor dies to the wiring structure. the bonding wire group includes a first curved wire connecting a second plurality of semiconductor dies of the first plurality of semiconductor dies, a first upward wire connected to the first curved wire, a first inclined wire connected to the first upward wire, and a second upward wire to connect the first inclined wire to the wiring structure.
20250062297. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinwon CHAE of Suwon-si (KR) for samsung electronics co., ltd., Taehong MIN of Suwon-si (KR) for samsung electronics co., ltd., Daehan SONG of Suwon-si (KR) for samsung electronics co., ltd., Inwook JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L23/00, H01L23/538, H10B80/00
CPC Code(s): H01L25/16
Abstract: a semiconductor package may comprise an interposer substrate including a substrate and a lower protective layer, a through-via passing through the substrate and the lower protective layer, a lower pad on the lower protective layer and in contact with the through-via, an interlayer insulating layer on an upper surface of the substrate, and an interconnection structure in the interlayer insulating layer, a plurality of first semiconductor chips on an upper surface of the interposer substrate and electrically connected to the interconnection structure, a second semiconductor chip on the upper surface of the interposer substrate apart from the plurality of first semiconductor chips and electrically connected to the interconnection structure, an encapsulant covering at least a portion of the plurality of first semiconductor chips and the second semiconductor chip and connection conductors on the lower surface of the lower protective layer and electrically connected to the lower pad.
20250062302. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghoon KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00, H01L23/29, H01L23/31, H01L23/48, H01L23/498
CPC Code(s): H01L25/18
Abstract: a semiconductor package includes a lower redistribution substrate, a logic structure on the lower redistribution substrate, connection terminals between the lower redistribution substrate and the logic structure, connection structures on the lower redistribution substrate and surrounding the logic structure in plan view, and external connection terminals below the lower redistribution substrate. the logic structure includes a first redistribution substrate, a connection substrate on the first redistribution substrate and having an opening in the connection substrate, a first logic chip on the first redistribution substrate and in the opening in the connection substrate, and a second logic chip on the connection substrate and the first logic chip. a first active surface of the first logic chip faces a second active surface of the second logic chip.
20250062303. SEMICONDUCTOR PACKAGES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joonho Jun of Suwon-si (KR) for samsung electronics co., ltd., Duksung Kim of Suwon-si (KR) for samsung electronics co., ltd., Gyesik Oh of Suwon-si (KR) for samsung electronics co., ltd., Minwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Wangyong Im of Suwon-si (KR) for samsung electronics co., ltd., Byoungkon Jo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00, H01L23/31, H01L23/48
CPC Code(s): H01L25/18
Abstract: a semiconductor package may include a package substrate; a plurality of upper dies on an upper side of the package substrate and arranged so as not to overlap each other vertically; a plurality of electrical connection structures between the plurality of upper dies and the package substrate and electrically connected to the package substrate; a lower die on the package substrate and arranged so as not to vertically overlap with the plurality of electrical connection structures; and a plurality of overlapped electrical connection structures arranged between the plurality of upper dies and an upper surface of the lower die and electrically connected to the upper surface of the lower die. each of the plurality of upper dies may include a plurality of memory dies that overlap each other vertically.
Inventor(s): Minkyu KWON of Hwaseong-si (KR) for samsung electronics co., ltd., Sungkyu CHO of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/00
CPC Code(s): H02J7/0019
Abstract: a charging integrated circuit (ic) includes: a connection circuit configured to selectively connect a first battery and a second battery to each other in series and in parallel; a first charger configured to charge the first battery and the second battery connected to each other in parallel in a first charging mode; and a second charger configured to charge the first battery and the second battery connected to each other in series in a second charging mode. the connection circuit may include: a first regulating circuit connected to the first battery in series and configured to regulate a first balancing current flowing to the first battery; and a second regulating circuit connected to the second battery in series and configured to regulate a second balancing current flowing to the second battery.
20250062643. WIRELESS POWER TRANSFER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sol Hee In of Suwon-si (KR) for samsung electronics co., ltd., Do Hyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Jae Sup Lee of Suwon-si (KR) for samsung electronics co., ltd., Byung Wook Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/27, H02J50/40
CPC Code(s): H02J50/27
Abstract: the present disclosure relates to power receiving devices and methods. an example power receiving device comprises an antenna cell array configured to receive a radio frequency (rf) signal from a transmission device, where the antenna cell array includes a first antenna cell and a second antenna cell, a first rectifier connected to the first antenna cell and having first maximum rectification efficiency when an input signal of the first rectifier has a first power value, a second rectifier connected to the second antenna cell and having second maximum rectification efficiency when an input signal of the second rectifier has a second power value different from the first power value, a first voltage converter configured to perform a first conversion of an output of the first rectifier, and a second voltage converter configured to perform a second conversion of an output of the second rectifier.
Inventor(s): Sungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungwoo MOON of Suwon-si (KR) for samsung electronics co., ltd., Daewoong CHO of Suwon-si (KR) for samsung electronics co., ltd., Youngwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo SO of Suwon-si (KR) for samsung electronics co., ltd., Yonghwan CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M3/07, H02J7/00
CPC Code(s): H02M3/07
Abstract: a switched capacitor circuit includes first, third, fifth and seventh switches connected to each other, second, fourth, sixth and eighth switches connected to each other, one end of each of the first and second switches connected to an input node, ninth and tenth switches connected to each other, eleventh and twelfth switches connected to each other, thirteenth and fourteenth switches connected to each other, fifteenth and sixteenth switches connected to each other, a first capacitor between the first and ninth switches, a second capacitor between the second and fifteenth switches, a third capacitor between the third and eleventh switches, a fourth capacitor between the fourth and thirteenth switches, a fifth capacitor between the sixth and eleventh switches, and a sixth capacitor between the fifth and thirteenth switches, one end of each of the ninth, eleventh, thirteenth, fifteenth, seventh and eighth switches connected to an output node.
Inventor(s): Byungchul JEON of Suwon-si (KR) for samsung electronics co., ltd., Junho HUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M3/158
CPC Code(s): H02M3/158
Abstract: provided is a switching voltage regulator including: a converting circuit configured to receive an input voltage and to generate an output voltage through a switching operation; and a control circuit configured to cause the output voltage to be generated by controlling the switching operation, wherein the converting circuit includes: at least one switch formed on a first die and configured to perform the switching operation under control of the control circuit; and at least one blocking transistor formed on a second die and electrically connected to at least one first transistor, and wherein the first die is vertically stacked on the second die.
Inventor(s): Junghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngjae PARK of Suwon-si (KR) for samsung electronics co., ltd., Jonghyun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Taeho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jehyung CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02P5/74, F24F11/52, F24F11/88, H02P5/50, H02P11/06
CPC Code(s): H02P5/74
Abstract: an air conditioner includes an inverter configured to drive a first motor for driving a first outdoor unit and a second motor for driving a second outdoor unit in parallel, and a processor. the processor is configured to determine parameters of the first motor and parameters of the second motor, compare the parameters of the first motor with the parameters of the second motor to determine whether the parameters differ by at least a certain value, and control the inverter through heterogeneous control for the first motor and the second motor based on the parameters differing by at least a certain value.
Inventor(s): Seonghoon Park of Suwon-si (KR) for samsung electronics co., ltd., Hyoun Soo Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K3/037, G01R31/3177, H03K3/012, H03K19/173
CPC Code(s): H03K3/037
Abstract: a test apparatus includes an input terminal, a first multiplexer, a plurality of first elements connected in series between the input terminal and the first multiplexer, and a processor. the first multiplexer is connected to each of a plurality of nodes between the plurality of first elements, and the processor is connected to the input terminal and to the first multiplexer. the processor inputs data to the plurality of first elements through the input terminal. the plurality of first elements outputs at least a portion of a plurality of pieces of data through the plurality of nodes between the elements to the first multiplexer. the processor may thereby determine whether a defect has occurred in any of the plurality of first elements by comparing data, output from the multiplexer, with an expected output value.
Inventor(s): Dohun Jang of Suwon-si (KR) for samsung electronics co., ltd., Junhyeok Yang of Suwon-si (KR) for samsung electronics co., ltd., Hyuntaek Oh of Suwon-si (KR) for samsung electronics co., ltd., Dokyung Lim of Suwon-si (KR) for samsung electronics co., ltd., Chanyoung Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03L7/107, H03L7/089, H03L7/095
CPC Code(s): H03L7/1077
Abstract: there is provided a phase locked loop circuit including a phase-frequency detection circuit configured to receive a reference clock signal and a feedback clock signal having a first phase difference from each other, adjust a phase gain based on first phase difference, and generate a first and a second control signals based on the phase gain, a lock detection circuit configured to generate a lock detection signal based on the first phase difference, a charge pump circuit configured to generate a loop filter input signal based on the first and second control signals, a loop filter configured to adjust impedance based on the activated lock detection signal and generate a loop filter output signal based on the adjusted impedance, an oscillator configured to generate a clock signal based on the loop filter output signal, and a divider configured to generate the feedback clock signal by dividing the clock signal.
Inventor(s): Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/0417, H04B7/06
CPC Code(s): H04B7/0417
Abstract: a method for operating a user equipment (ue) comprises: receiving information associated with a channel state information (csi) report, the information including a third-domain (td) parameter , where >1; determining spatial domain (sd) basis vectors; determining frequency domain (fd) basis vectors; determining coefficients; wherein at least one of the sd basis vectors, the fd basis vectors, and the coefficients are determined independently for each dimension of the td or determined jointly for all dimensions of the td; and transmitting the csi report including a precoding matrix indicator (pmi), the pmi indicating the sd basis vectors, the fd basis vectors, and the coefficients.
Inventor(s): Eunhye Park of Suwon-si (KR) for samsung electronics co., ltd., Jinmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Jungwoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Sukjin Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B17/309, H04L5/00, H04L25/02
CPC Code(s): H04B17/346
Abstract: an operating method of a wireless communication device includes: receiving a reference signal transmitted from a second wireless device; calculating a reference noise value based on the reference signal; calculating, by the processor, a noise threshold value based on the reference noise value; receiving a first data signal transmitted from the second wireless device; calculating a data noise value based on the first data signal; comparing, by the processor, the data noise value with the noise threshold value; determining whether interference occurs in a target symbol based on a result of the comparison; adjusting the noise threshold value based on the data noise value when it is determined that the interference has occurred in the target symbol; and receiving a second data signal transmitted from the second wireless device, and using the adjusted noise threshold value in processing the second data signal.
Inventor(s): Joo Seung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Young Ju KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jung Joon KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sung Chul PARK of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04B1/04, H04L5/14
CPC Code(s): H04L5/001
Abstract: according to various embodiments of the present invention, disclosed is an electronic device comprising: a first antenna element configured so as to transmit and receive a signal of a first frequency band or a second frequency band; a second antenna element configured so as to transmit and receive the signal of the first frequency band or the second frequency band; a first rf block electrically connected to the first antenna element and the second antenna element and including a first transmission and reception circuit and a second transmission and reception circuit; an rf reception circuit for receiving the signal of the first frequency band or the second frequency band from the first antenna element or the second antenna element; and a transceiver, wherein the first transmission and reception circuit processes the signal of the first frequency band or the second frequency band, the second transmission and reception circuit processes the signal of the first frequency band or the second frequency band, and the transceiver performs ca on the signal of the first frequency band and/or the second frequency band and performs diversity on the signals received from the first rf block and the rf reception circuit.
Inventor(s): Sunggeun KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Nakwon LEE of Seoul (KR) for samsung electronics co., ltd., Jaehyun PARK of Seoul (KR) for samsung electronics co., ltd., Kyeongjoon KO of Yongin-si (KR) for samsung electronics co., ltd., Kangjik KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Seuk SON of Suwon-si (KR) for samsung electronics co., ltd., Byunghyun LIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04L7/00
CPC Code(s): H04L7/0025
Abstract: a clock data recovery circuit includes an inphase-quadrature (i-q) merged phase interpolator circuit configured to generate a first clock pair and a second clock pair from a plurality of reference clock signals, the plurality of reference clock signals having different phases, the first clock pair comprising an i clock signal and an inverted i clock signal, and the second clock pair comprising a q clock signal and an inverted q clock signal, a sampler circuit configured to sample input data based on the first clock pair and the second clock pair, and a control circuit configured to control phases of the first clock pair and the second clock pair, the controlling including providing a control signal to the i-q merged phase interpolator circuit based on a sampling result of the sampler circuit, the i-q merged phase interpolator circuit is configured to share analog inputs based on the control signal.
Inventor(s): Dowon HYUN of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L47/2483, H04L12/46, H04L47/125
CPC Code(s): H04L47/2483
Abstract: a method, in a communication system, carried out by a switch server comprising a programmable switch and one or more field programmable gate arrays (fpgas) is provided. the method includes receiving information related to a flow table from an offloading server, receiving data packets, identifying a fpga corresponding to the data packets, identifying whether the data packets match a flow entry of a flow table of the fpga, in case that the data packets match the flow entry of the flow table, processing the data packets based on the flow entry and transmitting the processed data packet, and in case that the data packets do not match the entry of the flow table, providing the data packets to the offloading server.
Inventor(s): Mustque AHMED of Bangalore (IN) for samsung electronics co., ltd., Murali REDDIBOYANA of Bangalore (IN) for samsung electronics co., ltd., Gururaj B. MALANNAVAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L65/1069, H04L65/1016, H04L65/1104
CPC Code(s): H04L65/1069
Abstract: a method for optimizing an internet protocol (ip) multimedia subsystem (ims) packet data network (pdn) connection, includes: establishing, by a user equipment (ue), an ims pdn connection and an internet pdn connection with at least one data network element of a communication network, wherein a primary ip address corresponding to the ims pdn connection and a secondary ip address corresponding to the internet pdn connection are allocated to the ue by the at least one data network element; sharing, by the ue with an ims, the secondary ip address over the internet pdn connection, before disconnecting the ims pdn connection by the communication network; receiving, by the ue from the ims, a mobile terminated (mt) call notification using the secondary ip address over the internet pdn connection; and based on the received mt call notification, re-establishing, by the ue, the ims pdn connection.
Inventor(s): Anant BAIJAL of Suwon-si (KR) for samsung electronics co., ltd., Seungki Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L65/613, G06T19/00
CPC Code(s): H04L65/613
Abstract: a server is provided. the server includes a communication interface and a processor. the processor renders a virtual world image including an avatar corresponding to a user; transmits the virtual world image to a user terminal device through the communication interface; based on receiving, from the user terminal device through the communication interface, a first user command to add a virtual display device to the virtual world image, renders the virtual world image on which content displayed on a display device corresponding to the virtual display device is displayed through the virtual display device.
Inventor(s): Sungyong JOO of Suwon-si (KR) for samsung electronics co., ltd., Taehyuck KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngchan PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N5/63, H01L25/16, H02J50/00, H02J50/10, H02J50/40, H04N5/64
CPC Code(s): H04N5/63
Abstract: a display apparatus is provided. the display apparatus includes a display including a plurality of display modules, each of which includes a plurality of light emitting devices; a plurality of wireless power transmitters configured to wirelessly transmit power; a plurality of wireless power receivers configured to receive the power from the plurality of wireless power transmitters, each of the plurality of wireless power receivers including output terminals configured to output the power to the plurality of display modules; and a connector configured to connect the output terminals of the plurality of wireless power receivers to each other.
Inventor(s): Tomasz Jan Palczewski of Danville CA (US) for samsung electronics co., ltd., Anirudh Rao of San Jose CA (US) for samsung electronics co., ltd., Yingnan Zhu of Irvine CA (US) for samsung electronics co., ltd., Hong-Hoe Kim of Aliso Viejo CA (US) for samsung electronics co., ltd.
IPC Code(s): H04N7/01, G06T5/77, G06T7/20
CPC Code(s): H04N7/0122
Abstract: a method includes obtaining, using at least one processing device of an electronic device, a video including multiple scenes at a first aspect ratio. the method also includes performing, using the at least one processing device, backward optical flow estimation and forward optical flow estimation for each of the multiple scenes to select an image frame having a largest missing area. the method further includes performing, using the at least one processing device, outpainting on the image frame having the largest missing area to generate a first outpainted image frame at a second aspect ratio different from the first aspect ratio. in addition, the method includes performing, using the at least one processing device, backward optical flow estimation and forward optical flow estimation using the first outpainted image frame to generate additional outpainted image frames in the multiple scenes at the second aspect ratio.
Inventor(s): Jaesung PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N9/31, G06F3/14, G06V10/40
CPC Code(s): H04N9/3185
Abstract: an electronic apparatus includes an image projection unit, a memory configured to store at least one instruction, and one or more processors connected to the image projection unit and the memory to control the electronic apparatus, and the one or more processors are configured to, by executing the at least one instruction, based on an image capturing a projection surface, identify feature information of the projection surface, identify a first format information corresponding to a plurality of images provided in a multi-view mode, obtain layout information of a plurality of screens corresponding to the plurality of images based on the feature information of the projection surface and the first format information, and control the projection unit so that the plurality of images are provided based on the layout information.
Inventor(s): JAEYOUNG BAE of SEOUL (KR) for samsung electronics co., ltd., SUNYOOL KANG of SUWON-SI (KR) for samsung electronics co., ltd., HAESICK SUL of SUWON-SI (KR) for samsung electronics co., ltd., SUYONG KIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/75, H01L27/146, H04N25/709, H04N25/71, H04N25/77, H04N25/79
CPC Code(s): H04N25/75
Abstract: an image sensor includes a pixel array that includes a first pixel group located in a first row and including a first select transistor and a first floating diffusion region, a second pixel group located in a second row and including a second select transistor and a second floating diffusion region, and a column line connected to both the first pixel group and the second pixel group. while charges generated by a photoelectric conversion element of the first pixel group are transferred to the first floating diffusion region, the first select transistor is turned off, the second select transistor is turned on, and a first voltage is applied to the column line through the second select transistor. a photoelectric conversion element of the second pixel group generates charges prior to the photoelectric conversion element of the first pixel group, so as to be transferred to the second floating diffusion region.
Inventor(s): Keun Joo PARK of Seoul (KR) for samsung electronics co., ltd., Junseok KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Yohan ROH of Suwon-si (KR) for samsung electronics co., ltd., Hyunsurk RYU of Hwaseong-si (KR) for samsung electronics co., ltd., Jooyeon WOO of Hwasung-si (KR) for samsung electronics co., ltd., Hyunku LEE of Hwasung-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/77, G06F16/23, G06F16/583, H04N25/40, H04N25/683, H04N25/772, H04N25/79, H05B39/04, H05B47/11, H05B47/155, H05B47/16
CPC Code(s): H04N25/77
Abstract: an image processing device includes a vision sensor and a processor. the vision sensor generates a plurality of events in which an intensity of light changes and generates a plurality of timestamps depending on times when the events occur. in addition, the processor may regenerate a timestamp of a pixel where an abnormal event occurs, based on temporal correlation of the events.
20250063272. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SEOKSAN KIM of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/771, H04N25/773
CPC Code(s): H04N25/771
Abstract: an image sensor includes a plurality of pixels. each pixel includes a first photo diode, a floating diffusion node, a first capacitor, a second capacitor, a first sampling transistor, and a second sampling transistor. the first sampling transistor is configured to sample charges from the first capacitor. the second sampling transistor is configured to sample charges from the second capacitor. the image sensor operates the first capacitor to store one of reset charges according to a voltage of the floating diffusion node reset and signal charges according to a voltage of the floating diffusion node in which the photo charges are accumulated, operates the second capacitor to stores the other one of the reset charges and the signal charges and changes types of charges stored in each of the first capacitor and the second capacitor.
Inventor(s): Dongeun SUH of Suwon-si (KR) for samsung electronics co., ltd., Hyesung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangjun MOON of Suwon-si (KR) for samsung electronics co., ltd., Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W4/38, H04W4/029, H04W64/00
CPC Code(s): H04W4/38
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method for providing an integrated sensing service in a wireless communication system is provided. the method includes receiving, from a first device, a request message for requesting a sensing service related to at least one sensing node, transmitting, to an access and mobility management function (amf) related to the at least one sensing node, a transfer request message for requesting sensing service activation based on the request message, and receiving, from the at least one sensing node, at least one sensing event notification message including a sensing result based on the request message.
Inventor(s): Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Bilal Sadiq of Plano TX (US) for samsung electronics co., ltd., Matthew Tonnemacher of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Frisco TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei (TW) for samsung electronics co., ltd.
IPC Code(s): H04W8/00, H04W8/20, H04W88/04
CPC Code(s): H04W8/005
Abstract: a first device associated with a second device in a wireless network, the first device comprising at least one station (sta) affiliated with the first device and a processor coupled to the at least one sta, the processor configured to determine a relay node that can perform one or more relay operations to communicate with the first sta, transmit, to a second sta, a first frame that includes information regarding the relay node that can be used to communicate with the first sta, and communicate with the second sta via the relay node.
Inventor(s): Heejeong CHO of Seoul (KR) for samsung electronics co., ltd., Sanghwi LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeongdon KANG of Suwon-si (KR) for samsung electronics co., ltd., Killyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyeon SEO of Yongin-si (KR) for samsung electronics co., ltd., Sangsoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Yoonjung JUNG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/18, H04L9/40, H04L67/51, H04M1/72412, H04W4/50, H04W4/60, H04W4/80, H04W12/041, H04W12/06, H04W12/30, H04W12/42, H04W52/02, H04W76/11, H04W76/14, H04W76/15, H04W88/04, H04W88/06
CPC Code(s): H04W8/183
Abstract: an entitlement server establishes a communication connection with a user equipment and receives from the user equipment a first request for a specific service activation through a communication connection. the first request includes information indicating whether to activate the specific service and the specific service is for transmitting and/or receiving a call via a cellular communication connection with a telephone number of the user equipment at an external electronic device connected, via a short-range communication connection, with the user equipment. a second request for configuration information is received from the user equipment a through the communication connection and includes one or more service identifiers corresponding to one or more services, including the specific service, available to the external electronic device. subsequent to transmission of the first request and/or the second request, the entitlement server transmits to the user equipment the configuration information associated with the activated specific service available to the external electronic device.
Inventor(s): Hyunjae KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Taewon DO of Suwon-si (KR) for samsung electronics co., ltd., Hyonmyong CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/033, H04L5/00, H04W12/043, H04W80/06
CPC Code(s): H04W12/033
Abstract: in an electronic device and an operation method of the electronic device according to an embodiment, the electronic device may include: a communication circuit, an application processor including at least one processor comprising processing circuitry, and a communication processor including at least one processor comprising processing circuitry, wherein at least one processor, individually and/or collectively, of the application processor is configured to: according to initiation of a call, receive, from a cellular network supporting a quantum encrypted call, identity information of a session of the quantum encrypted call and information indicating a key of the quantum encrypted call, determine a number of times of transmission of at least one packet for identifying whether an external electronic device to be connected via the session has the identity information of the session and/or the key, based on a status of a channel between the electronic device and the cellular network, control the electronic device to transmit the at least one packet to the external electronic device, based on the determined number of times of transmission, and based on the electronic device receiving, from the external electronic device, an acknowledgement packet indicating that the external electronic device has the identity information of the session and the key, perform the quantum encrypted call, based on the key.
Inventor(s): Aby Kanneath ABRAHAM of Bangalore (IN) for samsung electronics co., ltd., Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04W64/00
CPC Code(s): H04W24/10
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein provide a method for managing measurement gap in a wireless network () by a ue (). the method includes sending a gap deactivation request message to a network apparatus () to deactivate the at least one measurement gap activated at the ue (). further, the method includes receiving a gap deactivation command message from the network apparatus () in response to the gap deactivation request message for deactivation of the at least one measurement gap activated at the ue. further, the method includes deactivating the at least one measurement gap activated at the ue in response to receiving the gap deactivation command message from the network apparatus.
20250063415. CSI COMPUTATION TIME_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04L5/00, H04W72/232, H04W72/51
CPC Code(s): H04W24/10
Abstract: apparatuses and methods for channel state information (csi) computation time. a method performed by a user equipment (ue) includes receiving a configuration about a csi report; based on the configuration, determining the csi report; and transmitting the csi report. the csi report starts no earlier than at a symbol z and at a symbol z′. the symbol z is a next uplink symbol with a cyclic prefix (cp) starting t=z(2048+144)�k2�tafter an end of a last symbol of a downlink control information triggering the csi report. the symbol z′ is a next uplink symbol with a cp starting t′=z(2048+144)�k2�tafter an end of a last symbol in time of a latest of channel and interference measurements associated with the csi report. (z, z′) is (z+w, z′) or (z+w+z′, 2z′) according to a ue capability. (z, z′) is according to a table; w depends on a periodicity of a periodic or semi-persistent csi-reference signal resource.
Inventor(s): Seunghoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyewon YANG of Suwon-si (KR) for samsung electronics co., ltd., Jaewon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04W52/02
CPC Code(s): H04W24/10
Abstract: the disclosure relates to a 5generation (5g) or a 6generation (g) communication system for supporting a higher data transmission rate. a method and performed by a user equipment (ue) in a communication system is provided. the method includes receiving, via higher layer signaling, a first configuration of measurement gap and a second configuration associated with whether signal transmission that is available to be received by the ue using a wake-up receiver (wur) of the ue is supported by a plurality of cells, identifying the measurement gap based on the first configuration, identifying at least one cell supporting the signal transmission among the plurality of cells based on the second configuration, and performing, by using the wur during the measurement gap, a measurement for the at least one cell.
Inventor(s): Donggun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sangkyu BAEK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04L5/00, H04W80/02
CPC Code(s): H04W28/0273
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure provides a method for processing mac control information of a base station, the method comprising the steps of: identifying capability information or configuration information of a terminal; determining, on the basis of the result of the identification, whether to use a first type of mac control information or a second type of mac control information; generating, on the basis of the result of the determination, the first type of mac control information or the second type of mac control information; and transmitting, to the terminal, the first type of mac control information or the second type of mac control information that has been generated.
Inventor(s): Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/14
CPC Code(s): H04W36/0079
Abstract: a method performed by a terminal in a wireless communication system is provided. the method comprises the steps of: receiving a message for a command of handover from a cell of a first radio access technology (rat) to a target cell of a second rat, the message including voicefallbackindication; performing handover from the cell of the first rat to the target cell of the second rat on the basis of the message; and determining report content for a radio link failure if establishment of a connection to the target cell is not successful, wherein the report content for a radio link failure can include information indicating that the handover failure is associated with voice fallback.
Inventor(s): Yanru WANG of Beijing (CN) for samsung electronics co., ltd., Yu PAN of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Fuyuan LI of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/12
CPC Code(s): H04W36/00838
Abstract: the disclosure provides a node in a wireless communication system and methods performed by the same. a method performed by a first node in a wireless communication system is provided. the method includes receiving a fifth message from a second node, wherein the fifth message includes a layer 1/layer 2 (l1/l2)-triggered mobility (ltm) handover request, and wherein the fifth message includes information of at least one candidate target cell of the first node, transmitting a sixth message to the second node, wherein the sixth message includes an ltm handover request result, receiving a second message from the second node, wherein the second message includes information of at least one candidate target cell, transmitting a third message to a third node based on the information of the at least one candidate target cell, wherein the third message includes information indicating a user equipment to handover and/or access to the first node, and receiving a fourth message from the third node and/or the second node, wherein the fourth message includes updated handover related information.
Inventor(s): Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/36, H04W36/00, H04W36/32, H04W76/20, H04W84/06
CPC Code(s): H04W36/362
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method and an apparatus for supporting an aerial ue can be provided according to various embodiments of the present disclosure.
Inventor(s): Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W40/22, H04W40/34, H04W84/04
CPC Code(s): H04W40/22
Abstract: the present disclosure relates to a pre-5th-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4th-generation (4g) communication system such as long term evolution (lte). the embodiments of the present application provide a method and a device for routing a data packet, and a method and a device for controlling a data packet transmission. the data packet routing method includes: receiving a first message transmitted by a first node; and determining a transmission path of the data packet according to the first message. the method provided in the present application achieves that a node in a relay network can determine a condition for transmitting the data packet by using other transmission paths, thereby effectively using multiple transmission paths to implement the data packet transmission.
Inventor(s): Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Bilal Sadiq of Plano TX (US) for samsung electronics co., ltd., Matthew Tonnemacher of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Rubayet Shafin of Frisco TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Frisco TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei City (TW) for samsung electronics co., ltd.
IPC Code(s): H04W48/10, H04L5/00, H04W76/15
CPC Code(s): H04W48/10
Abstract: methods and apparatuses for setup, management and use of relay devices in a wireless local area network. a relay device includes a transceiver and a processor operably connected to the transceiver. the transceiver is configured to form a first link with a wireless access point (ap) and a second link with a wireless non-ap station (sta). the processor is configured to determine to perform a relay control action comprising (i) setup of a relay connection by which the relay device will relay traffic between the ap and the sta over the first and second links, (ii) teardown of the relay connection, or (iii) advertisement of a capability of the relay device to support the relay connection, and to generate a control message including an indication of the relay control action. the transceiver is further configured to transmit, to at least one of the ap and the sta, the generated control message.
20250063475. ON-DEMAND SS/PBCH BLOCK_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of Allen TX (US) for samsung electronics co., ltd., Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W48/14
CPC Code(s): H04W48/14
Abstract: methods and apparatuses for an operation for an on-demand synchronization signals/physical broadcast channel (ss/pbch) block is provided. a method of a user equipment (ue) in a wireless communication system includes determining a first set of parameters for a first set of ss/pbch blocks and determining a second set of parameters for a second set of ss/pbch blocks. the first set of parameters includes a first cell identity (id) and a first frequency location. the second set of parameters includes a second cell id and a second frequency location. the first set of ss/pbch blocks is periodic. the second set of ss/pbch blocks is on-demand and indicated to be transmitted by a base station (bs). the method further includes receiving a first ss/pbch block from the first set of ss/pbch blocks and receiving a second ss/pbch block from the second set of ss/pbch blocks.
20250063476. CONFIGURATION FOR ON-DEMAND SIB1_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of Allen TX (US) for samsung electronics co., ltd., Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W48/14
CPC Code(s): H04W48/14
Abstract: methods and apparatuses for an operation for configurations for on-demand sib in a wireless communication system is provided. a method of a user equipment (ue) includes receiving, from a cell of a first base station (bs), a first synchronization signals and physical broadcast channel (ss/pbch) block; determining, based on an indication in a physical broadcast channel (pbch) of the first ss/pbch block, a first value of k; and determining, based on the first value of k, whether the cell is associated with an on-demand system information block 1 (sib1). the method further includes transmitting, based on a determination that the cell is associated with the on-demand sib1, a request for the on-demand sib1 to a second bs and receiving the on-demand sib1.
Inventor(s): Hyesung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jicheol LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W48/16, H04W84/04
CPC Code(s): H04W48/18
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by an access and mobility management function (amf) in a communication system includes receiving, from a user equipment (ue), a registration request message, receiving, from a unified data management (udm), subscription information for session management function (smf) selection including an identifier (id) of a target public land mobile network (plmn) for traffic routing, and selecting an smf for traffic routing in the target plmn based on the id of the target plmn included in the subscription information.
Inventor(s): Sangjun MOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W48/08
CPC Code(s): H04W48/18
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to the disclosure, a 3gpp 5gs (5g system) may provide a multiple-access-based network selection function for selecting a network for multiple 3gpp accesses in order to provide multiple 3gpp accesses to a wireless terminal.
Inventor(s): Pengru LI of Beijing (CN) for samsung electronics co., ltd., Min WU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W68/02
CPC Code(s): H04W52/0216
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment in a wireless communication system includes receiving, from a base station, configuration information related to a time-domain position of a signal, identifying the time-domain position of a first signal according to the configuration information, the first signal being used for at least one of synchronization or a radio resource management (rrm) measurement, and identifying the time-domain position of a monitoring occasion for a second signal based on the time-domain position of the first signal, the second signal being used for a wake-up.
Inventor(s): Hyunseok RYU of Suwon-si (KR) for samsung electronics co., ltd., Jeongho YEO of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung OH of Suwon-si (KR) for samsung electronics co., ltd., Sungjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Juho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/24, H04L5/00, H04W52/38, H04W56/00, H04W92/18
CPC Code(s): H04W52/242
Abstract: the present disclosure relates to a method and apparatus for estimating inter-terminal sidelink path loss for control information and data information transmission between terminals. a path loss estimation method of a transmission terminal in a wireless communication system according to an embodiment may include transmitting a signal for path loss estimation to a reception terminal, receiving a path loss estimation result report from the reception terminal in response to the signal for path loss estimation, configuring a transmission power based on the path loss estimation result report, and performing a sidelink transmission with the reception terminal with the configured transmission power.
Inventor(s): Matthew Tonnemacher of Allen TX (US) for samsung electronics co., ltd., Bilal Sadiq of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/24, H04W8/00
CPC Code(s): H04W52/245
Abstract: an embodiment includes a method for messaging in a wireless network that includes receiving, by a proxy device for an origin device, a first message from the origin device, wherein the first message includes a reference transmit power of the origin device and the first message is received with a received power, computing, by the proxy device, a transmit power for transmitting messages on behalf of the origin device based on the reference transmit power and the received power, and transmitting at the transmit power, by the proxy device, a second message that includes information about a service provided by the origin device.
Inventor(s): Seunghoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jinkyu KANG of Suwon-si (KR) for samsung electronics co., ltd., Youngbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Taehyoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/36, H04W52/46, H04W88/14
CPC Code(s): H04W52/367
Abstract: provided is an integrated access and backhaul (iab) node for controlling transmit and receive power of a signal in a wireless communication system, the iab node including: a transceiver; and at least one processor, wherein the at least one processor is configured to: determine a power value or an offset used for down adjustment of maximum transmit power for a backhaul link signal to be received by the iab node, based on receive power of an access uplink signal from a terminal or maximum transmit power of the terminal; control the transceiver to transmit power adjustment information including the power value or the offset to a parent node of the iab node or a child node of the iab node; and control the transceiver to receive, from the parent node or the child node, a backhaul link signal in which the maximum transmit power is down-adjusted based on the power adjustment information.
Inventor(s): Hyunjeong KANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Anil AGIWAL of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W60/04, H04W76/27
CPC Code(s): H04W60/04
Abstract: the present disclosure relates to: a communication technique for merging iot technology with a 5g communication system for supporting a data transmission rate higher than that of a 4g system; and a system therefor. the present disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smartcars or connected cars, healthcare, digital education, small businesses, security- and safety-related services, and the like) on the basis of 5g communication technology and iot-related technology. the present disclosure relates to a method and a device for performing, on the basis of a sidelink in a wireless communication system, a ran notification area (rna) update operation of a remote terminal, in an rrc_inactive state, connected to a relay.
Inventor(s): Jagadeesh GANDIKOTA of Bangalore (IN) for samsung electronics co., ltd., Koustav ROY of Bangalore (IN) for samsung electronics co., ltd., Danish Ehsan HASHMI of Bangalore (IN) for samsung electronics co., ltd., Arijit SEN of Bangalore (IN) for samsung electronics co., ltd., Jyotirmoy KARJEE of Bangalore (IN) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W60/04, H04W40/22, H04W48/18, H04W84/04
CPC Code(s): H04W60/04
Abstract: according to an example embodiment of the disclosure, a method for performing network slice reselection by a user equipment (ue) is disclosed. the method comprises identifying allowed network slices within a first network slice simultaneous registration group (nssrg) for first applications at the ue. the method comprises receiving an initialization request from a second application at the ue. the method comprises determining one or more ue route selection policy (ursp) rules for the second application. the method comprises determining whether the network slice required for the second application corresponds to one of the one or more allowed network slices within the first nssrg. the method comprises transmitting, to a network, a second registration request for registration of the ue to a second nssrg including the network slice required for the second application based on the ursp rules for the second application.
Inventor(s): Jingxing FU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Zhe CHEN of Beijing (CN) for samsung electronics co., ltd., Min WU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/0446
CPC Code(s): H04W72/0446
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a ue includes transmitting, to a base station, a first synchronization signal block (ssb) request; determining whether an ssb is detected from the base station; and in case that the ssb is not detected within a first time interval after transmitting the first ssb request, transmitting, to the base station, a second ssb request.
Inventor(s): Rubayet Shafin of Frisco TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei (TW) for samsung electronics co., ltd.
IPC Code(s): H04W72/27, H04L5/00, H04W52/04, H04W76/15
CPC Code(s): H04W72/27
Abstract: a first station (sta) establishes one or more peer-to-peer (p2p) links with one or more second stas. the first sta transmits, to a first access point (ap), an assistance request frame that requests the first ap coordinates with a second ap to assist in protecting p2p communication between the first sta and the one or more second stas. a first basic service set (bss) corresponding to the first ap and a second bss corresponding to the second ap partially overlap with each other. the first ap coordinates with the second ap to protect the p2p communication. the first ap transmits, to the first sta, an assistance response frame that indicates an assistance provided by the second ap in response to the assistance request frame. the first sta communicates with the one or more second stas based on the assistance provided from the second ap.
Inventor(s): Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Rubayet Shafin of Frisco TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei City (TW) for samsung electronics co., ltd., Abhishek Sehgal of Frisco TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/543, H04W52/02
CPC Code(s): H04W72/543
Abstract: methods and apparatuses for link recommendation for meeting qos requirements. a method of wireless communication performed by an ap associated with an ap mld, the method comprising: receiving an indication of quality of service (qos) requirements from a non-ap mld; determining whether an existing target wake time (twt) or existing links are sufficient to meet qos requirements; when the existing twt or existing links are not sufficient to meet the qos requirements, transmitting a message to the non-ap mld indicating a need to negotiate additional twt service periods (sps) or to transition additional enabled links to an active mode or enable additional links with the ap mld; and when the existing twt or existing links are sufficient to meet the qos requirements, scheduling uplink or downlink resources to meet the qos requirements.
Inventor(s): Rubayet Shafin of Frisco TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei (TW) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04W76/14
CPC Code(s): H04W74/08
Abstract: a first station (sta) in a wireless network is provided. the first sta establishes a peer-to-peer (p2p) link with a second sta. the first sta transmits, to an access point (ap), a first frame that requests the ap to assist in protecting a p2p communication between the first sta and the second sta. in response to the first frame, the first sta receives, from the ap, a second frame that indicates assistance that the ap is able to provide in response to the first frame. then the first sta communicates with the second sta based on the assistance provided from the ap.
Inventor(s): Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Sagar Sudhakara of San Diego CA (US) for samsung electronics co., ltd., Rubayet Shafin of Frisco TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei City (TW) for samsung electronics co., ltd.
IPC Code(s): H04W74/0816, H04W8/22, H04W52/36, H04W74/08
CPC Code(s): H04W74/0816
Abstract: methods and apparatuses for simultaneous transmission of p2p and infrastructure traffic. a method of wireless communication performed by a first wireless device comprises: transmitting a message indicating a capability to support a simultaneous channel access transmission to a second wireless device; receiving, from the second wireless device, an indication for support of the simultaneous channel access transmission; negotiating parameters of coordination for the simultaneous channel access transmission with the second wireless device; performing coordinated channel access inside coordination windows for the simultaneous channel access transmission with the second wireless device; and performing uncoordinated channel access outside the coordination windows for non-simultaneous channel access transmission with the second wireless device.
Inventor(s): Minh Duc HOANG of Hanoi (VN) for samsung electronics co., ltd., Van Hung NGUYEN of Hanoi (VN) for samsung electronics co., ltd., Van Hau TRUONG of Hanoi (VN) for samsung electronics co., ltd., Minh Tuan HOANG of Hanoi (VN) for samsung electronics co., ltd., Duc Doan NGUYEN of Hanoi (VN) for samsung electronics co., ltd., The Thoi NGUYEN of Hanoi (VN) for samsung electronics co., ltd., Van Thinh NGUYEN of Hanoi (VN) for samsung electronics co., ltd.
IPC Code(s): H04W76/10, H04L1/00, H04W8/22, H04W76/30
CPC Code(s): H04W76/10
Abstract: an example method performed by a first terminal in a wireless communication system may include identifying a connection state of a second terminal, receiving capability information from the second terminal, if the second terminal is connected with the first terminal using short-range communication, and is not connected with a serving cell of the first terminal over a wireless network, and transmitting a list of at least one candidate cell identified based on the capability information to the second terminal.
Inventor(s): Rubayet Shafin of Frisco TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/15, H04W88/10
CPC Code(s): H04W76/15
Abstract: methods and apparatuses for reconfiguration of setup links between multi-link devices (mlds). an access point (ap) mld comprises aps and a processor. the aps each comprise a transceiver configured to transmit on a link setup with a corresponding sta of a non-ap mld. the aps are affiliated with the ap mld for ml operation on the setup links. the processor is configured to generate a reconfiguration ml element that indicates affiliated aps that are to be removed from affiliation with the ap mld. the transceivers are configured to transmit the reconfiguration ml element to the corresponding stas of the non-ap mld. the processor is configured to determine whether any of the affiliated aps that are to be removed remain affiliated after transmitting the reconfiguration ml element, and to update the element to indicate the remaining affiliated aps that are to be removed. the transceivers of remaining affiliated aps are configured to transmit the updated reconfiguration ml element to the corresponding stas of the non-ap mld.
Inventor(s): Hyesung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyeon BAE of Suwon-si (KR) for samsung electronics co., ltd., Jicheol LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/22, H04L61/4541
CPC Code(s): H04W76/22
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method for operating a home-session management function (h-smf) in a wireless communication system, according to an embodiment, may comprise transmitting a first message requesting subscription data for a packet data unit (pdu) session to a unified data management (udm), receiving, from the udm, a second message including the subscription data and information about allowing routing of roaming traffic to an edge hosting environment (ehe) of a home network, and selecting a home-edge application server discovery function (h-easdf) based on the second message.
Inventor(s): Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/28
CPC Code(s): H04W76/28
Abstract: apparatuses and methods for monitoring of a physical downlink control channel (pdcch) providing a network operation state. a method performed by a user equipment (ue) receiving first information related to one or more sets of parameters associated with respective one or more cell discontinuous transmission (dtx) or cell discontinuous reception (drx) configurations on a cell, receiving second information related to a reception of an indication for activation or deactivation of the cell dtx or the cell drx and receiving the indication. the sets of parameters include periodicity, start offset, and an on-duration timer. the method further includes determining an active period and an inactive period of the cell dtx or cell drx based on the indication and the first information or an active period and receiving or transmitting channels or signals on the cell based on the determined active and inactive periods of the cell dtx or the cell drx.
Inventor(s): Rubayet Shafin of Frisco TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/34, H04W48/10, H04W88/10
CPC Code(s): H04W76/34
Abstract: a basic service set (bss) corresponding to an access point (ap) affiliated with an ap multi-link device (mld) is terminated when the ap is removed. the link id assigned to the ap is no longer assigned to that ap. a bss corresponding to an ap affiliated with an ap mld is not terminated when the link on which the ap is operating is disabled. the affiliated ap maintains the link id assigned to the ap.
Inventor(s): Youngsun LEE of Suwon-si (KR) for samsung electronics co., ltd., Byeongkeol KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeyeon RA of Suwon-si (KR) for samsung electronics co., ltd., Yongjae SONG of Suwon-si (KR) for samsung electronics co., ltd., Jongmin JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H05K1/02, H05K1/14, H05K7/14
CPC Code(s): H05K5/0226
Abstract: an electronic device comprises: a first housing; a second housing; a hinge structure comprising a hinge rotatably connecting the first housing with the second housing; and a substrate including a flexible portion, a rigid portion, and a stepped portion arranged at a boundary between the flexible portion and the rigid portion. the substrate comprises: a first conductive layer arranged in the flexible portion and the rigid portion; a first coating layer arranged on a portion of the first conductive layer corresponding to the rigid portion; a second conductive layer arranged on the first coating layer in the rigid portion; and a second coating layer arranged on the second conductive layer. a portion of the boundary of the first coating layer is aligned in the stepped portion.
20250063721. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Changhyuck Sung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor device may include a channel structure, a gate insulating layer, a work function adjustment layer, and a word line. the channel structure may include an oxide semiconductor material. the gate insulating layer, the work function adjustment layer, and the word line may be sequentially formed on the channel structure.
20250063724. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): GYUHWAN OH of Suwon-si (KR) for samsung electronics co., ltd., JINWOO HAN of Suwon-si (KR) for samsung electronics co., ltd., SEOKHAN PARK of Suwon-si (KR) for samsung electronics co., ltd., SUNG-MIN PARK of Suwon-si (KR) for samsung electronics co., ltd., BOWON YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L23/522
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes a substrate. bit lines are disposed on the substrate and extend in a first direction. a shield pattern is disposed on the bit lines. a first word line is disposed on the bit lines. the first word line extends in a second direction crossing the first direction. a second word line extends on the bit lines in the second direction and is spaced apart from the first word line in the first direction. a first active pattern and a second active pattern are disposed on the bit lines and are positioned between the first word line and the second word line. the shield pattern includes an opening pattern disposed between adjacent bit lines of the bit lines.
Inventor(s): Jongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungbo KO of Suwon-si (KR) for samsung electronics co., ltd., Donghyuk AHN of Suwon-si (KR) for samsung electronics co., ltd., Minyoung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/06, H01L29/423, H01L29/66
CPC Code(s): H10B12/482
Abstract: a semiconductor device may include first and second bit lines that each include a line portion, a connection portion extending from the line portion into a first extension region, and a pad portion extending from the connection portion in the first extension region; and a third bit line between the line portions of the first and second bit lines in a memory cell array region and the first extension region. a first end portion of the third bit line may be in the first extension region. the pad portions of the first and second bit lines each may be wider than the line portions of the first and second bit lines. a minimum distance between the pad portions of the first and second bit lines may be less than a minimum distance between the line portion of the first bit line and the third bit line.
20250063726. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Si Nyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seong Jae BYEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor memory device is provided. the semiconductor memory device includes a first bit line extending in a first direction on a substrate, a word line on the first bit line, and extending in a second direction intersecting the first direction, a first channel pattern between the first bit line and the word line, and extending along a first side wall of the word line and a first contact pattern on the first channel pattern, wherein in a cross-sectional view taken along the first channel pattern in the second direction, the first contact pattern includes a connecting part on the first channel pattern, and a protruding part which is connected to the connecting part, and extends along a side wall of the first channel pattern.
20250063727. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minhee CHO of Suwon-si (KR) for samsung electronics co., ltd., Hyeran LEE of Suwon-si (KR) for samsung electronics co., ltd., Masayuki TERAI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/66, H01L29/786
CPC Code(s): H10B12/50
Abstract: a semiconductor device includes an upper conductive line extending in a first horizontal direction over a substrate, a channel layer facing the upper conductive line in a second horizontal direction that is perpendicular to the first horizontal direction, a gate dielectric film between the channel layer and the upper conductive line, a conductive contact pattern including a lower surface, which is in contact with an upper surface of the channel layer, and sidewalls including a first sidewall, which faces the upper conductive line in the second horizontal direction, and an insulating spacer including a first portion between the upper conductive line and the conductive contact pattern in the second horizontal direction.
Inventor(s): Junhyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonyoung Kwon of Suwon-si (KR) for samsung electronics co., ltd., Siwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Jiyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Sukkang Sung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B41/35, H01L23/00, H01L25/18, H10B12/00, H10B41/41, H10B43/35, H10B43/40, H10B80/00
CPC Code(s): H10B41/35
Abstract: a semiconductor device includes a plate layer; conductive layers spaced apart from each other in a first direction perpendicular to an upper surface of the plate layer on the plate layer, extending by different lengths in a second direction perpendicular to the first direction, and forming a staircase region; a gap-fill insulating layer on the staircase region; and vertical structures penetrating through the gap-fill insulating layer and the conductive layers in the staircase region and extending in the first direction, and wherein the gap-fill insulating layer includes voids disposed symmetrically with respect to at least one of the vertical structures or a center of the staircase region in a third direction perpendicular to the first direction and the second direction.
Inventor(s): Sangwoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Jongho WOO of Suwon-si (KR) for samsung electronics co., ltd., Seung Min LEE of Suwon-si (KR) for samsung electronics co., ltd., Moonkang CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L25/065, H10B43/10, H10B43/35, H10B51/10, H10B51/20, H10B80/00
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes a source structure having a first source layer, a second source layer on the first source layer, and a third source layer on the second source layer. a gate stack structure is on the source structure. the gate stack structure includes dielectric patterns and conductive patterns that are alternately stacked. a memory channel structure penetrates the gate stack structure. the memory channel structure includes a channel layer. a data storage layer surrounds the channel layer. a blocking layer surrounds the data storage layer. the second source layer includes an inner sidewall directly contacting the channel layer. the third source layer includes an inner sidewall directly contacting the data storage layer.
Inventor(s): Seulji Song of Suwon-si (KR) for samsung electronics co., ltd., Hwayeong Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B53/30
CPC Code(s): H10B53/30
Abstract: a semiconductor memory device includes an active portion, a pad insulating layer on the active portion and including a pad through hole, a landing pad in the pad through hole and electrically connected to the active portion, and the landing pad including a protrusion protruding towards an upper portion of the pad insulating layer, a lower conductive layer on the pad insulating layer and bordering a side surface of the protrusion of the landing pad, a lower electrode on the landing pad and electrically connected to the landing pad, a ferroelectric layer on the lower conductive layer and bordering the lower electrode, an upper electrode bordering the ferroelectric layer, an electrode insulating layer on the upper electrode, a plate line on the electrode insulating layer and the upper electrode and electrically connected to the upper electrode, wherein the plate line is electrically connected to the lower conductive layer through a through via.
Inventor(s): Kilho LEE of Suwon-si (KR) for samsung electronics co., ltd., Daeshik KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B61/00
CPC Code(s): H10B61/00
Abstract: a semiconductor device may include a substrate, data storage patterns on the substrate and spaced apart from each other in a first direction and a second direction that intersect each other and are parallel to a top surface of the substrate, first cell conductive lines that extend in the first direction and are spaced apart from each other in the second direction on the data storage patterns, cell via contacts that are spaced apart from each other in the first direction and disposed between a pair of the first cell conductive lines, dummy data storage patterns that are spaced apart from each other in the first direction between the first cell conductive lines and are disposed between the cell via contacts, and upper conductive lines on the cell via contacts and electrically connected to the cell via contacts, respectively.
Inventor(s): Yumin KIM of Suwon-si (KR) for samsung electronics co., ltd., Seyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Garam PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunjae SONG of Suwon-si (KR) for samsung electronics co., ltd., Seungyeul YANG of Suwon-si (KR) for samsung electronics co., ltd., Seungdam Seungdam of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B63/00
CPC Code(s): H10B63/845
Abstract: a variable resistance memory device includes a channel layer, a resistance change layer provided on the channel layer, the resistance change layer having resistance characteristics that change based on an applied voltage and having a first oxygen diffusion activation energy, and an interface layer provided between the channel layer and the resistance change layer, the interface layer having a second oxygen diffusion activation energy that is greater than the first oxygen diffusion activation energy of the resistance change layer.
20250063763. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Won Keun CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Geun Woo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jun Ki PARK of Suwon-si (KR) for samsung electronics co., ltd., Wan Don KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyo Seok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L21/285, H01L23/528, H01L29/06, H01L29/40, H01L29/423, H01L29/45, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: a semiconductor device may include a backside wiring line in a first backside interlayer insulating film, a fin-type pattern on the backside wiring line, a second backside interlayer insulating film between the fin-type pattern and the first backside interlayer insulating film, a gate electrode on the fin-type pattern, a first source/drain pattern on a side of the gate electrode, and a backside source/drain contact in a backside contact hole defined by the fin-type pattern and the second backside interlayer insulating film. the backside source/drain contact may connect the backside wiring line and the first source/drain pattern. the backside source/drain contact may include an upper pattern and a lower pattern. the upper pattern may be between the lower pattern and the first source/drain pattern, and may fill at least a portion of the first backside contact hole. the upper pattern may have a single conductive film structure.
Inventor(s): Panjae Park of Halfmoon NY (US) for samsung electronics co., ltd., Jintae Kim of Clifton Park NY (US) for samsung electronics co., ltd., Kang-ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L27/06, H01L27/088, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/0847
Abstract: an integrated circuit device includes a wimpy transistor stack on a substrate, wherein the wimpy transistor stack comprises: an upper transistor comprising: a plurality of upper channel regions stacked in a vertical direction; and an upper source/drain region that contacts at least one of the plurality of upper channel regions; a lower transistor that is between the substrate and the upper transistor and comprises: a plurality of lower channel regions stacked in the vertical direction; and a lower source/drain region that contacts at least one of the plurality of lower channel regions; and a source/drain isolation layer separating the upper source/drain region from the lower source/drain region, wherein the source/drain isolation layer contacts a lowermost one of the plurality of upper channel regions and/or an uppermost one of the plurality of lower channel regions.
Inventor(s): Sang Min CHO of Suwon-si (KR) for samsung electronics co., ltd., Hee Sub KIM of Suwon-si (KR) for samsung electronics co., ltd., Bo Mi KIM of Suwon-si (KR) for samsung electronics co., ltd., Chul Sung KIM of Suwon-si (KR) for samsung electronics co., ltd., Geun Hee JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L21/8234, H01L27/088, H01L29/06, H01L29/08, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/66545
Abstract: the semiconductor device includes a substrate, first and second active patterns extending in a first direction, the second active pattern spaced apart from the first active pattern in a second direction different from the first direction, a gate electrode extending in the second direction, a first and second source/drain region each on one side of the gate electrode, a first and second source/drain contact each extending in the second direction on and connected to the first and second source/drain region respectively, and a contact separation layer separating the first and second source/drain contacts, the contact separation layer including a first portion and a second portion on first portion both between the first and second source/drain regions, wherein a width of the first portion of the contact separation layer in the first direction is greater than a width of the second portion of the contact separation layer in the first direction.
Inventor(s): Ju Hun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jong Hyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jong Lae LEE of Suwon-si (KR) for samsung electronics co., ltd., Jong Sun LEE of Suwon-si (KR) for samsung electronics co., ltd., Da Un JEON of Suwon-si (KR) for samsung electronics co., ltd., Hyo Won JEONG of Suwon-si (KR) for samsung electronics co., ltd., Gyu Eon CHO of Suwon-si (KR) for samsung electronics co., ltd., Hyo Taek CHOI of Suwon-si (KR) for samsung electronics co., ltd., Soo Yeon HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/522, H01L23/528, H01L27/088, H01L29/78
CPC Code(s): H01L29/41775
Abstract: a semiconductor device includes: an active pattern extending in a first direction across an underlying substrate, a gate structure extending in a second direction, on the active pattern, a first source/drain contact electrically connected to a source/drain region within the active pattern, on one side of the gate structure, and a first via pattern electrically connected to an upper surface of the first source/drain contact. a rail pattern is provided, which extends in the first direction, and is spaced apart from the first via pattern in the second direction. a wiring pattern extends in the first direction, and is electrically connected to an upper surface of the rail pattern. the first source/drain contact includes a first recess therein, which is more recessed downwardly relative to the upper surface of the first source/drain contact, and at least a portion of the first recess extends adjacent to the rail pattern.
Inventor(s): Suyoung BAE of Suwon-si (KR) for samsung electronics co., ltd., Ohseong Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jaeyeol Song of Suwon-si (KR) for samsung electronics co., ltd., Jeonghyuk Yim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/8238, H01L21/308, H01L27/092
CPC Code(s): H01L21/823807
Abstract: provided is a semiconductor device and method of manufacturing same, the method including: preparing a substrate including first and second regions; forming a first and second channel patterns in the first and second regions, wherein the first and second channel patterns each include a plurality of semiconductor patterns vertically stacked on the substrate, an inner region, and an outer region; forming a high-k dielectric layer covering the first channel pattern and the second channel pattern; forming a first protective mask on the high-k dielectric layer in the first region and the second region; removing the first protective mask from the first outer region and the second outer region; and forming an additional mask layer surrounding the first channel pattern and the second channel pattern, wherein the additional mask layer does not have etch selectivity with the first protective mask.
Inventor(s): Panjae Park of Halfmoon NY (US) for samsung electronics co., ltd., Jintae Kim of Clifton Park NY (US) for samsung electronics co., ltd., Kang-ill Seo of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/822, H01L21/8238, H01L29/06, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L27/0922
Abstract: an integrated circuit device includes a wimpy transistor stack and a reference transistor stack on a substrate. the wimpy transistor stack may include a first intergate insulator that is thicker than a second intergate insulator of the reference transistor stack. due to the thicker first intergate insulator, a number of first upper channel regions of the wimpy transistor stack may be less than a number of second upper channel regions of reference transistor stack, and/or a number of first lower channel regions of the wimpy transistor stack may be less than a number of second lower channel regions of the reference transistor stack.
20250063814. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eui Bok Lee of Suwon-si (KR) for samsung electronics co., ltd., Rak Hwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Jong Min Baek of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/118
CPC Code(s): H01L27/11807
Abstract: a semiconductor device includes a substrate; a first transistor on the substrate; a first contact on a source/drain pattern of the first transistor; a second transistor on the substrate; a second contact on a gate electrode of the second transistor; a first connecting structure that includes at least one first wiring and at least one first via that are alternately stacked on the first contact; a second connecting structure that includes at least one second wiring and at least one second via that are alternately stacked on the second contact; a first connecting via on the first connecting structure; a second connecting via on the second connecting structure; and a connecting wiring on the first connecting via and the second connecting via.
Inventor(s): JAEHONG LEE of Latham NY (US) for samsung electronics co., ltd., WONHYUK HONG of Clifton Park NY (US) for samsung electronics co., ltd., KANG-ILL SEO of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H01L21/822, H01L21/8238, H01L23/528, H01L27/06, H01L27/092, H01L29/06, H01L29/08, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L27/0255
Abstract: integrated circuit devices and methods of forming the same. as an example, an integrated circuit device may include a first substrate; a first transistor structure on the substrate; a second transistor structure stacked in a vertical direction on the first transistor structure; an isolation layer between the first transistor structure and the second transistor structure in the vertical direction; a diode structure on the first substrate and adjacent to the first transistor structure in a horizontal direction; and a second substrate on the second transistor structure in the vertical direction. the diode structure may be part of a discharging path between a gate electrode of the second transistor structure and the second substrate. the discharging path may extend through the isolation layer.
Inventor(s): Kyungsang CHO of Gwacheon-si (KR) for samsung electronics co., ltd., Hojung KIM of Suwon-si (KR) for samsung electronics co., ltd., Chanwook BAIK of Yongin-si (KR) for samsung electronics co., ltd., Yooseong YANG of Yongin (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, B82Y20/00
CPC Code(s): H01L27/14621
Abstract: provided is an image sensor including a sensor array including a plurality of light-sensors respectively including an optoelectronic device, the optoelectronic device including a first electrode, a second electrode spaced apart from the first electrode, and an active layer provided between the first electrode and the second electrode, the active layer including a plurality of quantum dot layers having different energy bands, and a circuit including circuits respectively connected to the plurality of light-sensors and configured to readout an optoelectronic signal generated from each of the plurality of light-sensors.
Inventor(s): Sunghyun Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14636
Abstract: an image sensor includes a substrate that includes a first surface and a second surface that faces the first surface, where the substrate includes a pixel array region, a light-blocking region that at least partially surrounds the pixel array region, and a pad region that at least partially surrounds the light-blocking region, a back surface trench that is in the pad region and extends from the second surface toward the first surface of the substrate, a back surface conductive pad in the back surface trench, and a first back surface via that is in the back surface trench and in a first hole that is spaced apart from the back surface conductive pad in a horizontal direction, where the first back surface via includes a first conductive pattern on an inner surface of the first hole and a second conductive pattern on the first conductive pattern.
Inventor(s): Bonjae KOO of Suwon-si (KR) for samsung electronics co., ltd., Seulji SONG of Suwon-si (KR) for samsung electronics co., ltd., Youngsun SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N70/00, H10B63/00, H10B63/10
CPC Code(s): H10N70/826
Abstract: according to an aspect of the disclosure, a vertical memory device may include: a substrate; a plurality of electrode structures extending in a vertical direction on the substrate; a word line cut disposed apart from the plurality of electrode structures in a horizontal direction and extending in the vertical direction; and a gate stack structure may include gate electrodes and interlayer insulating layers alternately stacked on the substrate along a sidewall of each of the plurality of electrode structures and the word line cut, wherein the gate electrodes may be electrically connected to the plurality of electrode structures. in a plan view, the word line cut may be wavy-shaped.
Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd.
- A47L11/40
- A47L11/24
- H04W4/33
- H04W4/80
- H04W76/10
- CPC A47L11/4011
- Samsung electronics co., ltd.
- A47L15/42
- A47L15/48
- CPC A47L15/4287
- B60R1/22
- H01L27/146
- CPC B60R1/22
- B60W30/165
- G06V10/70
- G06V20/56
- G06V20/58
- G08G1/056
- CPC B60W30/165
- D06F33/38
- D06F23/02
- D06F33/37
- D06F33/58
- D06F35/00
- D06F39/02
- D06F39/08
- D06F101/20
- D06F103/20
- D06F105/02
- D06F105/06
- D06F105/08
- D06F105/42
- CPC D06F33/38
- D06F58/22
- B01D46/681
- CPC D06F58/22
- F25C1/24
- F25C5/08
- CPC F25C1/24
- F25D29/00
- CPC F25D29/005
- G01M11/02
- CPC G01M11/0257
- G01S5/14
- G01S5/02
- CPC G01S5/145
- G02B3/00
- G02B27/10
- H04N23/60
- H04N25/11
- CPC G02B3/0006
- G02B7/02
- G03B17/12
- H04N23/55
- H04N23/57
- CPC G02B7/021
- G02B27/01
- CPC G02B27/0172
- G02C13/00
- G06F1/16
- CPC G02C13/001
- G03F9/00
- H01L23/544
- CPC G03F9/7076
- G05B15/02
- H04L12/28
- CPC G05B15/02
- G05D1/622
- G05D1/246
- G05D111/10
- G06T7/521
- CPC G05D1/622
- G05F1/575
- G05F1/565
- G11C5/14
- CPC G05F1/575
- G05F1/59
- CPC G05F1/59
- G06F3/16
- CPC G06F1/163
- G06F3/0354
- G06F3/041
- H04M1/02
- CPC G06F1/1652
- H01Q1/24
- CPC G06F1/1656
- G06F3/01
- G06T7/11
- G06T15/20
- CPC G06F3/013
- G06F3/044
- CPC G06F3/044
- G06F3/06
- CPC G06F3/0619
- CPC G06F3/064
- CPC G06F3/0659
- H03M13/00
- H03M13/11
- G06F3/14
- CPC G06F3/1454
- G06F9/30
- G06F9/48
- G06F17/16
- CPC G06F9/3836
- G06F11/14
- CPC G06F11/1448
- G06F12/02
- G06F13/42
- CPC G06F12/0246
- G06F12/0873
- G06F12/0804
- CPC G06F12/0873
- G06F12/12
- CPC G06F12/12
- G06F13/16
- CPC G06F13/1668
- G06F13/28
- CPC G06F13/28
- G06F16/2457
- G06F16/22
- G06F16/2453
- CPC G06F16/24573
- G06F21/57
- H04L9/06
- H04L9/08
- CPC G06F21/572
- G06F30/3953
- H01L23/528
- CPC G06F30/3953
- G06T5/80
- G06N3/088
- G06T5/50
- CPC G06T5/80
- G06T7/00
- G06V10/764
- G06V10/82
- CPC G06T7/0004
- G06T5/30
- G06T5/70
- G06V10/60
- G06V10/762
- G06V20/70
- CPC G06T7/0008
- G06T7/70
- G06V10/774
- G06V10/776
- CPC G06T7/70
- G06V10/26
- G06V10/74
- G06V10/77
- CPC G06V20/70
- G06V40/20
- G01S13/50
- CPC G06V40/20
- G01S13/62
- G06T7/246
- CPC G06V40/28
- G09G3/20
- H04R1/02
- H04R1/40
- H04R3/12
- H05K5/02
- CPC G09G3/20
- G09G3/32
- CPC G09G3/32
- G09G3/3233
- G11C11/408
- CPC G11C11/4085
- G11C11/4091
- G11C11/4096
- G11C29/52
- CPC G11C11/4091
- CPC G11C11/4096
- G11C29/12
- CPC G11C29/12
- H01L21/673
- H01L21/67
- CPC H01L21/67386
- H01L21/683
- C09J4/00
- C09J7/38
- H01L23/00
- CPC H01L21/6836
- H01L23/13
- H01L23/16
- H01L23/31
- H01L23/498
- CPC H01L23/13
- H01L23/538
- H01L25/10
- H10B80/00
- CPC H01L23/3107
- H01L21/56
- H01L25/00
- H01L25/065
- H01L25/18
- CPC H01L23/3192
- H01L23/367
- CPC H01L23/3677
- H01L23/42
- H01L23/373
- H01L23/64
- CPC H01L23/42
- H01L23/48
- H01L21/8238
- H01L27/07
- H01L27/092
- H01L29/06
- H01L29/417
- H01L29/423
- H01L29/66
- H01L29/775
- H01L29/786
- CPC H01L23/481
- H01L21/768
- H01L23/532
- H01L23/535
- CPC H01L23/49833
- CPC H01L23/49838
- H01L23/62
- H01L21/48
- H01L23/522
- CPC H01L23/5223
- H10B12/00
- CPC H01L23/5283
- H10B41/10
- H10B41/27
- H10B41/35
- H10B43/10
- H10B43/27
- H10B43/35
- CPC H01L23/5385
- H01L25/16
- CPC H01L23/5386
- H01L23/427
- CPC H01L23/5389
- CPC H01L23/562
- H01L23/58
- CPC H01L23/585
- CPC H01L24/05
- H01L23/36
- CPC H01L24/06
- CPC H01L24/08
- H01L23/60
- CPC H01L24/16
- CPC H01L24/20
- CPC H01L24/32
- CPC H01L25/0652
- CPC H01L25/0657
- CPC H01L25/16
- H01L23/29
- CPC H01L25/18
- H02J7/00
- CPC H02J7/0019
- H02J50/27
- H02J50/40
- CPC H02J50/27
- H02M3/07
- CPC H02M3/07
- H02M3/158
- CPC H02M3/158
- H02P5/74
- F24F11/52
- F24F11/88
- H02P5/50
- H02P11/06
- CPC H02P5/74
- H03K3/037
- G01R31/3177
- H03K3/012
- H03K19/173
- CPC H03K3/037
- H03L7/107
- H03L7/089
- H03L7/095
- CPC H03L7/1077
- H04B7/0417
- H04B7/06
- CPC H04B7/0417
- H04B17/309
- H04L5/00
- H04L25/02
- CPC H04B17/346
- H04B1/04
- H04L5/14
- CPC H04L5/001
- H04L7/00
- CPC H04L7/0025
- H04L47/2483
- H04L12/46
- H04L47/125
- CPC H04L47/2483
- H04L65/1069
- H04L65/1016
- H04L65/1104
- CPC H04L65/1069
- H04L65/613
- G06T19/00
- CPC H04L65/613
- H04N5/63
- H02J50/00
- H02J50/10
- H04N5/64
- CPC H04N5/63
- H04N7/01
- G06T5/77
- G06T7/20
- CPC H04N7/0122
- H04N9/31
- G06V10/40
- CPC H04N9/3185
- H04N25/75
- H04N25/709
- H04N25/71
- H04N25/77
- H04N25/79
- CPC H04N25/75
- G06F16/23
- G06F16/583
- H04N25/40
- H04N25/683
- H04N25/772
- H05B39/04
- H05B47/11
- H05B47/155
- H05B47/16
- CPC H04N25/77
- H04N25/771
- H04N25/773
- CPC H04N25/771
- H04W4/38
- H04W4/029
- H04W64/00
- CPC H04W4/38
- H04W8/00
- H04W8/20
- H04W88/04
- CPC H04W8/005
- H04W8/18
- H04L9/40
- H04L67/51
- H04M1/72412
- H04W4/50
- H04W4/60
- H04W12/041
- H04W12/06
- H04W12/30
- H04W12/42
- H04W52/02
- H04W76/11
- H04W76/14
- H04W76/15
- H04W88/06
- CPC H04W8/183
- H04W12/033
- H04W12/043
- H04W80/06
- CPC H04W12/033
- H04W24/10
- CPC H04W24/10
- H04W72/232
- H04W72/51
- H04W28/02
- H04W80/02
- CPC H04W28/0273
- H04W36/00
- H04W36/14
- CPC H04W36/0079
- H04W36/12
- CPC H04W36/00838
- H04W36/36
- H04W36/32
- H04W76/20
- H04W84/06
- CPC H04W36/362
- H04W40/22
- H04W40/34
- H04W84/04
- CPC H04W40/22
- H04W48/10
- CPC H04W48/10
- H04W48/14
- CPC H04W48/14
- H04W48/18
- H04W48/16
- CPC H04W48/18
- H04W48/08
- H04W68/02
- CPC H04W52/0216
- H04W52/24
- H04W52/38
- H04W56/00
- H04W92/18
- CPC H04W52/242
- CPC H04W52/245
- H04W52/36
- H04W52/46
- H04W88/14
- CPC H04W52/367
- H04W60/04
- H04W76/27
- CPC H04W60/04
- H04W72/0446
- CPC H04W72/0446
- H04W72/27
- H04W52/04
- CPC H04W72/27
- H04W72/543
- CPC H04W72/543
- H04W74/08
- CPC H04W74/08
- H04W74/0816
- H04W8/22
- CPC H04W74/0816
- H04L1/00
- H04W76/30
- CPC H04W76/10
- H04W88/10
- CPC H04W76/15
- H04W76/22
- H04L61/4541
- CPC H04W76/22
- H04W76/28
- CPC H04W76/28
- H04W76/34
- CPC H04W76/34
- H05K1/02
- H05K1/14
- H05K7/14
- CPC H05K5/0226
- CPC H10B12/315
- CPC H10B12/482
- CPC H10B12/50
- H10B41/41
- H10B43/40
- CPC H10B41/35
- H10B51/10
- H10B51/20
- CPC H10B43/27
- H10B53/30
- CPC H10B53/30
- H10B61/00
- CPC H10B61/00
- H10B63/00
- CPC H10B63/845
- H01L21/285
- H01L29/40
- H01L29/45
- CPC H01L29/41733
- H01L27/06
- H01L27/088
- CPC H01L29/0847
- H01L21/8234
- H01L29/08
- CPC H01L29/66545
- H01L29/78
- CPC H01L29/41775
- H01L21/308
- CPC H01L21/823807
- H01L21/822
- CPC H01L27/0922
- H01L27/118
- CPC H01L27/11807
- H01L27/02
- CPC H01L27/0255
- B82Y20/00
- CPC H01L27/14621
- CPC H01L27/14636
- H10N70/00
- H10B63/10
- CPC H10N70/826