Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
Patent Applications by Samsung Electronics Co., Ltd. on March 13th, 2025
Samsung Electronics Co., Ltd.: 176 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (20), H01L25/065 (13), H01L23/31 (11), H01L23/498 (9), G06F3/06 (7) G06F3/0611 (2), H01J37/32642 (2), G06N3/126 (2), H10K85/346 (2), H01L25/0652 (2)
With keywords such as: device, semiconductor, layer, including, information, based, surface, image, configured, and memory in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Jeayun SO of Suwon-si (KR) for samsung electronics co., ltd., Kyongsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinhee KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeonkyu JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28, A47L9/00, A47L11/40, G05D1/648, G05D101/00, G05D105/10
CPC Code(s): A47L9/2826
Abstract: a cleaning robot for detecting a floor while moving around and a method of controlling the cleaning robot are provided. the method includes identifying, by the cleaning robot, a fibrous floor area through a floor detection sensor while the cleaning robot moves around on a cleaning area, determining, by the cleaning robot, based on at least one of a size of the fibrous floor area or a location of the fibrous floor area on a map of the cleaning area, whether the fibrous floor area is a defecation pad area, and causing, based on determining that the fibrous floor area is the defecation pad area, the cleaning robot to move around while avoiding the fibrous floor area.
Inventor(s): Seongu LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk PARK of Suwon-si (KR) for samsung electronics co., ltd., Seho PARK of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon BAE of Suwon-si (KR) for samsung electronics co., ltd., Yeongju LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeshik JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28, H02J7/00
CPC Code(s): A47L9/2873
Abstract: a method of operating a switch and an electric device employing the method. the method of operating the switch is according to an operation event occurring on a station side of a wireless vacuum cleaner, and includes activating a cleaner body according to the switch operation in a state in which a connection between a main processor of the cleaner body and a battery is blocked and charging from the station and the battery is stopped.
20250082171. DISHWASHER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Johannes BÜSING of Suwon-si (KR) for samsung electronics co., ltd., Jisun YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L15/42
CPC Code(s): A47L15/4246
Abstract: the dishwasher comprises: a tub having a washing chamber and includes a bottom wall having an opening; a sump housing coupled to the bottom wall and includes a guide wall radially extending to guide a movement of washing water discharged from the opening, an inner flange protruding from the guide wall toward the bottom wall of the tub, an outer flange disposed outside the inner flange and spaced apart from the inner flange to form a locking groove, and a first coupling portion at the guide wall inside the inner flange; and a sealer to seal between the bottom wall of the tub and the sump housing, the sealer includes a sealing body disposed between the inner flange and the bottom wall of the tub and including a second coupling portion coupled to the first coupling portion, and a locking body inserted into the locking groove of the sump housing.
Inventor(s): Soyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinseok LEE of Yongin-si (KR) for samsung electronics co., ltd., Seungseok LEE of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/0245, A61B5/00, A61B5/308
CPC Code(s): A61B5/0245
Abstract: a biosignal processing method includes receiving a biosignal from a sensor, performing first signal processing based on variable frequency complex demodulation (vfcdm) on the biosignal, performing, once or more, second signal processing based on the vfcdm on a periodic signal having an instantaneous frequency as a center frequency, the instantaneous frequency being calculated based on the first signal processing, and estimating bio-information, based on at least one processing signal calculated based on the second signal processing performed once or more.
Inventor(s): Soyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinseok Lee of Yongin-si (KR) for samsung electronics co., ltd., Sang Kyu Kim of Suwon-si (KR) for samsung electronics co., ltd., Yongbin Lee of Yongin-si (KR) for samsung electronics co., ltd., Hong Soon Rhee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/361, A61B5/024
CPC Code(s): A61B5/361
Abstract: a method of detecting atrial fibrillation includes receiving a photoplethysmogram (ppg) signal from a first sensor of a wearable device, detecting a heart rate from the ppg signal based on a window power spectrum analysis of the ppg signal, and detecting atrial fibrillation based on the heart rate.
Inventor(s): Viswam NATHAN of Clovis CA (US) for samsung electronics co., ltd., Larry ZHANG of San Jose CA (US) for samsung electronics co., ltd., Md Mahbubur RAHMAN of San Jose CA (US) for samsung electronics co., ltd., Jilong KUANG of San Jose CA (US) for samsung electronics co., ltd., Jungmok BAE of Menlo Park CA (US) for samsung electronics co., ltd., Jun GAO of Menlo Park CA (US) for samsung electronics co., ltd.
IPC Code(s): A61B5/00, A61B5/024, A61B5/0295, A61B5/16
CPC Code(s): A61B5/7267
Abstract: a computer-implemented method includes: receiving, from a sensor of an electronic device, a photoplethysmography (ppg) signal about a user; dividing the received ppg signal into a first set of waveforms; checking qualities of the first set of waveforms and generating a second set of waveforms based on the checked qualities of the first set of waveforms; extracting a plurality of morphological features of each waveform of the second set of waveforms and calculating a plurality of time/amplitude factors based on the extracted plurality of morphological features; estimating, using an artificial intelligence model, a stress level of the user, based on the calculated plurality of time/amplitude factors; and providing the estimated stress level to the user.
Inventor(s): Shailabh Kumar of Pasadena CA (US) for samsung electronics co., ltd., Vinayak Narasimhan of Altadena CA (US) for samsung electronics co., ltd., Hyuck Choo of Yongin-si (KR) for samsung electronics co., ltd., Radwanul Hasan Siddique of Monrovia CA (US) for samsung electronics co., ltd., Yibing Michelle Wang of Temple City CA (US) for samsung electronics co., ltd.
IPC Code(s): B01L7/00
CPC Code(s): B01L7/52
Abstract: a nucleic acid amplification system includes a single use chemical heater, a fluidic consumable on the single use chemical heater that is configured to contain a test sample including target nucleic acids, a multi-use heater configured to heat the single use chemical heater and/or the fluidic consumable, a temperature sensor configured to measure a temperature of the test sample in the fluidic consumable, a computer device including a processor, a non-volatile memory device, and a controller that is configured to control the multi-use heater, and a detection system configured to detect the target nucleic acids.
20250083279. POLISHING PROCESS APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Bongwon Ahn of Suwon-si (KR) for samsung electronics co., ltd., Eunsil Bae of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B49/04, B24B49/14
CPC Code(s): B24B49/04
Abstract: a polishing process apparatus includes a carrier including a polishing head on which a polishing object is provided, a polishing pad on a lower portion of the carrier, a plurality of temperature sensors on the carrier, and a controller configured to control the carrier, the polishing pad, and the plurality of temperature sensors. the plurality of temperature sensors are in a row in a radial direction, parallel to an upper surface of the polishing head and extending outwardly from a rotation axis of the polishing head. the controller is configured to derive an end point in time of a polishing process using the plurality of temperature sensors and to precisely manage a thickness of the polishing object to be polished, thereby improving reliability of the polishing process apparatus.
20250083320. ROBOT AND CONTROL METHOD THEREOF_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaeha LEE of Suwon-si (KR) for samsung electronics co., ltd., Soonbeom KWON of Suwon-si (KR) for samsung electronics co., ltd., Yeonjun LEE of Suwon-si (KR) for samsung electronics co., ltd., Junyeong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, B25J13/08
CPC Code(s): B25J9/1666
Abstract: a drivable robot includes: at least one sensor; a driver; at least one processor; and memory storing one or more instructions that, when executed by the at least one processor, cause the robot to: based on identifying a revolving door in a photographed image obtained by the at least one sensor, identify free space information of a free space inside the revolving door and object information of an object that is to enter the revolving door based on the photographed image; identify a first time point for the robot to enter the revolving door based on the free space information and the object information; and control the driver such that the robot enters the revolving door at the first time point.
Inventor(s): Sungbae PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B65D5/50, B65D5/38
CPC Code(s): B65D5/5035
Abstract: a packaging box, according to one embodiment, may comprise: a first box having a first through hole; a second box movable in a first direction or a second direction on the basis of the first box; and an elastic structure. the elastic structure, according to one embodiment, may comprise: an elastic part compressed by the second box moving in the first direction; and a guide passing through the inside of the elastic part and the first through hole, and guiding transformation of the elastic part. one end of the guide, according to one embodiment, may be in contact with one end of the elastic part, and the other end of the guide may be fixed to a portion of an inner surface of the second box facing the first box. other embodiments are possible.
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Juhee Moon of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C07B59/00, C09K11/02, C09K11/06, H10K85/30, H10K85/60
CPC Code(s): C07F15/0033
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Juhee Moon of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C07B59/00, C09K11/02, C09K11/06, H10K85/30, H10K85/60
CPC Code(s): C07F15/0033
Abstract:
m(l)(l) formula 1
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Juhee Moon of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C07B59/00, C09K11/02, C09K11/06, H10K85/30, H10K85/60
CPC Code(s): C07F15/0033
Abstract: wherein mis a transition metal, lis a ligand represented by formula 1a, lis a ligand represented by formula 1b, and n1 and n2 are each independently 1 or 2,
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Juhee Moon of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C07B59/00, C09K11/02, C09K11/06, H10K85/30, H10K85/60
CPC Code(s): C07F15/0033
Abstract:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Yong Joo Lee of Suwon-si (KR) for samsung electronics co., ltd., Juhee Moon of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C07B59/00, C09K11/02, C09K11/06, H10K85/30, H10K85/60
CPC Code(s): C07F15/0033
Abstract: wherein xis c or n; xis c or n; xis c or n; and xis c or n; yis o, s, or se; rand rare each independently deuterium, a substituted c-calkyl group comprising deuterium, a substituted c-ccycloalkyl group comprising deuterium, a substituted c-caryl group comprising deuterium, or a substituted c-cheteroaryl group comprising deuterium, and the remaining substituent groups in formulae 1a and 1b are each as described herein.
Inventor(s): Doyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungbok CHOI of Incheon (KR) for samsung electronics co., ltd., Junhyeong PARK of Suwon-si (KR) for samsung electronics co., ltd., Byunghyuk KANG of Incheon (KR) for samsung electronics co., ltd., Jeonghoon KANG of Suwon-si (KR) for samsung electronics co., ltd., Bogyu KIM of Pohang-si (KR) for samsung electronics co., ltd., Yujin PARK of Incheon (KR) for samsung electronics co., ltd., Jaeik PARK of Suwon-si (KR) for samsung electronics co., ltd., Sejun LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyungjin CHOE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F37/22, D06F23/02
CPC Code(s): D06F37/22
Abstract: a clothing treatment apparatus including a cabinet, a tub to be disposed within the cabinet, and a damper configured to support the tub while the tub is disposed within the cabinet, a damper includes a housing, a piston configured to be movable within the housing, a core to be disposed within the housing and including a yoke and teeth extending from the yoke toward the piston, a coil wound on the core, and a magnetorheological elastomer to be disposed between the piston and the core whereby while the magnetorheological elastomer is between the piston and the core, stiffness of the magnetorheological elastomer is changeable by a magnetic field applied to control a movement of the piston within the housing.
Inventor(s): Jun HWANG of Suwon-si (KR) for samsung electronics co., ltd., Donghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo HONG of Suwon-si (KR) for samsung electronics co., ltd., Hyeongkyu CHO of Suwon-si (KR) for samsung electronics co., ltd., Sangjin TAE of Suwon-si (KR) for samsung electronics co., ltd., Jaehun HUR of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F11/63, F24F120/10
CPC Code(s): F24F11/63
Abstract: provided is an air conditioner. the air conditioner includes a detection sensor. the air conditioner includes an air conditioning module configured to perform an air conditioning operation on a target space. the air conditioner includes a memory storing at least one instruction. the air conditioner includes at least one processor, comprising processing circuitry. at least one processor, individually and/or collectively, is configured to execute the at least one instruction to: detect a person in the target space using a sensor detection value of the detection sensor, and perform a power saving control operation to adjust at least one of wind strength or a set temperature of the air conditioning module, according to a power saving performing condition indicating a condition to perform a power saving control operation being satisfied, based on an absence time during which it is determined that a person is absent in the target space, and in the power saving control operation, set one power saving learning level from among a plurality of power saving learning levels, according to a performance history of a plurality of intermediate operation stages of the power saving control operation, adjust respective duration times of the plurality of intermediate operation stages, according to the set power saving learning level, and adjust at least one of the wind strength or the set temperature while the plurality of intermediate operation stages are being performed, according to the absence time.
Inventor(s): Dongil SEO of Suwon-si (KR) for samsung electronics co., ltd., Yongkwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongyoul PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyeonseok HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01J1/42, G06F1/16, G09G5/10, H04N23/88
CPC Code(s): G01J1/4204
Abstract: a clamshell-type electronic device is provided. the clamshell-type electronic device includes a housing of which a state is switchable between a folded state and an unfolded state and which includes a common hole, a main display disposed on a first surface of the housing and transformable depending on the state of the housing, a sub-display disposed on a second surface of the housing, a camera disposed in the housing and including a flash, an optical proximity sensor disposed in the housing and configured to sense light entering an inside of the housing, an optical sensor disposed in the housing and including a plurality of light receiving elements configured to sense light entering the inside of the housing, memory storing one or more computer programs, and one or more processors communicatively coupled to the optical sensor and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the clamshell-type electronic device to obtain at least one of ambient brightness information and ambient light source information based on light information received from the optical sensor.
Inventor(s): Donghun Heo of Suwon-si (KR) for samsung electronics co., ltd., Himchan Park of Suwon-si (KR) for samsung electronics co., ltd., Cheolhwan Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/26, G01R19/10, H01L27/06
CPC Code(s): G01R31/2608
Abstract: a semiconductor device may include a voltage generator configured to generate a first base-emitter voltage of a first bipolar junction transistor, and a failure detector configured to generate a failure signal by comparing the first base-emitter voltage with an upper limit reference voltage and a lower limit reference voltage. the failure detector may include a second bipolar junction transistor a current source configured to generate a bias current, a first resistor coupled between the current source and a emitter of the second bipolar junction transistor to generate the upper limit reference voltage, a second resistor and a third resistor configured to divide a second base-emitter voltage of the second bipolar junction transistor to generate the lower limit reference voltage, and a first and second comparator configured to compare the first base-emitter voltage with the upper limit reference voltage and the lower limit reference voltage, respectively, to generate respective failure signals.
20250085340. CIRCUIT FOR DETECTING DEFECTS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Takuya FAUTATSUYAMA of Suwon-si (KR) for samsung electronics co., ltd., Wandong Kim of Suwon-si (KR) for samsung electronics co., ltd., Kiwhan Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/28, H01L21/66
CPC Code(s): G01R31/2894
Abstract: a circuit for detecting defects includes a defect detection conductor provided in a peripheral region of a semiconductor die, an input pad connected to a first end of the defect detection conductor, an output pad connected to a second end of the defect detection conductor, a defect detection assembly connected to the defect detection conductor and configured to detect a defect of the defect detection conductor, and a controller configured to control operations of the defect detection assembly, where the defect detection assembly includes a reference voltage supply, a reference capacitor, a switching assembly, and a plurality of detection capacitors, and the switching assembly is configured to connect the reference capacitor to one of the reference voltage supply, a position adjacent to the input pad of the defect detection conductor, and a position adjacent to the output pad of the defect detection conductor.
Inventor(s): Henry Dennis FALK of Long Beach CA (US) for samsung electronics co., ltd., Di ZHOU of San Jose CA (US) for samsung electronics co., ltd., Mayank AMIN of Mountain View CA (US) for samsung electronics co., ltd., Norman LO of Milpitas CA (US) for samsung electronics co., ltd., John KIOLBASA of Cedar Rapids IA (US) for samsung electronics co., ltd., Sigang QIU of Sunnyvale CA (US) for samsung electronics co., ltd.
IPC Code(s): G01S19/29, G01S19/30, G01S19/37
CPC Code(s): G01S19/29
Abstract: a method and an apparatus are provided in which data is loaded from a memory to an input sample memory (ism) of a user equipment (ue). the data corresponds to input from an l5 antenna of the ue. a first high-resolution correlation (hrc) engine of the ue performs coherent correlation and accumulation on the data for at least one code-frequency offset combination, to generate coherent correlation results. a second hrc engine of the ue processes the coherent correlation results by at least performing frequency widening and non-coherent accumulation to generate non-coherent correlation results indicating at least peak accumulations of correlations.
Inventor(s): Chansoo Kang of Suwon-si (KR) for samsung electronics co., ltd., Daewon Kang of Suwon-si (KR) for samsung electronics co., ltd., Minju Kim of Suwon-si (KR) for samsung electronics co., ltd., Tae-Hyun Kim of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Sang Ki Nam of Suwon-si (KR) for samsung electronics co., ltd., Dougyong Sung of Suwon-si (KR) for samsung electronics co., ltd., Jungmo Yang of Suwon-si (KR) for samsung electronics co., ltd., Sejin Oh of Suwon-si (KR) for samsung electronics co., ltd., Keonhee Lim of Suwon-si (KR) for samsung electronics co., ltd., Junho Im of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01T1/36, G01T1/20, H01L21/67
CPC Code(s): G01T1/362
Abstract: a substrate processing apparatus includes a process chamber providing a process space, a stage located in the process chamber and configured to support a substrate, a window coupled to a side of the process chamber, and a scintillator layer coupled to one side surface of the window. the scintillator layer covers a portion of the one side surface of the window which is less than the full window surface. a second surface corresponding to another portion of the one side surface of the window is exposed. light emitted by a plasma in the process space passes through the window and is collected by an optical system and analyzed. ultraviolet light passing through the scintillator is converted to longer wavelength, generally visible, light. comparing the light passing through the bare window with the light passing through the scintillator layer enables analysis of the plasma.
Inventor(s): Kyuhwan CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon HAN of Suwon-si (KR) for samsung electronics co., ltd., Changgyun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jaeduck JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00
CPC Code(s): G03F7/70633
Abstract: a measurement optical system and an overlay measurement method using the same are provided. the measurement optical system includes: a light source configured to emit infrared light; a light splitter configured to reflect, from the light source and to a subject, a first portion of the infrared light incident to the light splitter; a photodetector on a same optical axis as the light splitter and configured to receive a second portion of the infrared light reflected from the subject; a first lens optical system between the light splitter and the photodetector; and a second lens optical system between the first lens optical system and the photodetector, wherein the subject may include an alignment key on which a meta key is provided.
Inventor(s): Seungwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunsu KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G06F3/01
CPC Code(s): G06F1/163
Abstract: according to an embodiment, a first wearable device includes at least one sensor, a communication circuit, and a processor operably coupled to the at least one sensor and the communication circuit. the processor is configured to obtain, using the at least one sensor, first information on orientation of the first wearable device worn on a first part of a body of a user. the processor is configured to receive, from a second wearable device connected to the first wearable device and worn on a second part of the body of the user, second information on orientation of the second wearable device. based on the first information and the second information, the processor is configured to provide a notification to guide changing at least one of a position or a direction of the second wearable device on the second part.
Inventor(s): Daechan JANG of Suwon-si (KR) for samsung electronics co., ltd., Kihwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Harksang KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Dasom LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G02B27/01
CPC Code(s): G06F3/011
Abstract: a wearable device includes memory storing instructions, a sensor, a communication circuit, and at least one processor. the instructions, when executed by the at least one processor, cause the wearable device to receive first sensor information of a first external electronic device and second sensor information of a second external electronic device; obtain a first similarity value and a second similarity value; identify a compensated movement value based on the value representing the movement of the wearable device and the first sensor information; identify a compensated movement value based on the value representing the movement of the wearable device and the second sensor information; and display a screen according to the compensated movement value.
Inventor(s): Javier GONZALEZ of Solrød Strand (DK) for samsung electronics co., ltd., Arun GEORGE of Bengaluru (IN) for samsung electronics co., ltd., Michael Scott ALLISON of Longmont CO (US) for samsung electronics co., ltd., Daniel Lee HELMICK of Thornton CO (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0611
Abstract: a system is disclosed. the system may include a storage device and a processor. the processor may send a write request to the storage device. the write request may include a data to be written and a reclaim unit identifier identifying how the data is to be organized on the storage device. the processor may also send a message to the storage device regarding management of garbage collection of a reclaim unit identified by the reclaim unit identifier.
Inventor(s): Donggeon Kim of Suwon-si (KR) for samsung electronics co., ltd., Myeongsik Ryu of Suwon-si (KR) for samsung electronics co., ltd., Bokyeon Won of Suwon-si (KR) for samsung electronics co., ltd., Seokjae Lee of Suwon-si (KR) for samsung electronics co., ltd., Daehyeon Kwon of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Inseok Baek of Suwon-si (KR) for samsung electronics co., ltd., Selyung Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0611
Abstract: a bit-line sense amplifier includes an amplifying circuit, an isolation circuit, an offset cancellation circuit and an equalizer. the amplifying circuit is connected to a bit-line and a complementary bit-line, senses a voltage difference between the bit-line and the complementary bit-line based on a first control signal and a second control signal, and adjusts a voltage of a sensing bit-line and a complementary sensing bit-line based on the voltage difference. the equalizer is connected to the sensing bit-line, and equalizes the bit-line and the complementary bit-line to a precharge voltage, based on an equalizing signal. the equalizer includes an equalizing transistor that has a source, a gate configured to receive the equalizing signal, and a drain. the source of the equalizing transistor is connected to a wiring structure through a direct contact, and the wiring structure is configured to receive the precharge voltage.
Inventor(s): Marc Timothy Jones of Longmont CO (US) for samsung electronics co., ltd., Daniel Lee Helmick of Thornton CO (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F12/0815
CPC Code(s): G06F3/0616
Abstract: one or more embodiments of the present disclosure are directed to systems and methods for host and device cooperation. in some embodiments, a storage device comprises a first memory for storing data; a second memory configured with a cache coherent protocol; and a processing circuit coupled to the first memory and the second memory. the processing circuit is configured to: store, in the second memory, information for managing the storage device, wherein the information is shared with a computing device via the cache coherent protocol; receive a first value from the computing device, the first value associated with a first block of the first memory; and take an action with respect to the first block based on the first value, wherein the action is for managing the first memory.
Inventor(s): Taejin PARK of Suwon-si (KR) for samsung electronics co., ltd., Kirock KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0619
Abstract: a storage device includes nonvolatile memory including a plurality of memory blocks in any one of a user area, a reserved area, and an over-provisioning (op) area; and a storage controller configured to perform a bad block management operation on the plurality of memory blocks, wherein the storage controller is further configured to: based on a memory block in the user area being detected as a bad block, determine whether a number of bad blocks is greater than a maximum number of bad blocks, and based on the number of bad blocks being greater than the maximum number of bad blocks, decrease a capacity of the user area based on a use ratio of the user area and maintain an op capacity of the op area as it is.
Inventor(s): Mungyu BAE of Suwon-si (KR) for samsung electronics co., ltd., Sungho YOON of Suwon-si (KR) for samsung electronics co., ltd., Jisoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Younsung CHU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0631
Abstract: provided is a storage system. when a user registration request for a new user is received, the storage system is configured to allocate a user storage space for the new user in a plurality of storage devices, and, when a user activation request for the new user is received, the storage system is configured to generate user identification information regarding the new user, based on user credential information of the new user included in the user activation request, allocate a user area for the new user in the memory, and store the user identification information regarding the new user in the user area for the new user.
Inventor(s): SOOYOUNG JI of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/064
Abstract: disclosed is a method of operating an electronic device which includes a first storage device, a second storage device, and a host device. the method includes providing a first request indicating a memory operation of target data to the first storage device, providing a second request indicating a redirection of the memory operation to the second storage device based on the first request, performing the memory operation based on the second request, providing the first storage device with a first completion response indicating that the memory operation is performed, and providing a second completion response to the host device based on the first completion response. the first storage device stores first mapping information of a logical block address (lba) of the target data and a physical block address (pba) indicating a physical block of the second storage device, in which the target data are stored.
Inventor(s): TAEJIN PARK of Suwon-si (KR) for samsung electronics co., ltd., KIROCK KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0655
Abstract: in a method of operating a storage device including at least one boot logical unit (lu), a first request is received to check whether a boot code stored in the at least one boot lu is fragmented. a first response including first information is output in response to the first request. the first information indicates whether the boot code is fragmented. when it is determined based on the first information that the boot code is fragmented, a second request is received to perform a defragmentation on the boot code. the defragmentation is performed on the boot code in response to the second request so that the boot code has physical continuity.
Inventor(s): Stephanie AHN of Suwon-si (KR) for samsung electronics co., ltd., Myoungwoo NAM of Suwon-si (KR) for samsung electronics co., ltd., Eunyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongil SON of Suwon-si (KR) for samsung electronics co., ltd., Bona LEE of Suwon-si (KR) for samsung electronics co., ltd., Eunbin LEE of Suwon-si (KR) for samsung electronics co., ltd., Miyeoung CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G02B7/02
CPC Code(s): G06F3/1423
Abstract: a wearable device includes: at least one first sensor, a display, lens sets including at least one lens arranged with respect to the display, at least one actuator configured to adjust the lens sets, and at least one processor, comprising processing circuitry, individually and/or collectively, configured to: identify movements related to the wearable device through the at least one first sensor based on a screen provided through each of the lens sets being displayed on the display, identify whether a number of times of the movements identified during a reference time is greater than a first reference number of times, adjust a focus of each of the lens sets configured to provide the screen displayed on the display through the at least one actuator in response to the number of times being greater than the first reference number of times, and maintain the adjusted focus based on identifying that the number of times of the movements identified during the reference time being less than or equal to a second reference number of times greater than the first reference number of times, within a designated time interval after adjusting the focus of each of the lens sets.
Inventor(s): Chen CHEN of Nanjing (CN) for samsung electronics co., ltd., Wei ZHANG of Nanjing (CN) for samsung electronics co., ltd.
IPC Code(s): G06F9/451
CPC Code(s): G06F9/451
Abstract: a method for recording and playback including: recording an operation of a first device based on an operation recording instruction to obtain a user operation record; acquiring environment data of the first device; and performing user operations of the user operation record sequentially in a second device based on an operation playback instruction, where the performing the user operations of the user operation record includes, for one of the user operations: determining a corresponding target control in the second device based on the environment data of the first device and environment data of the second device, and performing a respective user operation based on the target control.
Inventor(s): Gang LI of Xi'an (CN) for samsung electronics co., ltd., Lei WANG of Xi'an (CN) for samsung electronics co., ltd., Chungwoo PARK of Xi'an (CN) for samsung electronics co., ltd., Minhyung KIM of Xi'an (CN) for samsung electronics co., ltd., Mindong ZHAO of Xi'an (CN) for samsung electronics co., ltd.
IPC Code(s): G06F9/455
CPC Code(s): G06F9/45558
Abstract: the present disclosure provides an inter-core communication method and apparatus, a computer equipment, and a computer-readable storage medium. the inter-core communication method comprising: transmitting, with respect to at least one interrupt pass-through core configured for an interrupt pass-through mode among a plurality of cores, a physical interrupt directly to a client without going through a hypervisor in response to the physical interrupt occurring, the hypervisor being a virtual machine manager, and performing communication between the plurality of cores using a fast interrupt request (fiq).
Inventor(s): Changhyeon CHAE of Suwon-si (KR) for samsung electronics co., ltd., Kyeonghwan JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jihun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jaeook KWON of Suwon-si (KR) for samsung electronics co., ltd., Jusun SONG of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Youngho CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/50, G06F11/34
CPC Code(s): G06F9/5016
Abstract: various embodiments of the present disclosure relate to a memory management method and apparatus which perform a memory return operation by dynamically setting a memory threshold value by additionally considering performance information of an electronic apparatus in addition to an amount of available memory. an electronic apparatus comprises: a memory that stores at least one instruction corresponding to at least one program; and at least one processor, comprising processing circuitry, electrically connected to the memory, wherein at least one processor, individually and/or collectively, is configured to execute the at least one instruction as a process, and to: acquire performance information of the electronic apparatus and an amount of available memory; determine a memory threshold value based on the performance information and the amount of available memory; update a memory threshold value to the determined memory threshold value; and based on the amount of available memory being less than the memory threshold value at a certain point in time, terminate a certain process.
Inventor(s): Hanju Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/50
CPC Code(s): G06F9/5055
Abstract: a method of operating an electronic system includes identifying a physical function provided by an input/output device and obtaining resource amount information of the input/output device; determining a resource allocation rule for each of a plurality of allocation unit groups of the input/output device based on the resource amount information; selecting one or more allocation unit groups among the plurality of allocation unit groups based on a required amount of resources and input/output properties of a virtual machine and the resource allocation rule determined for each of the allocation unit groups; generating one or more allocation units for the selected one or more allocation unit groups; and mapping the one or more allocation units to the virtual machine.
Inventor(s): Changhee Jung of Lafayette IN (US) for samsung electronics co., ltd., Yang Seok Ki of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F11/10, G06F9/30, G06F11/07
CPC Code(s): G06F11/1064
Abstract: a system, including: a code cache; and a memory controller connected to the code cache, and configured to: receive a read command to read requested data from a location in primary memory connected to the memory controller over a first interface; read first data stored in the location from the primary memory; read a code corresponding to the requested data associated with the read command from the code cache, or from secondary memory connected to the memory controller over a second interface different from the first interface; perform error detection and/or correction based on the first data and the code; select second data based on a result of the error detection and/or correction; and output the second data for the requested data.
Inventor(s): Changhee Jung of Lafayette IN (US) for samsung electronics co., ltd., Yang Seok Ki of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F11/10, G06F13/16
CPC Code(s): G06F11/1068
Abstract: provided is a method for memory recovery, the method including detecting, by a first memory controller, an error associated with a primary memory, receiving, by the first memory controller, information including a recovery code from an interface, and modifying, by the first memory controller, the error on the primary memory based on the information.
Inventor(s): Keunseo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaecheol LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangdo PARK of Suwon-si (KR) for samsung electronics co., ltd., Dokyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Minkyu YANG of Suwon-si (KR) for samsung electronics co., ltd., Young LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinsic JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/22
CPC Code(s): G06F11/2273
Abstract: a method for verifying reliability of a test for products performed by test equipment includes: receiving result images generated from preprocessing of result data of the test, the result data of the test including labels for a plurality of scale levels and the received result images including first result images belonging to a first scale level of the plurality of scale levels and second result images belonging to a second scale level of the plurality of scale levels; making a first determination, from the first result images, whether the first scale level is normal or abnormal; making a second determination, from the second result images, whether the second scale level is normal or abnormal; and determining that no error occurred in the test in response to both the first scale level and the second scale level being determined to be normal; or determining that an error occurred in the test in response to at least one scale level being determined to be abnormal.
Inventor(s): Seokgi HONG of Suwon-si (KR) for samsung electronics co., ltd., Seongnam KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/0223
Abstract: disclosed is a storage device configured to receive a read command or a write command from a host device, the storage device comprising, a non-volatile memory device configured to store data, and a storage controller configured to operate at least one virtual machine to control the non-volatile memory device, store a workload threshold of the at least one virtual machine according to settings received from the host device, and send an asynchronous event interrupt to the host device based on the workload threshold, wherein the storage controller is further configured to, store the workload threshold for the at least one virtual machine, monitor read commands or write commands received from the host device to count and update a workload, and determine whether to send the asynchronous event interrupt based on the workload and the workload threshold.
Inventor(s): Byungsue JUNG of Suwon-si (KR) for samsung electronics co., ltd., Kyungduk LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02, H01L23/00, H01L25/065, H01L25/18, H10B41/27, H10B43/27, H10B80/00
CPC Code(s): G06F12/0246
Abstract: a memory device, which receives a vehicle status mode command from a host and executes background jobs based on the received vehicle status mode command, includes a command executor configured to generate a command on the background jobs based on the received vehicle status mode command, a scheduler configured to receive the command on the background jobs, determine whether a vehicle status is a status in which the background jobs are able to be executed, and generate the background jobs based on a determination result, and a background job executor configured to execute the background jobs generated by the scheduler.
Inventor(s): Nam Wook KANG of Suwon-si (KR) for samsung electronics co., ltd., Youngjo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02, G06F13/16
CPC Code(s): G06F12/0292
Abstract: a storage device and an electronic system including the same semiconductor device are provided. the storage device includes a non-volatile memory device configured to store data in a data area and metadata corresponding to the data in a spare area distinguished from the data area, and a memory controller configured to perform a translation operation of translating a logical address received from an outside to a physical group address, receive first and second metadata different from each other from the non-volatile memory based on the physical group address, and perform an index check operation of selecting a piece of metadata corresponding to the logical address from the first and second metadata.
Inventor(s): Chonghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Minkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokha SHIN of Suwon-si (KR) for samsung electronics co., ltd., Youngjin JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/0862, G06F12/0804, G06F12/123
CPC Code(s): G06F12/0862
Abstract: an operating method of a storage controller includes, storing data and a source type of the data in a cache memory, when a cache hit occurs, determining a source type of data corresponding to the cache hit and updating a hit count corresponding to the determined source type among a plurality of hit counts, determining a source type with a dominant hit rate among a plurality of source types based on the plurality of hit counts, operating in a first mode when a result of the determining indicates that the source type with the dominant hit rate is a first type, and operating in a second mode when the result of the determining indicates that the source type with the dominant hit rate is a second type.
20250086121. SECURITY-ENHANCED STORAGE DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunjoon YOO of Suwon-si (KR) for samsung electronics co., ltd., Youngsik Moon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/14, H04L9/14
CPC Code(s): G06F12/1408
Abstract: provided is a storage device with enhanced security. the storage device includes: a security pad; a non-volatile memory device; and a storage controller including a sensing pin connected to the security pad. the storage controller is configured to: classify data corresponding to an input/output request for the non-volatile memory device as hot data or cold data, based on an access frequency with respect to the data; encrypt write data to be stored in the non-volatile memory device; and perform a data protection operation of encrypting the hot data, based on a signal change at the sensing pin according to a change in electrical contact of a physical sensing structure, the physical sensing structure including the security pad and a locking structure. a locking structure in electrical contact with a security pad extends through a through hole defined in the substrate.
Inventor(s): Marc Timothy Jones of Longmont CO (US) for samsung electronics co., ltd., Daniel Lee Helmick of Thornton CO (US) for samsung electronics co., ltd.
IPC Code(s): G06F13/16, G06F13/12, G06F13/40
CPC Code(s): G06F13/1642
Abstract: systems and methods for moving data between a storage device and a processing element are disclosed. the storage device may include: a non-volatile storage medium; a first interface for communicating with a computing device; and a second interface for communicating with a processing element over a data communications network. the processing element may include a processing circuit that is configured to: receive a first request from the computing device via the first interface, where the first request identifies a first memory address associated with the first memory; retrieve first data from the non-volatile storage medium based on the first request; and transmit the first data to the processing element via the second interface for storing the first data in the first memory based on the first memory address.
Inventor(s): Hang-kyu KIM of Seongnam-si (KR) for samsung electronics co., ltd., Chi-hyun PARK of Seoul (KR) for samsung electronics co., ltd., Hae-dong YEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F16/9537, H04W4/029
CPC Code(s): G06F16/9537
Abstract: a method for providing user-customized information is disclosed. the method for providing user-customized information can provide information suitable for a user's situation by: obtaining information on a location where a terminal is located, and information on the time when the location information was obtained; obtaining situation information of a user of the terminal predicted on the basis of the location information and the time information; and requesting, to a server, situation-adaptive information corresponding to the user's situation on the basis of the obtained situation information of the user, pre-stored profile information of the user, and state information of the terminal at a time when the location information is obtained so as to obtain the situation-adaptive information from the server.
Inventor(s): Junsoo HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F17/14
CPC Code(s): G06F17/14
Abstract: disclosed is a method and an apparatus for restoring a damaged signal data including: obtaining a transition matrix by performing a dimensionality reduction analysis with respect to a dataset of an intact signal data within a time series dataset and restoring the damaged signal data in the time series dataset by using the transition matrix.
Inventor(s): Ji Hyun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jung Sic SUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Chul Hwan LEE of Seoul (KR) for samsung electronics co., ltd., Jeong Hun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Ji Hea PARK of Seoul (KR) for samsung electronics co., ltd., Se Jun SONG of Seoul (KR) for samsung electronics co., ltd., Yo Han LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Young Keun CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06F40/106, G06F16/957
CPC Code(s): G06F40/106
Abstract: a method is provided including: displaying a first content; detecting, by an electronic device, an output condition; and in response to the output condition, outputting, by the electronic device, a second content that that is associated with the first content. furthermore, an electronic device is provided including: a memory configured to store content; and a processor configured to: display a first content; detect, by an electronic device, an output condition; and in response to the output condition, output a second content that that is associated with the first content.
Inventor(s): Kijung YOON of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/0455, G06N3/0985
CPC Code(s): G06N3/0455
Abstract: a method and apparatus for graph processing using a neural network model are provided. the method includes generating messages based on node states of nodes of input graph data using a neural message generating model, generating aggregated messages by aggregating the messages based on the nodes, updating the node states of the nodes by executing different neural update models, and outputting a task result with respect to the input graph data based on the updated node states.
Inventor(s): Yoo Jin Choi of San Diego CA (US) for samsung electronics co., ltd., Mostafa El-Khamy of San Diego CA (US) for samsung electronics co., ltd., Jungwon Lee of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G06N3/08, G06F17/18, G06F18/2113, G06F18/214, G06F18/22, G06N3/045, G06N7/01
CPC Code(s): G06N3/08
Abstract: a method for training a generator, by a generator training system including a processor and memory, includes: extracting training statistical characteristics from a batch normalization layer of a pre-trained model, the training statistical characteristics including a training mean � and a training variance �; initializing a generator configured with generator parameters; generating a batch of synthetic data using the generator; supplying the batch of synthetic data to the pre-trained model; measuring statistical characteristics of activations at the batch normalization layer and at the output of the pre-trained model in response to the batch of synthetic data, the statistical characteristics including a measured mean, and {circumflex over (�)} measured variance {circumflex over (�)}; computing a training loss in accordance with a loss function l based on �, �, {circumflex over (�)}, and {circumflex over (�)}; and iteratively updating the generator parameters in accordance with the training loss until a training completion condition is met to compute the generator.
Inventor(s): Nayeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sujin JANG of Suwon-si (KR) for samsung electronics co., ltd., Dae Ung JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/09
CPC Code(s): G06N3/09
Abstract: a learning method of generating a vector map and a method and apparatus for generating a vector map are disclosed. the learning method includes converting a first feature extracted by inputting a first modality sensed by a first sensor to a student model into a first feature vector in a bird eye view (bev) space, converting a second feature extracted by inputting a multi-modality including the first modality and a second modality sensed by a second sensor to a teacher model into a second feature vector in the bev space, and learning the student model to generate a vector map corresponding to the first modality by back-propagating cross-correlation loss by dimension that causes the first feature vector to replicate a cross-correlation with the second feature vector to the student model.
Inventor(s): Youngmin OH of Suwon-si (KR) for samsung electronics co., ltd., Hyung-dal KWON of Suwon-si (KR) for samsung electronics co., ltd., Bosun HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/126, G06N3/092
CPC Code(s): G06N3/126
Abstract: a method for performing a genetic algorithm is performed by one or more processors, and the method includes: generating a subset of elements by using a neural network from a population including elements that each correspond to a respective solution to a problem; generating child elements by performing a genetic algorithm on the subset; and determining that one of the child elements, from among the child elements is an answer to the problem.
Inventor(s): Hyung-Dal KWON of Suwon-si (KR) for samsung electronics co., ltd., Youngmin OH of Suwon-si (KR) for samsung electronics co., ltd., Doyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Yoonhyeok LEE of Suwon-si (KR) for samsung electronics co., ltd., Bosun HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/126, G06N3/0985
CPC Code(s): G06N3/126
Abstract: a method is performed by one or more processors, and the method includes: receiving a problem definition for which an optimized solution is to be determined; executing a genetic algorithm to determine the optimized solution, the executing the genetic algorithm including iteratively performing, according to changing values of a control parameter, a genetic operation on a population of elements while evaluating elements of the population against the problem definition, the control parameter being a hyperparameter of the genetic operations; based on results of the respective iterations of the genetic operation to a neural network, generating, by a neural network, the values of the control parameter; and determining the optimized solution based on the iterations of the genetic operation as controlled, via the values of the control parameter, by the neural network.
Inventor(s): Hyunwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Honghee Gil of Suwon-si (KR) for samsung electronics co., ltd., Jinho Mun of Suwon-si (KR) for samsung electronics co., ltd., Mihwa ` Park of Suwon-si (KR) for samsung electronics co., ltd., Sungdeuk Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N20/00, G06F11/30, G06F11/34
CPC Code(s): G06N20/00
Abstract: a server includes: a communication interface configured to communicate with an external electronic device; at least one processor; and memory storing instructions that, when executed by the at least one processor, cause the server to: acquire one or more first performance levels of a first model of the external electronic device operatively connected to the server via the communication interface; train a second model based on determining the one or more first performance levels have declined; generate difference information based on differences between one or more second performance levels of the second model and the one or more first performance levels of the first model; transmit, to the external electronic device, the difference information via the communication interface; and transmit, to the external electronic device, the second model based on receiving, from the external electronic device, a first signal indicating that the second model is requested.
Inventor(s): Moongyu JUNG of Suwon-si (KR) for samsung electronics co., ltd., Wooyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinha HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06T3/40, G06V10/74
CPC Code(s): G06T7/0002
Abstract: an electronic device includes at least one memory, a camera, and at least one processor, wherein the at least one processor is configured to: obtain raw image for an external object from the camera in a secure environment and store the obtained raw image in the at least one memory, to obtain first image from the raw image through first image processing and second image processing on the stored raw image in the secure environment, based on obtaining of a verification request from a normal environment: to obtain, in the secure environment, second image obtained from the raw image through the second image processing for the stored raw image in the normal environment, to obtain third image from the second image through the first image processing for the obtained second image in the secure environment, and to identify integrity of the second image based on the obtained first image and the obtained third image.
20250086812. ALIGNING IMAGE DATA AND MAP DATA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kazim Selim Engin of Weehawken NJ (US) for samsung electronics co., ltd., Jun-Jee Chao of Minneapolis MN (US) for samsung electronics co., ltd., Ibrahim Volkan Isler of Saint Paul MN (US) for samsung electronics co., ltd., Nikhil Narsingh Chavan-Dafle of Jersey City NJ (US) for samsung electronics co., ltd., Bhoram Lee of Princeton NJ (US) for samsung electronics co., ltd.
IPC Code(s): G06T7/33, G06T5/77, G06T7/13, G06T7/70, G06T15/20, G06V20/64
CPC Code(s): G06T7/33
Abstract: a method of generating a composite map from image data and spatial map data may include: acquiring a spatial map of an environment; acquiring a plurality of images of a portion of the environment; generating a three-dimensional (3d) image of the portion of the environment using the plurality of images; identifying a floor in the 3d image; generating a synthetic spatial map of the portion of the environment based on the floor in the 3d image; determining a location of the portion of the environment within the spatial map by identifying a region of the spatial map that corresponds to the synthetic spatial map; and generating a composite map by associating the 3d image with the location within the spatial map of the portion of the environment.
Inventor(s): Heewon Park of Suwon-si (KR) for samsung electronics co., ltd., Nakju DOH of Seoul (KR) for samsung electronics co., ltd., Gunhee Koo of Seoul (KR) for samsung electronics co., ltd., Joo Hyung KIM of Seoul (KR) for samsung electronics co., ltd., Jahoo KOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/73, G06T7/536, G06V20/58, G06V20/62, G06V30/18, G06V30/19
CPC Code(s): G06T7/73
Abstract: a processor-implemented method including detecting pieces of text from an image, determining vanishing points of the image, and estimating an orientation of the image based on the determined vanishing points, the detected pieces of text, and a key text graph representing a connection between nodes corresponding to pieces of key text.
Inventor(s): Zhihua LIU of Beijing (CN) for samsung electronics co., ltd., Xiongfeng PENG of Beijing (CN) for samsung electronics co., ltd., Zhitong YE of Beijing (CN) for samsung electronics co., ltd., Qiang WANG of Beijing (CN) for samsung electronics co., ltd., SoonYong CHO of Suwon-si (KR) for samsung electronics co., ltd., Young Hun SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/73, G06T15/20, G06V10/40, G06V10/82, G06V20/40
CPC Code(s): G06T7/75
Abstract: a method performed by an electronic device, the electronic device, and a storage medium are provided. the method includes obtaining a frame image of a video from a camera and inertia data of an inertial measurement unit (imu) corresponding to the frame image and obtaining a camera position and pose of the camera, a sparse map, and a high-density map corresponding to the frame image, based on the frame image and the inertia data of the imu.
Inventor(s): Kiwon YOO of Suwon-si (KR) for samsung electronics co., ltd., Kumran JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T9/00
CPC Code(s): G06T9/002
Abstract: an electronic device that processes an image by using artificial intelligence (ai) encoding that obtains a second image including luminance information based on a first image including pixel information, inputs the second image into the first neural network model and obtain a first residual image including luminance residual information, obtain a second residual image including pixel residual information based on the first residual image, obtains an ai-encoded image based on the first image and the second residual image, and transmits a compressed image obtained by encoding the ai-encoded image.
Inventor(s): Lakshmi Priya MURALEEDHARAN of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06T15/08
CPC Code(s): G06T15/08
Abstract: provided is a method for object placement in an xr environment by a xr apparatus. the method includes determining a voxel occupancy of a first position of a first object available in a virtual scene; receiving a user input including a second position for placing a second object in the virtual scene; determining a voxel occupancy for the second object for placing the second object in the second position; determining a voxel space in-between the first position of the first object and the second position of the second object based on the voxel occupancy of the first object and the voxel occupancy of the second object; and displaying at least one recommendation to place the second object in the virtual scene based on the voxel space in-between the first position of the first object and the second position of the second object.
Inventor(s): Raghavan VELAPPAN of Bengaluru (IN) for samsung electronics co., ltd., Abhishek CHANDEL of Bengaluru (IN) for samsung electronics co., ltd., Lokesh Rayasandra BOREGOWDA of Bengaluru (IN) for samsung electronics co., ltd., Lakshmi Priya MURALEEDHARAN of Kozhikode (IN) for samsung electronics co., ltd., Pankaj BANSAL of Bengaluru (IN) for samsung electronics co., ltd., S KRITHIHA of Bengaluru (IN) for samsung electronics co., ltd., Gyanendu SHEKHAR of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06T19/00
CPC Code(s): G06T19/006
Abstract: a method for contextual based enhancement of an extended reality (xr) scene by an electronic device is provided. the method includes detecting at least one static object and at least one dynamic object in an xr scene, determining context information of the at least one dynamic object, determining whether a correlation between the context information of the dynamic object and the contextual meta information corresponding to the dynamic object is available in a contextual database, and applying the contextual meta information from the contextual database to the at least one dynamic object.
Inventor(s): Haeun YOON of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Sanghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyungsok YEO of Suwon-si (KR) for samsung electronics co., ltd., Seonho HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/20, G06F3/01, G06T7/70, G06T17/20, H04N23/61
CPC Code(s): G06T19/20
Abstract: a processor of a head-mounted display (hmd) device according to an embodiment controls a camera to obtain a first image of the outside of the hmd device. the processor detects a portion of the first image corresponding to an external hmd device. the processor receives information with respect to a body part covered by the external hmd device from the external hmd device through a communication circuit. the processor obtains a second image representing the body part by performing rendering on the body part based on the information. the processor displays the second image positioned in the portion of the first image and a composite image including the first image through at least one display.
Inventor(s): Jong-Ok Kim of Seoul (KR) for samsung electronics co., ltd., Dong-Keun Han of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06V10/60, G06V10/77, G06V10/82
CPC Code(s): G06V10/60
Abstract: a method and apparatus with neural network based image processing are provided. the method includes: accessing an input image set including a visible light image of a visible light wavelength band corresponding to an input image and an infrared image of an infrared wavelength band corresponding to the input image; estimating an illumination map representing an illumination configuration of the input image based on a first input image set of the input image set; estimating a confidence score map of the input image based on spectral information of a second input image set of the input image set; and determining illuminant information of the input image by combining the illumination map and the confidence score map.
Inventor(s): Jingbiao NAN of Xi'an (CN) for samsung electronics co., ltd., Yohan KIM of Xi'an (CN) for samsung electronics co., ltd., Yi GUO of Xi'an (CN) for samsung electronics co., ltd.
IPC Code(s): G06V10/75, G06T7/60, G06T7/73, G06V10/77
CPC Code(s): G06V10/751
Abstract: a recognition system and a recognition method are provided. the recognition system includes: an image acquisition module configured to acquire an original image of a target object; an information acquisition module configured to acquire positioning information of the target object; and an image recognition module configured to extract a target region in the original image, and to recognize the target object based on the extracted target region.
Inventor(s): Xiaoshuai HAO of Beijing (KR) for samsung electronics co., ltd., Yi ZHOU of Beijing (KR) for samsung electronics co., ltd., Byung In YOO of Suwon-si (KR) for samsung electronics co., ltd., Hui ZHANG of Beijing (KR) for samsung electronics co., ltd., Seungin PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangil JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V10/80, G01S17/86, G01S17/89, G06V10/44
CPC Code(s): G06V10/806
Abstract: an image processing method is provided. the method includes obtaining a first bird's eye view (bev) feature of first data, obtaining a second bev feature of second data, inputting the first bev feature and the second bev feature to a self-attention network to obtain a third bev feature of the first data and a fourth bev feature of the second data, and obtaining a fusion feature in which the third bev feature and the fourth bev feature are fused, wherein the first data and the second data are collected by different sensors. related operations of the examples provided by the present disclosure are implemented by an ai model. ai-related functions are performed by non-volatile memory, volatile memory, and a processor.
Inventor(s): Subin HAN of Suwon-si (KR) for samsung electronics co., ltd., Seungwan JEON of Suwon-si (KR) for samsung electronics co., ltd., Sara LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Yitae KIM of Suwon-si (KR) for samsung electronics co., ltd., Heeshin KIM of Suwon-si (KR) for samsung electronics co., ltd., Kichrl PARK of Suwon-si (KR) for samsung electronics co., ltd., Yugyung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V10/98, H04N9/64, H04N25/611
CPC Code(s): G06V10/993
Abstract: a method for evaluating performance of an image signal processor according to various example embodiments includes: selecting at least two target colors from an original image generated by the image signal processor; defining a true color range in each of the target colors and identifying at least one false color pixel having a color deviating from the true color range in the original image; generating a reference image by changing a color of the false color pixel; and calculating a color error between the original image and the reference image.
Inventor(s): Wooyong LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Seunghyup BAIK of Gyeonggi-do (KR) for samsung electronics co., ltd., Chanmin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyejin KANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Jungeun LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06V20/20, G06T13/40, G06V20/64, G06V40/16
CPC Code(s): G06V20/20
Abstract: an electronic device according to an embodiment may include: a camera module; a display; and a processor, wherein the processor may be configured to: obtain a preview image corresponding to an external object using the camera module; determine attributes of the external object, based on the obtained preview image; synthesize the preview image with a virtual character image, based on the attributes of the external object; and output the synthesized preview image through the display. other embodiments may be provided.
Inventor(s): Li Zhu of Saratoga CA (US) for samsung electronics co., ltd., Qijia Shao of New York NY (US) for samsung electronics co., ltd., Mohsin Ahmed of Sunnyvale CA (US) for samsung electronics co., ltd., Korosh Vatanparvar of San Jose CA (US) for samsung electronics co., ltd., Migyeong Gwak of Santa Clara CA (US) for samsung electronics co., ltd., Nafiul Rashid of San Jose CA (US) for samsung electronics co., ltd., Jungmok Bae of Menlo Park CA (US) for samsung electronics co., ltd., Jilong Kuang of San Jose CA (US) for samsung electronics co., ltd., Jun Gao of Menlo Park CA (US) for samsung electronics co., ltd.
IPC Code(s): G06V40/10, A61B5/1455, G06V10/56, G06V10/764, G06V10/774, G06V20/40, H04N23/611, H04N23/71, H04N23/72, H04N23/74, H04N23/84
CPC Code(s): G06V40/15
Abstract: in one embodiment, a method includes recording, by a camera of a client device, a video of a region of a first user's skin and estimating, from the recorded video, a current ratio of ratios (ror) for the first user corresponding to the first user's current blood-oxygen saturation. the method further includes converting the first user's determined ror to a transformed ror for the first user based at least in part on a baseline user's ror determined while generating a trained spo2 prediction model. the trained spo2 prediction model is trained to estimate the baseline user's spo2 value based on an input ror value from the baseline user. the method further includes determining, by the trained spo2 prediction model and based on the transformed ror for the first user, the first user's current estimated blood-oxygen saturation.
Inventor(s): Heejun YOU of Suwon-si (KR) for samsung electronics co., ltd., Minsoo SHIN of Suwon-si (KR) for samsung electronics co., ltd., Wonjung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V40/16, G06V10/141, G06V10/20, H04N23/611, H04N23/80
CPC Code(s): G06V40/16
Abstract: an electronic device may comprise: an image sensor, an image pre-processor comprising circuitry, memory storing instructions, and at least one processor comprising processing circuitry. the instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to: obtain raw data including biometric data using the image sensor. the instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to store, in a first buffer, the raw data as first image data. the instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to store, in a second buffer, second image data generated by applying a change operation to the raw data using the image pre-processor. the instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to forward the first image data stored in the first buffer to a first application included in a secure area and apply a first algorithm for biometric authentication to the first image data. the instructions, when executed by at least one processor, individually and/or collectively, may cause the electronic device to forward the second image data stored in the second buffer to a second application included in a non-secure area and apply a second algorithm different from the first algorithm to the second image data. other various embodiments are also available.
Inventor(s): Mostafa EL-KHAMY of San Diego CA (US) for samsung electronics co., ltd., Soheil HOR of Sunnyvale CA (US) for samsung electronics co., ltd., Yanlin ZHOU of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G06V40/20
CPC Code(s): G06V40/20
Abstract: a system and a method for performing gesture recognition are disclosed, the method comprising detecting a gesture using a primary modality; evaluating an expected accuracy gain (eag) to identify a modality that yields a maximum relative eag among the primary modality and one or more secondary modalities; and activating the one or more secondary modalities for detecting the gesture if the one or more secondary modalities correspond to the modality that yields the maximum relative eag.
Inventor(s): Byuksun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G08C17/02, G08C23/04
CPC Code(s): G08C17/02
Abstract: an electronic device including a connection unit; and a processor configured to identify that a first external device is physically connected to the electronic device through the connection unit, identify connection information about the first external device, the identified connection information including device information about the first external device, image information from the first external device, and information about a connection environment of the first external device, determine whether the first external device is a controllable device based on the identified connection information about the first external device and at least one machine learning model for identifying a plurality of external devices, identify at least one control scheme of the first external device in response to determining that the first external device is a controllable device, and determine a control scheme of the identified at least one control scheme as a priority control scheme.
Inventor(s): Yoonjae Lee of Suwon-si (KR) for samsung electronics co., ltd., Yeji Shin of Suwon-si (KR) for samsung electronics co., ltd., Sang-Wan Nam of Suwon-si (KR) for samsung electronics co., ltd., Sang-Won Shim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/10
CPC Code(s): G11C7/1096
Abstract: disclosed is a memory device which includes a memory cell array that includes a plurality of memory cells, and a peripheral circuit configured to perform a plurality of operations on the memory cell array by using a plurality of operating voltages. the peripheral circuit includes a voltage generating circuit including a first pump block, a second pump block, and a common pump block. the voltage generating circuit connects the first pump block and the common pump block in parallel to generate a first operating voltage among the plurality of operating voltages and connects the common pump block and the second pump block in series to generate a second operating voltage among the plurality of operating voltages. the common pump block is configurable to match the first pump block, the second pump block, or both, as needed.
Inventor(s): Seongjin Kim of Suwon-si (KR) for samsung electronics co., ltd., Jayang Yoon of Suwon-si (KR) for samsung electronics co., ltd., Chiweon Yoon of Seoul (KR) for samsung electronics co., ltd., Cheonan Lee of Yongin-si (KR) for samsung electronics co., ltd., Kichang Jang of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4099, G11C11/4074, G11C11/408
CPC Code(s): G11C11/4099
Abstract: according to the present disclosure, a nonvolatile memory device may include an operational amplifier comparing a reference voltage with a voltage of a feedback node; a first feedback network circuit generating a first output voltage by dividing an input voltage in response to an output voltage of the operational amplifier, and transmitting a voltage corresponding to the first output voltage to the feedback node in response to a first feedback signal, a second feedback network circuit generating a second output voltage by dividing the input voltage in response to the output voltage of the operational amplifier, and transmitting a voltage corresponding to the second output voltage to the feedback node in response to a second feedback signal, and a third feedback network circuit generating a third output voltage by dividing the input voltage in response to the output voltage of the operational amplifier, and transmitting a voltage corresponding to the third output voltage to the feedback node in response to a third feedback signal.
Inventor(s): Yun Heub Song of Seoul (KR) for samsung electronics co., ltd., Sun Jun Choi of Seoul (KR) for samsung electronics co., ltd., Jea Min Shim of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/10, G11C16/04, G11C16/08
CPC Code(s): G11C16/102
Abstract: disclosed is a method for operating ferroelectric-based three-dimensional flash memory including a data storage pattern. according to one embodiment, a program operation method of three-dimensional flash memory may comprise the steps of: adjusting the value of a program voltage to be applied to a selected word line corresponding to a target memory cell that is the target of a program operation among word lines on the basis of the slope at which a voltage pulse increases in an incremental step pulse programming (ispp) method; applying the adjusted value of the program voltage to the selected word line; applying a pass voltage to each of the non-selected word lines excluding the selected word line among the word lines; and performing a program operation on the target memory cell in response to the adjusted value of the program voltage being applied to the selected word line and the pass voltage being applied to each of the non-selected word lines.
Inventor(s): JINSEONG YUN of Suwon-si (KR) for samsung electronics co., ltd., Daehyun KWON of Suwon-si (KR) for samsung electronics co., ltd., KI-HEUNG KIM of Suwon-si (KR) for samsung electronics co., ltd., JONGHOON KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunghak LEE of Suwon-si (KR) for samsung electronics co., ltd., CHANG-YONG LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/56
CPC Code(s): G11C29/56016
Abstract: a memory module includes: a circuit board including a plurality of signal lines to which a command is applied; and a first memory device mounted on a first surface of the circuit board, connected to the plurality of signal lines, including a first mode register, and configured to: operate in a standard mode or a mirrored mode, based on a value set in the first mode register, set a value corresponding to the mirrored mode in the first mode register, based on a first command applied to the plurality of signal lines, wherein at least one bit of a plurality of command/address bits in the first command is swapped with at least one bit of a plurality of command/address bits in a second command.
Inventor(s): Md Mahbubur Rahman of Santa Clara CA (US) for samsung electronics co., ltd., David Lin of El Cerrito CA (US) for samsung electronics co., ltd., Li Zhu of Saratoga CA (US) for samsung electronics co., ltd., Viswam Nathan of Clovis CA (US) for samsung electronics co., ltd., Larry Zhang of San Jose CA (US) for samsung electronics co., ltd., Ramesh Sah of Mountain View CA (US) for samsung electronics co., ltd., Mehrab Bin Morshed of Gilroy CA (US) for samsung electronics co., ltd., Jungmok Bae of Menlo Park CA (US) for samsung electronics co., ltd., Jilong Kuang of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G16H50/30, A61B5/0205, A61B5/024, A61B5/11
CPC Code(s): G16H50/30
Abstract: in one embodiment, a method includes accessing a window of motion data collected by a motion sensor of a device worn by a user and selecting motion data in the window about or more particular axes of the motion sensor. the method further includes determining a ballistocardiogram (bcg) signal in the selected motion data and determining whether the bcg signal in the selected motion data satisfies a signal-quality metric. if the bcg signal in the selected motion data satisfies the signal-quality metric, then the method includes (1) determining one or more heart-beat metrics of the user from the selected motion data; and (2) estimating, based on the one or more determined heart-beat metrics, a stress condition of the user at a time coincident with the window of motion data.
20250087464. FOCUS RING ALIGNMENT APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaehyun SOH of Suwon-si (KR) for samsung electronics co., ltd., Wookhyeon KWON of Suwon-si (KR) for samsung electronics co., ltd., Chulwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongkyu SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hoontaek LEE of Suwon-si (KR) for samsung electronics co., ltd., Minnhoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yongwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hansol KIM of Suwon-si (KR) for samsung electronics co., ltd., Deukho LEE of Suwon-si (KR) for samsung electronics co., ltd., Junghyun CHO of Suwon-si (KR) for samsung electronics co., ltd., Yangyeon CHU of Suwon-si (KR) for samsung electronics co., ltd., Uzun KAAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32642
Abstract: an embodiment provides a focus ring alignment apparatus including a frame, a sensing member that is connected to the frame and is configured to acquire images of a focus ring within in a substrate processing apparatus, and an alignment module that is connected to the frame and is configured to move the focus ring to change a position of the focus ring.
Inventor(s): Hyungsik Ko of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/67, H01L21/683
CPC Code(s): H01J37/32642
Abstract: provided is a substrate processing apparatus including a chamber, an electrostatic chuck (esc) in the chamber and configured to support a substrate, a shower head in the chamber and on the electrostatic chuck, and a ring assembly for a semiconductor process in the chamber and surrounding the electrostatic chuck, wherein the ring assembly for the semiconductor process includes a focus ring having a central axis extending in a first direction, an outer ring surrounding the focus ring, and a top ring on a top surface of the outer ring.
Inventor(s): Jitae Park of Suwon-si (KR) for samsung electronics co., ltd., Kwangho Lee of Suwon-si (KR) for samsung electronics co., ltd., Seongjin In of Suwon-si (KR) for samsung electronics co., ltd., Keonhee Lim of Suwon-si (KR) for samsung electronics co., ltd., Yoonjae Kim of Suwon-si (KR) for samsung electronics co., ltd., Ilwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangki Nam of Suwon-si (KR) for samsung electronics co., ltd., Sejin Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, G01J3/443, G05B19/4099, H01J37/32
CPC Code(s): H01L21/67253
Abstract: a semiconductor process device includes a housing including a chamber where a substrate is processed, a viewport in a side wall of the housing, an adapter configured to receive reflected light in which light generated from plasma generated inside the chamber is reflected at a target position on a surface of a structure provided on an upper surface of the substrate, a polarization beam splitter configured to separate the reflected light received from the adapter into p-polarized light and s-polarized light, a spectroscope configured to analyze spectra of the p-polarized light and the s-polarized light, and a control unit configured to monitor a thickness of the structure based on luminous intensity over time at one or more wavelengths of each of the p-polarized light and the s-polarized light, based on results of analyzing the spectra.
20250087531. SEMICONDUCTOR CHIP STRUCTURE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangjun Park of Yongin-si (KR) for samsung electronics co., ltd., Byungkyu Kim of Seoul (KR) for samsung electronics co., ltd., Eunji Kim of Seoul (KR) for samsung electronics co., ltd., Seungwoo Paek of Yongin-si (KR) for samsung electronics co., ltd., Sungdong Cho of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/768, H01L23/00, H01L23/522, H01L25/065, H01L25/18
CPC Code(s): H01L21/76819
Abstract: a semiconductor chip structure includes a first semiconductor chip that includes a first chip region and a first scribe lane region and a second semiconductor chip that includes a second chip region and a second scribe lane region respectively bonded to the first chip region and the first scribe lane region. the first semiconductor chip includes a first bonding wiring layer that includes a first bonding insulating layer and a first bonding electrode in the first bonding insulating layer. the second semiconductor chip includes a second bonding wiring layer that includes a second bonding insulating layer and a second bonding electrode in the second bonding insulating layer and a polishing stop pattern. the first bonding insulating layer and the first bonding electrode of the first bonding wiring layer are respectively hybrid bonded to the second bonding insulating layer and the second bonding electrode of the second bonding wiring layer.
20250087538. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myeonghoon HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, H01L23/00, H01L23/532, H10B41/41
CPC Code(s): H01L22/34
Abstract: a semiconductor device may include a semiconductor substrate having a first surface including a memory cell area; a first chipping detection circuit on the first surface of the semiconductor substrate and surrounding the memory cell area; and a chip guard on the first surface of the semiconductor substrate. a portion of the chip guard may overlap the first chipping detection circuit in a direction perpendicular to the first surface of the semiconductor substrate.
20250087541. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngbae Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/13, G02B6/42, H01L23/00, H01L23/498, H01L25/16, H10B80/00
CPC Code(s): H01L23/13
Abstract: a semiconductor package includes a package substrate that extends in a first direction, an interposer on an upper surface of the package substrate, where the interposer includes: a first substrate that includes a first portion having a first thickness in a second direction that is perpendicular to the first direction and a second portion having a second thickness in the second direction that is greater than the first thickness, and a plurality of first through vias that extend into the first substrate, a photonic ic chip on the first portion of the first substrate, where the photonic ic chip includes: a second substrate, a front insulation layer, an optical waveguide, an optical fiber, and a coupler, and a plurality of semiconductor chips on the second portion of the interposer.
Inventor(s): Yuseon HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00
CPC Code(s): H01L23/315
Abstract: provided is a semiconductor package including a first wiring structure including a plurality of first wiring patterns respectively including a plurality of first lower surface connection pads and a plurality of first upper surface connection pads, a second wiring structure including a plurality of second wiring patterns respectively including a plurality of second lower surface connection pads and a plurality of second upper surface connection pads, a semiconductor chip arranged between the first wiring structure and the second wiring structure, a plurality of connection structures connecting some of the plurality of first upper surface connection pads to the plurality of second lower surface connection pads, and arranged adjacent to the semiconductor chip, and a binding reinforcement layer on side surfaces of each of the plurality of connection structures and at least a portion of the semiconductor chip.
Inventor(s): Narae Shin of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jeongkyu Ha of Suwon-si (KR) for samsung electronics co., ltd., Woonbae Kim of Suwon-si (KR) for samsung electronics co., ltd., Yechung Chung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/495, H01L23/00, H01L23/31
CPC Code(s): H01L23/49572
Abstract: a chip on film package includes a base film having a first surface and a second surface which are opposite to each other, at least one first conductive line disposed on the first surface and extending in a first direction, at least one second conductive line disposed on the second surface and extending in the first direction, a semiconductor chip disposed on the first surface and connected to the at least one first conductive line through a bump structure, a protective layer covering a part of the first surface and a part of the second surface, and a display panel disposed on the first surface and connected to the at least one first conductive line, wherein the at least one second conductive line is not disposed on the second surface between the semiconductor chip and the display panel.
Inventor(s): Sehoon JANG of Suwon-si (KR) for samsung electronics co., ltd., Kyung Don MUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H01L21/768, H01L23/00
CPC Code(s): H01L23/49822
Abstract: a wiring structure may include a wiring layer including a wiring pad, an insulating layer on the wiring layer and covering the wiring layer, a connection pad on the insulating layer, and a via passing through the insulating layer and connecting the wiring pad and the connection pad. the wiring pad may include a first metal layer and a second metal layer on the first metal layer. a bottom surface of the via may abut the first metal layer, and the second metal layer may surround a side surface of the via and may be adjacent to the bottom surface.
Inventor(s): HYUNSOO CHUNG of Suwon-si (KR) for samsung electronics co., ltd., KWANG-SOO KIM of Suwon-si (KR) for samsung electronics co., ltd., CHI WOO LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/56, H01L23/29, H01L23/31, H01L25/065
CPC Code(s): H01L23/49827
Abstract: a semiconductor package includes a redistribution layer structure, a first sub-package positioned on the redistribution layer structure, a second sub-package positioned on the first sub-package, and a first encapsulant positioned on the first sub-package and encapsulating the second sub-package. the first sub-package includes a first semiconductor chip including a first chip through via and a dielectric through via electrically connected to the redistribution layer structure. the second sub-package includes a second semiconductor chip including a plurality of second chip through vias, each second chip through via electrically connected to one of the first chip through via and the dielectric through via, a third semiconductor chip positioned on the second semiconductor chip, and a fourth semiconductor chip positioned on the third semiconductor chip. each of the second to fourth semiconductor chips is exposed at a side surface of the second sub-package and covered with the first encapsulant.
20250087579. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sanghyun Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L21/768, H01L23/532
CPC Code(s): H01L23/5226
Abstract: a semiconductor device includes an insulating structure, a first interconnection pattern having a first through-hole and disposed on an upper surface of the insulating structure, and a conductive via passing through the first through-hole of the first interconnection pattern and contacting the first interconnection pattern on an internal sidewall of the first through-hole, in which the first interconnection pattern includes a material having first resistivity in a first direction, parallel to the upper surface of the insulating structure, and second resistivity in a second direction, different from the first direction and not parallel to the upper surface of the insulating structure, and the first resistivity is lower than the second resistivity.
Inventor(s): Dohyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Chulhae PARK of Suwon-si (KR) for samsung electronics co., ltd., Younghwan SON of Suwon-si (KR) for samsung electronics co., ltd., Sukkang SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L25/065, H10B41/27, H10B41/35, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device includes a first semiconductor structure including, circuit devices on a substrate, a lower interconnection structure, and a capacitor structure on a same level as a level of at least a portion of the lower interconnection structure, and a second semiconductor structure on the first semiconductor structure and including a plurality of memory cells arranged three-dimensionally. the lower interconnection structure includes a lower contact, a lower line on the lower contact, an upper contact on the lower line, and an upper line on the upper contact. the capacitor structure includes first electrode structures extending in a first direction and spaced apart from each other in a second direction intersecting the first direction, second electrode structures positioned alternately alongside the first electrode structures and spaced apart from each other in the second direction, and dielectric layers between the first electrode structures and the second electrode structures.
Inventor(s): Youngjin Jung of Suwon-si (KR) for samsung electronics co., ltd., Jaehwang Sim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L25/065, H10B43/10, H10B43/27, H10B43/35, H10B43/40, H10B80/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device includes a first word line having a first electrode portion and a first extension portion extending from the first electrode portion, a second word line having a second electrode portion disposed at a higher level than the first electrode portion and a second extension portion extending from the second electrode portion, a first vertical memory structure penetrating through the first and second electrode portions in a vertical direction, and a first interconnection structure electrically connected to the first extension portion. the first extension portion includes a first lower portion extending from the first electrode portion and a first plug portion extending upwardly from at least one side of the first lower portion and connected to the first interconnection structure. at least a portion of the first lower portion has a thickness greater than a thickness of the first electrode portion.
20250087586. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungho Do of Hwaseong-si (KR) for samsung electronics co., ltd., Sanghoon Baek of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/8238, H01L27/02, H01L27/092, H01L29/06, H01L29/423, H01L29/78, H01L29/786
CPC Code(s): H01L23/5286
Abstract: disclosed is a semiconductor device comprising a mixed height cell on a substrate, and a first power line and a second power line that run across the mixed height cell. first to third line tracks are defined between the first power line and the second power line. a fourth line track is defined adjacent to the second power line. the second power line is between the third line track and the fourth line track. the mixed height cell includes a plurality of lower lines aligned with the first to fourth line tracks. a cell height of the mixed height cell is about 1.25 times to about 1.5 times a distance between a first point of the first power line and a corresponding second point of the second power line.
20250087593. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Juil CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jusuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Jongho PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaeyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunju LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonho CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/00, H01L23/48
CPC Code(s): H01L23/544
Abstract: a semiconductor package including a first semiconductor chip including a substrate having a front surface and a rear surface opposite to each other, front pads on the front surface, through-electrodes electrically connected to the front pads, passing through the substrate, and protruding onto the rear surface, and rear pads on the through-electrodes, a first dielectric layer covering at least a portion of the first semiconductor chip, the first dielectric layer surrounding, on the rear surface of the substrate, a portion of a side surface of each of the through-electrodes and a side surface of each of the rear pads, on the rear surface of the substrate, at least one first alignment structure within the first dielectric layer around the first semiconductor chip, and a second semiconductor chip on the first dielectric layer may be provided.
20250087596. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaesun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/552, H01L23/00, H01L23/31, H01L23/36, H01L23/498, H01L23/538, H01L25/065, H01L25/10, H01Q1/22
CPC Code(s): H01L23/552
Abstract: a semiconductor package may include a lower redistribution structure, conductive posts on an upper surface of the lower redistribution structure, a first semiconductor chip on the upper surface of the lower redistribution structure and separated from a conductive post in a first direction parallel to the upper surface of the lower redistribution structure, a radio frequency chip on the upper surface of the lower redistribution structure and separated from the first semiconductor chip in the first direction, a ground post between the first semiconductor chip and the radio frequency chip and configured to shield against an electromagnetic wave generated from the radio frequency chip, a molding layer covering the upper surface of the lower redistribution structure, and a ground layer in contact with an upper surface of the ground post. the molding layer may surround the conductive posts, first semiconductor chip, radio frequency chip, and ground post.
20250087599. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seung Hyun BAIK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L25/065, H01L25/16
CPC Code(s): H01L23/562
Abstract: a semiconductor package includes a package substrate. a ceramic electronic component is electrically connected to the package substrate. the ceramic electronic component includes a main body having a main body upper surface and a first electrode disposed on a first side of the main body. the first side of the main body includes a first upper area disposed on the main body upper surface. a second electrode is disposed on an opposite second side of the main body. the second side of the main body includes a second upper area disposed on the main body upper surface. the second upper area is spaced apart from the first upper area. a protection unit is disposed on the main body upper surface and is positioned between the first and second upper areas. a mold unit seals the ceramic electronic component and the protection unit.
20250087603. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Young Lyong Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyun Soo Chung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/64, H01L23/00, H01L23/28, H01L23/498, H01L23/538, H01L25/065
CPC Code(s): H01L23/642
Abstract: a semiconductor package includes an interposer structure extending in a first direction and including an inner area and an outer area defined by an inner area, a first semiconductor chip mounted on the inner area and electrically connected to the interposer structure, a plurality of bumps disposed between the first semiconductor chip and the interposer structure, and contacting each of the first semiconductor chip and the interposer structure, an underfill filling a space between the interposer structure and the first semiconductor chip and covering the plurality of bumps; and a mold layer disposed on the outer area and surrounding the first semiconductor chip, wherein the interposer structure includes a decoupling capacitor, wherein a ratio of a length in the first direction of the first semiconductor chip to a length in the first direction of the interposer structure is in a range of 0.9 inclusive to 1 exclusive.
20250087607. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): HYEONMIN LEE of Suwon-si (KR) for samsung electronics co., ltd., Haseob Seong of Suwon-si (KR) for samsung electronics co., ltd., MINSEUNG JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/48, H01L23/528, H01L25/065
CPC Code(s): H01L24/08
Abstract: a semiconductor package includes a first semiconductor chip, a dummy die on the first semiconductor chip, second semiconductor chips stacked on the dummy die, and a dummy plate on the second semiconductor chips. each of the first semiconductor chip, the dummy die, and the second semiconductor chips includes through-electrodes. the dummy die and the second semiconductor chip closest to the dummy die are connected to each other by direct contact of bonding pads. adjacent ones of the second semiconductor chips are connected to each other by direct contact of bonding pads. the first semiconductor chip, the dummy die, the second semiconductor chip, and the dummy plate have a first width, a second width, a third width, and a fourth width in a horizontal direction, respectively. the fourth width is greater than the second width and the third width.
Inventor(s): JUNHYUN AN of Suwon-si (KR) for samsung electronics co., ltd., UN-BYOUNG KANG of Suwon-si (KR) for samsung electronics co., ltd., HYOJIN YUN of Suwon-si (KR) for samsung electronics co., ltd., SEUNG HUN CHAE of Suwon-si (KR) for samsung electronics co., ltd., JU-IL CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00
CPC Code(s): H01L24/13
Abstract: the present disclosure relates to a conductive structure including: a conductive pad that includes a first seed layer having a first area and a second area surrounding the first area, and a first metal layer disposed on the first area of the first seed layer; and a conductive pillar disposed on the conductive pad, wherein a thickness of the conductive pad in an area vertically overlapping the first area of the first seed layer is thicker than a thickness of the conductive pad in an area vertically overlapping the second area of the first seed layer, a semiconductor chip including the conductive structure, and a manufacturing method of the conductive structure.
Inventor(s): Jing Cheng LIN of Suwon-si (KR) for samsung electronics co., ltd., Sungjin Han of Suwon-si (KR) for samsung electronics co., ltd., Gyeongjae JO of Suwon-si (KR) for samsung electronics co., ltd., Hyunchul JUNG of Suwon-si (KR) for samsung electronics co., ltd., Youngkun JEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00
CPC Code(s): H01L24/74
Abstract: a semiconductor package manufacturing apparatus is provided and includes a bonding head including at least one vacuum hole, and at least one adsorption trench in a lower surface of the bonding head and connected to the at least one vacuum hole. a lower part of the bonding head includes at least one first portion, and a second portion spaced apart from the at least one first portion and surrounding the at least one first portion in a plan view. the at least one adsorption trench is defined by and between the at least one first portion and the second portion, and at least a portion of an inner surface of the at least one adsorption trench and at least a portion of an outer surface of the at least one adsorption trench are curved in the plan view.
Inventor(s): Choongbin Yim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/48, H01L25/00, H10B80/00
CPC Code(s): H01L25/0652
Abstract: a semiconductor package may include a substrate, a semiconductor stacked structure on the substrate, with the semiconductor stacked structure including a logic die and a high-bandwidth memory on the logic die, one or more semiconductor dies on the substrate and arranged side by side with the semiconductor stacked structure, and one or more surface mount devices (smd) on the semiconductor stacked structure.
20250087636. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Inhee YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31
CPC Code(s): H01L25/0652
Abstract: a semiconductor package includes a package substrate including an insulating layer, an interconnection layer in the insulating layer, and interconnection pads on the insulating layer and electrically connected to the interconnection layer, first and second semiconductor chips on the package substrate and spaced apart from each other, first connection wires each extending from a first side of the first semiconductor chip to a second side of the second semiconductor chip and spaced apart from each other, an adhesive layer on the first and second semiconductor chips and covering at least a portion of each of the first connection wires, an upper semiconductor chip on the adhesive layer, second connection wires connecting the first and second semiconductor chips and the upper semiconductor chip to the interconnection layer of the package substrate, and an encapsulant on the package substrate and filling a space between the first and second semiconductor chips.
20250087637. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myungsam KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/13, H01L23/15, H01L23/31, H01L23/367, H01L23/498, H01L23/538, H01L23/64, H01L25/16
CPC Code(s): H01L25/0655
Abstract: a semiconductor package includes a redistribution substrate, a glass substrate mounted on the redistribution substrate and including a cavity in a central portion of the glass substrate, a bridge die in the cavity, a first semiconductor chip and a second semiconductor chip, the first semiconductor chip and the second semiconductor chip side by side, on the glass substrate, and the first semiconductor chip and the second semiconductor chip on the bridge die, a mold layer covering a top surface of the redistribution substrate, the glass substrate, the bridge die, the first semiconductor chip and the second semiconductor chip, and internal connection terminals connecting the glass substrate and the bridge die to the first and second semiconductor chips. the glass substrate includes a plurality of connection vias. a distance between an outer side surface of the glass substrate and a side surface of the mold layer ranges from 30 �m to 500 �m.
20250087642. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wanho Park of Cheonan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/16, H01L23/31, H01L23/538
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a chip stack comprising semiconductor chips vertically stacked on a substrate in a first direction perpendicular to a top surface of the substrate, pillars between the substrate and the chip stack, an adhesive layer on a bottom surface of a lowermost semiconductor chip of the semiconductor chips, a first lower protective layer between the adhesive layer and the pillars, a second lower protective layer between the first lower protective layer and the adhesive layer, and a mold layer covering the chip stack and filling a space between the pillars. a thickness of the second lower protective layer in the first direction is greater than a thickness of the adhesive layer in the first direction.
Inventor(s): Hyunsoo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Kwang-Soo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaesic LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/31, H01L23/48, H01L23/498, H01L23/528, H01L23/538
CPC Code(s): H01L25/105
Abstract: a semiconductor package includes a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, a first mold layer at least partially covering the first redistribution substrate and the first semiconductor chip, a plurality of first conductive pillars at least partially penetrating the first mold layer and contacting the first redistribution substrate, a second redistribution substrate on the first mold layer, a second semiconductor chip on the second redistribution substrate, a second mold layer at least partially covering the second redistribution substrate and the second semiconductor chip, a plurality of second conductive pillars at least partially penetrating the second mold layer and contacting the second redistribution substrate, and a third redistribution substrate on the second mold layer. the first semiconductor chip includes a first through via. the second semiconductor chip includes a backside power delivery network layer.
20250087647. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jing Cheng LIN of Suwon-si (KR) for samsung electronics co., ltd., Youngkun Jee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L23/00, H01L23/31, H01L23/36, H01L23/498, H01L23/538, H01L25/00, H01L25/16, H01L25/18, H10B80/00
CPC Code(s): H01L25/105
Abstract: a semiconductor package includes a lower redistribution structure, an internal semiconductor chip on the lower redistribution structure and including first connection pads on a lower surface of the internal semiconductor chip, conductive posts connected to the lower redistribution structure, an encapsulant surrounding a side surface of each of the conductive posts, surrounding a side surface of the internal semiconductor chip, and covering an upper surface of the internal semiconductor chip, upper trace pads on the encapsulant and respectively connected to ends of the conductive posts, an external semiconductor device on the encapsulant, the external semiconductor device including second connection pads on a lower surface of the external semiconductor device and respectively connected to the upper trace pads, and a heat dissipation structure on the encapsulant and laterally spaced apart from the external semiconductor device.
20250087651. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Daegon Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L23/00, H01L23/04, H01L23/48, H01L23/498
CPC Code(s): H01L25/167
Abstract: a semiconductor package includes a package substrate including a first surface and a second surface opposite the first surface, a die disposed on the first surface of the package substrate, a stack structure disposed on the first surface of the package substrate and spaced apart from the die in a horizontal direction, and a socket disposed between the first surface of the package substrate and the stack structure and coupling the package substrate and the stack structure to each other, wherein the stack structure includes a plurality of optical integrated circuit chips stacked vertically with each other.
Inventor(s): Myungjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyunbum Kang of Suwon-si (KR) for samsung electronics co., ltd., Taehee Kim of Suwon-si (KR) for samsung electronics co., ltd., Jusik Kim of Suwon-si (KR) for samsung electronics co., ltd., Gaehwang Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01M4/66, H01M4/02, H01M4/131, H01M4/133, H01M10/0525, H01M10/0562, H01M10/42
CPC Code(s): H01M4/668
Abstract: an all-solid-state secondary battery includes: a positive electrode layer including a positive electrode active material layer, and a positive electrode current collector; a negative electrode layer including a negative electrode current collector, and a negative electrode active material layer; a solid electrolyte layer; and an elastomeric member including an elastomer and disposed inside the negative electrode current collector or the positive electrode current collector, wherein the negative electrode current collector and the negative electrode active material layer are disposed side by side in a thickness direction of the negative electrode layer, the positive electrode current collector and the positive electrode active material layer are disposed side by side in a thickness direction of the positive electrode layer, and the negative electrode current collector or the positive electrode current collector surrounds an outer surface of the elastomeric member.
20250087743. SODIUM ALL-SOLID SECONDARY BATTERY_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungock PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngsin PARK of Suwon-si (KR) for samsung electronics co., ltd., Joungwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunpyo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon KA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01M10/0562, H01M4/02, H01M4/583, H01M4/66, H01M10/26
CPC Code(s): H01M10/0562
Abstract: a sodium all-solid secondary battery including: a cathode; an anode; a sulfide-containing electrolyte between the cathode and the anode; an oxide-containing electrolyte between the sulfide-containing electrolyte and the anode; and a first bonding layer between the oxide-containing electrolyte and the sulfide-containing electrolyte, wherein the cathode includes a cathode current collector and a cathode active material layer, the anode includes an anode current collector and an anode active material layer, and the first bonding layer includes a metal capable of forming an alloy with sodium, a sodium ion-conductive material, or a combination thereof.
Inventor(s): Youngkon LIM of Suwon-si (KR) for samsung electronics co., ltd., Kihyuk Han of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok Na of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q1/52, H05K1/02
CPC Code(s): H01Q1/243
Abstract: an electronic device includes: a housing including a front surface and a rear surface; a display on the front surface of the housing; a shielding member being inside the housing; a printed circuit board on the shielding member, including: a first antenna area including a first pattern, a second antenna area including a second pattern, and a bending area, which is at least partially bent to interconnect the first antenna area and the second antenna area; and a rear surface plate on the rear surface of the housing to cover the printed circuit board, wherein the second pattern extends to outside of the first pattern and at least partially faces a portion of the first pattern.
20250087886. ELECTRONIC DEVICE INCLUDING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaehyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hongpyo BAE of Suwon-si (KR) for samsung electronics co., ltd., Seunghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Taegyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Jesun MOON of Suwon-si (KR) for samsung electronics co., ltd., Himchan YUN of Suwon-si (KR) for samsung electronics co., ltd., Jaebong CHUN of Suwon-si (KR) for samsung electronics co., ltd., Hochul HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q5/364, H01Q1/24
CPC Code(s): H01Q5/364
Abstract: an electronic device includes a display, a rear cover, a side member surrounding the space between the display and the rear cover, the side member having a groove formed therein, a side key disposed the groove and including a conductive portion, a wireless communication circuit, at least one processor, and a first conductive connection member electrically connecting the at least one processor to the side key. the wireless communication circuit is configured to feed power to a first portion of the side member surrounding an edge of the groove through the first conductive connection member electrically connecting the at least one processor to the side key, and transmit and/or receive radio frequency (rf) signals in a specified frequency band, based on an electrical path formed in the first portion of the side member and the conductive portion of the side key.
Inventor(s): Jaeseok PARK of Suwon-si (KR) for samsung electronics co., ltd., Beomwoo Gu of Suwon-si (KR) for samsung electronics co., ltd., Sangwook Kwon of Suwon-si (KR) for samsung electronics co., ltd., Joonhong Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun Park of Suwon-si (KR) for samsung electronics co., ltd., Sungku Yeo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/60, G01S13/04, H02J50/12
CPC Code(s): H02J50/60
Abstract: a wireless power transmission device includes: a power transmission coil; a first circuit electrically connected to the power transmission coil and configured to provide first power of a first frequency to the power transmission coil; a sensing antenna configured to detect a human body; a second circuit electrically connected to the sensing antenna; and a controller, where the controller is configured to: control the first circuit to provide the first power of the first frequency to the power transmission coil; control the second circuit to provide a second power of a second frequency, which is different from the first frequency, to the sensing antenna in a state in which the first power is provided to the power transmission coil; and obtain at least one parameter based on at least one sensing result for at least one point of the second circuit from the second circuit.
20250088178. VOLTAGE REGULATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): EUNJE PARK of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H03K3/017, H03K3/037, H03K5/00
CPC Code(s): H03K3/017
Abstract: an electronic device according to an embodiment includes a clock generator generating a first clock signal having a first frequency, and a voltage regulating system configured to receive the first clock signal, receive a detection signal indicating that a boost voltage is within a first voltage range, adjust the first frequency of the first clock signal to generate a second clock signal having a second frequency based on a period during which the detection signal is maintained at a constant level, and generate the boost voltage based on the second clock signal.
Inventor(s): Jangsun YOO of Suwon-si (KR) for samsung electronics co., ltd., Hakjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihye MOON of Suwon-si (KR) for samsung electronics co., ltd., Youngheon SONG of Suwon-si (KR) for samsung electronics co., ltd., Myeonggil LEE of Suwon-si (KR) for samsung electronics co., ltd., Heeseung LEE of Suwon-si (KR) for samsung electronics co., ltd., Gun LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/50, H04B1/401
CPC Code(s): H04B1/50
Abstract: an electronic device is provided. the electronic device includes a housing including a conductive portion, the conductive portion including a first segment and a second segment separated from the first segment by a first gap, a first switch configured to selectively connect the first segment and the second segment, a first wireless communication circuit including a first port and a second port, the first port being electrically connected to the first segment, and a second switch configured to selectively connect the second port and the second segment, wherein the first wireless communication circuit is configured to operate in a first mode or a second mode, wherein the first mode is configured to transmit and/or receive a wireless signal in a first frequency range by using a first antenna formed from the first segment electrically open to the second segment through the first switch, and transmit and/or receive the wireless signal in the first frequency range by using a second antenna formed from the second segment electrically open to the first segment through the first switch and electrically connected to the second port through the second switch, wherein the second mode is configured to transmit and/or receive a wireless signal in the first frequency range and a second frequency range by using a third antenna formed from the first segment electrically connected to the second segment through the first switch and the second segment electrically open to the second port through the second switch, and wherein the second frequency range is different from the first frequency range.
Inventor(s): Yu-Chien Lin of Davis CA (US) for samsung electronics co., ltd., Yan Xin of Princeton NJ (US) for samsung electronics co., ltd., Yong Ren of Warren NJ (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/0456, H04B7/06
CPC Code(s): H04B7/0456
Abstract: methods and apparatuses for an operation for a channel state information upsampling in a wireless communication system. a method of bs includes: receiving, from a ue, feedback information including at least one sb level precoder; identifying, based on the at least one sb level precoder, a mapping function to perform an up-sampling operation; performing, based on the mapping function, the up-sampling operation to the at least one sb level precoder; and identifying, based on the up-sampling operation, at least one rb level precoder from the at least one sb level precoder for a precoder gain of the bs.
20250088246. CSI REPORTING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B7/0456
CPC Code(s): H04B7/0626
Abstract: apparatuses and methods for channel state information (csi) reporting. a method performed by a user equipment (ue) includes receiving information about a channel state information (csi) report. the information indicates ncsi reference signal (csi-rs) resources, where n≥1. the method further includes, based on the information: measuring the ncsi-rs resources; identifying a number of groups of receive antenna ports, n, where n>1; and determining the csi report associated with the ncsi-rs resources based on the number of groups of receive antenna ports. the method further includes transmitting the csi report. the number of groups of receive antenna ports is according to a ue capability. the csi report includes a rank indicator (ri) of � layers, n≥1 precoding matrix indicators (pmis), and n≥1 channel quality indicators (cqis).
Inventor(s): Junyung YI of Suwon-si (KR) for samsung electronics co., ltd., Youngbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongho YEO of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Taehan BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/08, H04W72/0446, H04W72/21
CPC Code(s): H04L1/08
Abstract: the disclosure relates to a communication technique for combining an iot technology with a 5g communication system for supporting a higher data transmission rate beyond a 4g system, and a system therefor. the disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, health care, digital education, retail businesses, security and safety related services, and the like) based on 5g communication technologies and iot-related technologies. the disclosure provides a method for improving the coverage of an uplink channel for uplink transmission.
20250088333. GROUP COMMON BEAM INDICATION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dalin Zhu of Allen TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/232
CPC Code(s): H04L5/0053
Abstract: methods and apparatuses for group common beam indication. a method performed by a user equipment (ue) includes receiving a plurality of first transmission configuration indication (tci) states in a group common downlink control information (dci) and receiving first information related to a plurality of channel measurement resources (cmrs) for coherent-joint transmission (cjt). the method further includes determining, based on the plurality of first tci states, at least one second tci state; determining an association between the at least one second tci state and the first information; and receiving, based on the association, the plurality of cmrs. the first information comprises at least a number of the plurality of cmrs and time-frequency domain resource configurations for the plurality of cmrs.
Inventor(s): Sa ZHANG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/0446
CPC Code(s): H04L5/0055
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a terminal and a method performed by the same in a wireless communication system are provided. the method includes transmitting a physical uplink shared channel (pusch) and/or receiving a physical downlink shared channel (pdsch) from one or more puschs and/or one or more pdschs, wherein the one or more puschs include dynamically scheduled puschs and/or configured grant (cg) puschs, and the one or more pdschs include dynamically scheduled pdschs and/or semi-persistent scheduling (sps) pdschs. the invention can improve communication efficiency.
Inventor(s): Dokyung Lim of Seoul (KR) for samsung electronics co., ltd., Sounghun Shin of Anyang-si (KR) for samsung electronics co., ltd., Wooseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Wonsik Yu of Anyang-si (KR) for samsung electronics co., ltd., Chanyoung Jeong of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L7/033, H04L43/087
CPC Code(s): H04L7/033
Abstract: a monitoring circuit for a high frequency signal includes: a phase locked loop configured to generate a divided output signal with respect to an input signal based on a plurality of dividers; a plurality of dividing monitoring circuits configured to receive dividing input signals and dividing output signals respectively corresponding to the plurality of dividers, and output dividing error signals; and a jitter monitoring circuit configured to output a jitter error signal.
Inventor(s): Young Sik Moon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/00, H04L9/06
CPC Code(s): H04L9/008
Abstract: an operation method of a homomorphic encryption system comprises generating a ciphertext, performing an operation on the ciphertext, generating history information about the operation, generating a noise prediction value by predicting noise accumulated in the ciphertext by the operation based on the history information, and generating an encryption parameter including a guard interval inserted into the ciphertext based on the noise prediction value.
20250088395. ADAPTIVE AFE CALIBRATION TECHNIQUES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Anup P. Jose of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L25/03
CPC Code(s): H04L25/03057
Abstract: an adaptation engine included in a receiver of a serial data link, including at least one processor configured to: receive an error signal generated by an error slicer included in a decision feedback equalizer (dfe) and a data signal generated by a data slicer included in the dfe, perform a first iterative adaptation process corresponding to the afe by adjusting a gain of the afe based on the error signal and the data signal, and perform a second iterative adaptation process corresponding to the afe by adjusting an degeneration resistance of a degeneration resistor included in the afe based on the error signal and the data signal.
Inventor(s): Dong Han KIM of Suwon-si (KR) for samsung electronics co., ltd., Sung Soo KIM of Seoul (KR) for samsung electronics co., ltd., Wan KIM of Uiwang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L27/38, H03K5/00, H03K5/01
CPC Code(s): H04L27/3863
Abstract: an electronic device includes a feedback oscillator configured to output a first oscillation signal and a second oscillation signal, the second oscillation signal having a defined phase difference from the first oscillation signal, the feedback oscillator including a phase shifter configured to receive the first oscillation signal and output the second oscillation signal, an up-conversion mixer configured to output a first loopback signal obtained by mixing the first oscillation signal with a reference tone signal, and output a second loopback signal obtained by mixing the second oscillation signal with the reference tone signal, and a receiver configured to generate a first reference iq signal from the first loopback signal, generate a second reference iq signal from the second loopback signal, and compare an actual phase difference between the first reference iq signal and the second reference iq signal with the defined phase difference.
Inventor(s): Yanru WANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04L43/0852, H04L43/062
CPC Code(s): H04L43/0852
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). the present disclosure provides a first node in a wireless communication system and an method performed by the same, including: receiving first information from a second node in the wireless communication system: and determining an interface delay of a general packet radio service tunneling protocol user plane (gtp-u) packet between a gtp-u packet transmission node and a gtp-u packet reception node based on the first information.
Inventor(s): Jiwoon LIM of Suwon-si (KR) for samsung electronics co., ltd., Hakju KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongmun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H01Q1/24, H01Q1/38
CPC Code(s): H04M1/0283
Abstract: provided is an electronic device including: a housing including a front plate, a rear plate facing the opposite direction to the front plate, and a side member surrounding the space between the front plate and the rear plate; and an antenna, wherein at least a portion of the housing includes a mirror ink pattern layer containing metal powder, and adjacent pattern components forming the mirror ink pattern layer are electrically insulated from each other.
Inventor(s): Gaurav KHANDELWAL of Bangalore (IN) for samsung electronics co., ltd., Divyanshu KUMAR of Bangalore (IN) for samsung electronics co., ltd., Saiksha Dhananjay SHETTY of Bangalore (IN) for samsung electronics co., ltd., Digadari SUMAN of Bangalore (IN) for samsung electronics co., ltd., Alok Shankarlal SHUKLA of Bangalore (IN) for samsung electronics co., ltd., Abhijit DEY of Bangalore (IN) for samsung electronics co., ltd., Kiran NATARAJU of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04N5/915, G11B27/00, H04N5/77
CPC Code(s): H04N5/915
Abstract: a method performed by an electronic device for generating a slow motion video includes obtaining plural image frames captured at a frame rate from a camera of the electronic device, detecting motion information in a first image frame from among the plural image frames, and performing an interpolation operation using one or more image frames from among the plural image frames. the one or more image frames are image frames obtained during a predetermined time after the first image frame in which the motion information is detected. a second image frame obtained before the first image frame in which the motion information is detected is discarded from the electronic device. a third image frame obtained after the predetermined time from the first image frame in which the motion information is detected is discarded from the electronic device.
Inventor(s): Yin-ji PIAO of Yongin-si (KR) for samsung electronics co., ltd., Jie CHEN of Seoul (KR) for samsung electronics co., ltd., Elena ALSHINA of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/52, H04N19/117, H04N19/159, H04N19/176, H04N19/635, H04N19/64
CPC Code(s): H04N19/52
Abstract: a video decoding method includes obtaining split information indicating whether to split a current block, splitting the current block into two or more lower blocks when the split information indicates to split the current block, obtaining encoding order information indicating an encoding order of the lower blocks of the current block, determining a decoding order of the lower blocks according to the encoding order information, and decoding the lower blocks according to the decoding order.
20250088696. CONTROLLER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jangwon HAN of Suwon-si (KR) for samsung electronics co., ltd., Euishik YOON of Suwon-si (KR) for samsung electronics co., ltd., Jungwon KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyoungmoon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/422, G06F3/0362
CPC Code(s): H04N21/42222
Abstract: a controller includes: a main body including at least one rib; a rotating wheel including: a fixed body supported by the main body, and a rotating body facing the at least one rib, coupled to the fixed body and rotatable with respect to the fixed body; and a clicker protruding toward the main body from the rotating body to allow an end portion to be provided between the at least one rib, where the rotating body includes a wheel cover including an accommodation space recessed in a direction away from the at least one rib to allow at least a portion of the clicker to be provided therein.
Inventor(s): In-ji KIM of Uijeongbu-si (KR) for samsung electronics co., ltd., Sang-on CHOI of Suwon-si (KR) for samsung electronics co., ltd., Byung-seok SOH of Yongin-si (KR) for samsung electronics co., ltd., Mi-ra YU of Seoul (KR) for samsung electronics co., ltd., Ho-june YOO of Seoul (KR) for samsung electronics co., ltd., Eun-seok CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/4227, G06F3/0354, G06F3/04883, G06F21/32, G06V40/13, G08C17/00, G08C17/02, H04N21/41, H04N21/422, H04N21/4415, H04N21/45, H04N21/472, H04N21/475, H04W88/02
CPC Code(s): H04N21/4227
Abstract: a user terminal apparatus is provided. the user terminal apparatus for performing a remote control function for an electronic apparatus includes a communication unit configured to communicate with an electronic apparatus for providing a text input user interface (ui), an input unit configured to receive a user command for input of a specific text on the text input ui, a fingerprint scanner provided in the input unit and configured to recognize a user fingerprint, and a controller configured to recognize a user fingerprint according to the user command and to transmit information corresponding to the recognized user fingerprint to the electronic apparatus in response to the electronic apparatus entering a preset text input mode.
Inventor(s): Youngbok YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/68, H04N23/55, H04N23/67
CPC Code(s): H04N23/687
Abstract: a camera module according to an embodiment of the disclosure may include: an image sensor, an optical image stabilization (ois) carrier coupled to the image sensor and configured to move the image sensor on a plane perpendicular to an optical axis, a housing accommodating the image sensor and the ois carrier, an ois magnet fixed to a first side of the ois carrier, a first ois coil and a second ois coil fixed to a first inner surface of the housing to face the ois magnet, the first ois coil and the second ois coil disposed side by side on the first inner surface along a direction perpendicular to the optical axis, and a driving circuit electrically connected to the first ois coil and the second ois coil. the driving circuit may be configured to: control a first current applied to the first ois coil and a second current applied to the second ois coil to perform ois by moving the image sensor in a direction perpendicular to the optical axis, and perform roll rotation correction of the image sensor by rotating the image sensor on a plane perpendicular to the optical axis.
Inventor(s): Seungwan JEON of Suwon-si (KR) for samsung electronics co., ltd., Eunji YONG of Suwon-si (KR) for samsung electronics co., ltd., Dongyoung SONG of Suwon-si (KR) for samsung electronics co., ltd., Dongoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Yitae KIM of Suwon-si (KR) for samsung electronics co., ltd., Kichrl PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/71, H04N23/741
CPC Code(s): H04N23/71
Abstract: a method of operating an electronic device includes receiving a plurality of reference code values respectively corresponding to a plurality of reference images captured by an image sensor during different exposure times, receiving a plurality of target code values corresponding to a target image captured by the image sensor, estimating an inverse camera response function (crf) by adjusting a scale of the plurality of reference code values so that the scale of the plurality of reference code values is equal to a scale of the inverse crf, wherein the inverse crf estimates radiance corresponding to the plurality of reference code values, generating a radiance map based on the plurality of reference code values and the inverse crf, and measuring an effective dynamic range (dr) length of the image sensor based on the radiance map and the plurality of target code values.
20250088792. WEARABLE ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinyong Kim of Suwon-si (KR) for samsung electronics co., ltd., Jonghwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Taiyong Kim of Suwon-si (KR) for samsung electronics co., ltd., Wonju Seo of Suwon-si (KR) for samsung electronics co., ltd., Myungcheol Lee of Suwon-si (KR) for samsung electronics co., ltd., Yonghoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeock Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/34, H04R1/02, H04R1/10
CPC Code(s): H04R1/345
Abstract: provided is a wearable electronic device including: a housing forming at least a part of an exterior of the wearable electronic device; a nozzle extending from a part of the housing, wherein the nozzle includes a first hole at a first position and a second hole at a second position; an acoustic path inside the nozzle; a grill inside the nozzle, wherein the grill includes a first latch passing through the first hole such that a part thereof protrudes in a first direction and a second latch passing through the second hole such that a part thereof protrudes in a second direction; and an ear tip at least partially surrounding an outer surface of the nozzle, wherein the ear tip includes a first groove detachably coupled to a part of the first latch and a second groove detachably coupled to a part of the second latch.
Inventor(s): Hyunkee MIN of Suwon-si (KR) for samsung electronics co., ltd., Mingyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Doosuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Choonkyoung MOON of Suwon-si (KR) for samsung electronics co., ltd., Bokun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R5/04
CPC Code(s): H04R5/04
Abstract: an electronic device is provided. the electronic device includes communication circuitry, memory storing one or more computer programs, and one or more processors communicatively coupled to the communication circuitry and the memory. the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to communicate with an external wireless audio device outside the electronic device via the communication circuitry, identify an activation or a deactivation of a noise canceling function of the wireless audio device based on a request to transmit audio data to the wireless audio device, in case that the activation of the noise canceling function is identified, transmit a control signal for the activation of the noise canceling function and the audio data to the wireless audio device, and in case that the deactivation of the noise canceling function is identified, transmit a control signal for the deactivation of the noise canceling function and the audio data to the wireless audio device.
Inventor(s): Taehyung LIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Duckey LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Jungje SON of Gyeonggi-do (KR) for samsung electronics co., ltd., Hongjin CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/041, H04W12/10
CPC Code(s): H04W12/041
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. the disclosure relates to a method and apparatus for enhancing security of a user plane in a communication system by improving security of a protection key to be used in the user plane. according to an embodiment of the disclosure, a method performed by a base station in a wireless network system includes generating, by a cu-cp or cu-up included in the base station, a user plane protection key for integrity protection of at least one data or signaling transmitted and received in a user plane based on protection key generation information of the base station, transmitting, to a user equipment, protection key generation information of the user equipment for generating the user plane protection key, and applying the user plane protection key to the at least one data or signaling transmitted and received in the user equipment and the user plane.
Inventor(s): Jingxing FU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Sa ZHANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W16/28, H04W56/00, H04W72/231, H04W74/0808
CPC Code(s): H04W16/28
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method performed by a network device for forwarding information in a communication system is provided. the method includes receiving, from a base station, beam indication information indicating a first beam for receiving, by the network device, an uplink signal from a user equipment (ue) or indicating a second beam for transmitting, by the network device, a downlink signal to the ue: receiving, from a first node, a signal; and transmitting, to a second node, the signal received from the first node.
Inventor(s): Liang HU of San Diego CA (US) for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04L41/147
CPC Code(s): H04W24/10
Abstract: methods and devices of a wireless system are provided. a user equipment (ue) of the wireless system receives configuration information from a base station (bs). the ue transmits repetitions of joint communication and sensing (jcs)-reference signals (rss) on a first set of beams based on the configuration information. the ue determines a beam blockage prediction measurement for communication of a second set of beams received corresponding to the first set of beams. the ue transmits the beam blockage measurement to the bs.
Inventor(s): Yongsen MA of Milpitas CA (US) for samsung electronics co., ltd., Michail KOUNDOURAKIS of Hamburg (DE) for samsung electronics co., ltd., Mark Gorthorn RISON of Cambridge (GB) for samsung electronics co., ltd., Srinivas KANDALA of Morgan Hill CA (US) for samsung electronics co., ltd., Ravi GIDVANI of Fremont CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W28/082, H04W52/02, H04W88/10
CPC Code(s): H04W28/0268
Abstract: a system and a method are disclosed for improving energy efficiency of an ap mld utilizing ttlm. a method performed by an ap mld is provided, which includes establishing, with a non-ap mld, a first link between a first sta of the non-ap mld and a first ap of the ap mld and a second link between a second sta of the non-ap mld and a second ap of the ap mld, mapping a plurality of tids to the first link and the second link utilizing ttlm; identifying a first event triggering a reduced power operation mode on the second link; and modifying a number of the plurality of tids mapped to the second link utilizing the ttlm, in response to identifying the first event.
Inventor(s): Hoondong NOH of Suwon-si (KR) for samsung electronics co., ltd., Youngwoo KWAK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/06, H04B7/06, H04L5/00, H04W72/044
CPC Code(s): H04W36/06
Abstract: the present disclosure relates to a communication method for converging iot technology with 5g communication systems for supporting higher data transmission rates than beyond 4g systems, and to a system therefor. the present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail business, security and safety-related services, etc.) on the basis of 5g communication technology and iot-related technology. the present invention characterizes in a method for a terminal of a wireless communication system, wherein the method comprises the steps of: receiving channel or reference signal configuration information including beam-related configuration information via higher layer signalling; transmitting and receiving the channel or a reference signal to and from a base station on the basis of the beam-related configuration information; receiving beam change information for the channel or reference signal; and transmitting and receiving the channel or reference signal of a plurality of component carriers to and from the base station on the basis of the beam change information, wherein the beam-related configuration information and the beam change information include transmission configuration indicator (tci) state information of the channel or reference signal.
Inventor(s): Anil Agiwal of Allen TX (US) for samsung electronics co., ltd., Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04W36/00
CPC Code(s): H04W36/08
Abstract: a user equipment (ue) includes a transceiver configured to receive a radio resource control (rrc) reconfiguration message including a configuration of a lower layer triggered mobility (ltm) candidate cell, and receive an ltm cell switch command instructing the ue to perform an ltm cell switch to the ltm candidate cell. the ue also includes a processor operably coupled to the transceiver. the processor is configured to determine whether the ltm candidate cell belongs to a master cell group (mcg), and determine whether the configuration of the ltm candidate cell includes a system information block 1 (sib1). the transceiver is also configured to, when the ltm candidate cell belongs to the mcg and the configuration of the ltm candidate cell includes the sib1, transmit a system information (si) request to the ltm candidate cell after the ltm cell switch to the ltm candidate cell is successfully completed.
20250088933. RACH-LESS CONDITIONAL HANDOVER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of McKinney TX (US) for samsung electronics co., ltd., Ravindranath Kanamangala of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W36/36, H04W36/00
CPC Code(s): H04W36/362
Abstract: a random access channel (rach)-less conditional cell switch is provided. a user equipment (ue) receives and stores a candidate cell configuration including an execution condition of a conditional cell switch to the candidate cell. the ue selects the candidate cell as a target cell for the conditional cell switch on determination that the execution condition is met. the ue determines whether a valid timing advance (ta) and a valid uplink (ul) grant for initial ul transmission to the target cell is available. when a valid ta and a valid ul grant are available, ue transmits initial ul transmission to the target cell using the valid ta and the valid ul grant. when a valid ta is unavailable, the ue performs random access procedure to the target cell. when a valid ul grant is unavailable, the ue transmits a scheduling request to the target cell.
Inventor(s): Yongsen MA of Milpitas CA (US) for samsung electronics co., ltd., Michail KOUNDOURAKIS of Hamburg (DE) for samsung electronics co., ltd., Mark Gorthorn RISON of Cambridge (GB) for samsung electronics co., ltd., Srinivas KANDALA of Morgan Hill CA (US) for samsung electronics co., ltd., Ravi GIDVANI of Fremont CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/02
CPC Code(s): H04W52/0206
Abstract: a system and a method are disclosed for implementing power saving protocols for devices in a wireless communication system. a method performed by an ap is provided, which includes transmitting, to a sta, a first message indicating a power save schedule of the ap; and transitioning, during a scheduled time window, from an awake state to a reduced power state, based on the power save schedule. the reduced power state is associated with a power state transition capability.
Inventor(s): Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W74/0808
CPC Code(s): H04W68/02
Abstract: the present disclosure provides a method performed by a gnb-distributed unit (du) of a base station in a wireless communication system and the gnb-du, the method comprises receiving, from a gnb-central unit (cu) of the base station, signaling information for paging subgrouping of a user equipment (ue), identifying a subgroup of the ue for the paging subgrouping, based on the signaling information, and transmitting the paging message to the ue which belongs in the subgroup.
Inventor(s): Pengru LI of Beijing (CN) for samsung electronics co., ltd., Qi XIONG of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/0446, H04W74/0833, H04W76/27
CPC Code(s): H04W72/0446
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). the application provides a method performed by a user equipment ue, comprising: identifying a first time interval between a first transmission of an srs for positioning outside an initial uplink bwp and a second transmission of an uplink signal; and in case that the first time interval between the first transmission and the second transmission is less than a first threshold, dropping the first transmission. the application also provides a ue performing the method.
Inventor(s): Emad N. Farag of Flanders NJ (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/0446, H04W72/56
CPC Code(s): H04W72/0446
Abstract: apparatuses and methods for low power sensing operations for a sidelink (sl) a wireless communication system a method of operating a user equipment (ue) is provided. the method includes transmitting, on a sidelink sl interface, traffic with a periodicity; operating in a transmit (tx) resource pool with a parameter sl-multireserveresource set to enabled; and performing at least partial sensing including: determining a resource selection window, selecting y slots within the resource selection window, and for each slot, sensing a set of slots. the method further includes determining candidate resources available in the resource selection window after resource exclusion based on the at least partial sensing and performing resource selection within the available candidate resources.
Inventor(s): Juyeong LEE of Suwon-si (KR) for samsung electronics co., ltd., Heedon Gha of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/0457, H04L1/1812, H04L5/14, H04W72/0453, H04W72/1273, H04W72/231
CPC Code(s): H04W72/0457
Abstract: a method of a terminal, includes: receiving first dl bwp configuration information comprising an id of a first dl bwp; receiving first ul bwp configuration information comprising an id of a first ul bwp; receiving, from the base station, second dl bwp configuration information comprising an id of a second dl bwp and an id of a second ul bwp; and recognizing, through the id of the second ul bwp, that the second dl bwp configuration information is information for dl-ul configuration of the terminal, wherein, in a first slot, when the first dl bwp and the first ul bwp are temporally separated from each other, dl communication and ul communication are not simultaneously performed, by the terminal, with the base station, and wherein, in a second slot, the dl communication and the ul communication are simultaneously performed with a base station based on the second dl bwp configuration information.
Inventor(s): Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W76/10, H04W76/38
CPC Code(s): H04W76/10
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed is a method of operating a user equipment, the ue being operable in a first mode or a second mode, and being further operable to communicate with a telecommunication network, wherein in the first mode (eps/s1) if: the ue receives a service accept message: the ue has set a control plane service type of a control plane service request message to “mobile terminating request” and an “active” flag in the control plane service type information element, ie, to 0); user plane, up, radio bearers have not been set up; and the control plane service request message was sent from emm-idle mode, then the ue starts a timer to guard a time during which the ue remains in connected mode; and in the second mode (5gs/n1) if: the ue sends a control plane service request message; the ue did not set a control plane service type ie to “emergency services fallback”; the ue has not included an uplink data status ie in the control plane service request message, or the ue has included the uplink data status ie in the control plane service request message but a received service accept message indicates that no user-plane resources of any pdu sessions are to be re-established, then the ue starts a timer to guard a time during which the ue remains in connected mode.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W76/15, H04W28/16, H04W88/08
CPC Code(s): H04W76/15
Abstract: a first access point (ap) device in a wireless network, the first sta device comprising a memory and a processor coupled to the memory, the processor configured to transmit, to a second ap, a first frame that requests multi-ap coordination (map) for peer-to-peer (p2p) communication amongst a plurality of stations (stas) and includes information to coordinate allocation of resources for the stas to use for the p2p communication, receive, from the second ap, a second frame that responds to the first frame, and advertise information on allocation of resources for the p2p communication to one or more stas associated with the first ap.
Inventor(s): Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W76/19, H04W4/06, H04W76/20, H04W76/30
CPC Code(s): H04W76/19
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure relates to a method, a base station, an electronic apparatus and a storage medium for supporting multicast transmission. a method performed by a centralized unit (cu) of a second base station comprising the cu and at least one distributed unit (du), the method comprising: receiving a radio resource control (rrc) resume request message comprising a rrc resume reason from a user equipment (ue), the rrc resume reason being set for a purpose of transmission of a mbs; as a response to the rrc resume request message, sending configuration information of a multimedia broadcast multicast service (mbs) radio bearer (mrb) and/or suspension indication information to the ue.
Inventor(s): Kyoungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/20, H04L5/00, H04W16/28, H04W72/231
CPC Code(s): H04W76/20
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transfer rates. the present disclosure provides a method of providing transmission configuration indicator (tci) state information for beam control of a terminal by a base station, the method comprising the steps of: transmitting dci including tci index information to a terminal; and receiving, from the terminal, a predetermined channel on the basis of a beam controlled on the basis of tci state information corresponding to the tci index information, wherein the tci state information comprises information relating to at least one of a target channel and a target reference signal (rs) to be subjected to beam control on the basis of the tci state information.
Inventor(s): Anil Agiwal of Allen TX (US) for samsung electronics co., ltd., Sangkyu Baek of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/28, H04L5/00, H04W72/21, H04W72/231, H04W72/40, H04W74/0833
CPC Code(s): H04W76/28
Abstract: a user equipment (ue) includes a transceiver configured to receive a radio resource control (rrc) reconfiguration message including a configuration of a periodic cell discontinuous transmission (dtx) pattern for at least one serving cell. the ue also includes a processor operably coupled to the transceiver. the processor is configured to determine whether a special cell (spcell) is configured with the periodic cell dtx pattern, determine whether a random access response (rar) window is running, and based on a determination that the spcell is configured with the periodic cell dtx pattern and the rar window is running, monitor a physical downlink control channel (pdcch) of the spcell.
Inventor(s): Sohmann KIM of Suwon-si (KR) for samsung electronics co., ltd., Heedeok KANG of Suwon-si (KR) for samsung electronics co., ltd., Soohong KIM of Suwon-si (KR) for samsung electronics co., ltd., Daewon MOON of Suwon-si (KR) for samsung electronics co., ltd., Dongho KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/50, H04L65/1016, H04W4/14, H04W4/90, H04W48/16
CPC Code(s): H04W76/50
Abstract: an electronic device is provided. the electronic device includes memory storing one or more computer programs, a communication circuit, and one or more processors communicatively coupled to the memory and the communication circuit, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to detect, based on information related to a network to which the electronic device is connected, movement to a service area supporting an emergency call based on long-term evolution (lte) communication, identify, based on the detection of the movement to the service area, whether an emergency call profile of the lte communication, which corresponds to a home network of the electronic device, exists, in response to a determination that the emergency call profile of the lte communication, which corresponds to the home network of the electronic device, does not exist, identify, based on connection information to the network to which the electronic device is connected, whether the network supports circuit switching (cs) communication, acquire, based on the determination that the network does not support cs communication, the emergency call profile of the lte communication, which corresponds to the network to which the electronic device is connected, and provide, based on the emergency call profile of the lte communication, which corresponds to the network, the emergency call based on the lte communication.
Inventor(s): Hyunjoon CHOO of Suwon-si (KR) for samsung electronics co., ltd., Heejun KANG of Suwon-si (KR) for samsung electronics co., ltd., Dongwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehee SHIN of Suwon-si (KR) for samsung electronics co., ltd., Dongoh KANG of Suwon-si (KR) for samsung electronics co., ltd., Yongwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaejin KIM of Suwon-si (KR) for samsung electronics co., ltd., Kanghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sojeong YU of Suwon-si (KR) for samsung electronics co., ltd., Jonghun HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B6/12, A47J36/32, H02J50/10
CPC Code(s): H05B6/1236
Abstract: a method, performed by a wireless power transmission apparatus, of performing a cooking operation, includes: detecting a cooking appliance, establishing a communication connection with the detected cooking appliance, obtaining operation history information corresponding to the cooking appliance, and transmitting power to the cooking appliance based on the operation history information.
20250089166. HYBRID PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Keonwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Moonyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinhyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Junyoung KO of Suwon-si (KR) for samsung electronics co., ltd., Kangmoon SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/11, H05K1/09
CPC Code(s): H05K1/115
Abstract: a hybrid printed circuit board includes: an insulating substrate; a printed circuit board disposed on an upper surface of the insulating substrate and including at least one through hole configured to accommodate a surface mount device; and an adhesive member comprising an adhesive material provided between the insulating substrate and the printed circuit board.
20250089170. STORAGE DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Suin KIM of Suwon-si (KR) for samsung electronics co., ltd., Minsung KIL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/14, H05K1/02, H05K1/18, H05K5/00, H05K7/20
CPC Code(s): H05K1/144
Abstract: a storage device includes a first module including a first substrate and at least one first semiconductor chip provided on the first substrate, a second module electrically connected to the first module and including a second substrate and at least one second semiconductor chip provided on the second substrate, a capacitor module provided between the first module and the second module, including at least one capacitor, and electrically connected to at least one of the first and second modules, and a case configured to accommodate the first module, the second module, and the capacitor module therein.
20250089179. BALL ATTACH TOOL_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeon Hwang of Suwon-si (KR) for samsung electronics co., ltd., Sangwon Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K3/34
CPC Code(s): H05K3/3478
Abstract: a ball attach tool may include a housing a valve module. the housing may include a plurality of pick-up holes configured to pick up balls when a reduced pressure is applied thereto. the valve module may control a reduced pressure applied to the pick-up holes.
Inventor(s): Jonghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Yunjin NAM of Suwon-si (KR) for samsung electronics co., ltd., Kwondeuk YOON of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/00
CPC Code(s): H05K5/0052
Abstract: according to various embodiments of the present disclosure, provided is an electronic device, comprising: a first housing including a first side and a second side opposite the first side; a second housing that covers at least a portion of the second side of the first housing; a printed circuit board disposed between the first housing and the second housing; and a display disposed on the first side of the first housing and electrically connected to the printed circuit board, wherein: the first housing comprises a first member including a first edge that forms an outer edge of the first housing, a second member including a second edge disposed within the edge formed by the first member and provides the second side of the first housing for having the printed circuit board disposed thereon, a mold member comprising an injectable mold material configured to combine the first member and the second member and at least a portion of which overlaps a first metal member comprising a first metal and a second metal member comprising a second metal, and a fastening hole for connecting to the second housing through a fastening member comprising a fastener; the second member includes a fastening area disposed inside the mold member, and at least a portion of which is formed by folding to extend in a direction that the second side faces; and the fastening hole is formed through at least a portion of the fastening area of the second member disposed inside the mold member.
20250089188. DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wookjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyun JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, G06F1/18, H01L25/075, H05K5/00
CPC Code(s): H05K5/0217
Abstract: a display apparatus including a display module, a cabinet to support the display module, the cabinet including an opening, an adjustment part arrangeable in the display module such that while the adjustment part is arranged in the display module, the adjustment part is movable with respect to the cabinet, a support member, moveable within the cabinet, and configured to support the adjustment part such that the adjustment part is moveable while supported on the support member, a rotation member coupleable to the support member and while coupled to the support member, the rotation member is configured to be rotatable such that the support member, the adjustment part, and the display module are moved based on a rotation of the rotation member. the rotation member is accessible through the opening of the cabinet to allow the rotation of the rotation member while the display module is supported on the cabinet.
Inventor(s): Jongkil PARK of Suwon-si (KR) for samsung electronics co., ltd., Joseph Ahn of Suwon-si (KR) for samsung electronics co., ltd., Hongki Moon of Suwon-si (KR) for samsung electronics co., ltd., Hajoong Yun of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K7/20
CPC Code(s): H05K7/20327
Abstract: an electronic device including a frame structure and a housing are provided. the frame structure may include a plate, a plurality of first channels, and a plurality of second channels. the plurality of first channels and the plurality of second channels may form a closed loop in the plate. the plurality of first channels may include a first liquid region and a first gas region.
Inventor(s): Kyungsoo JANG of Suwon-si (KR) for samsung electronics co., ltd., Yongwoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Eunsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinwan AN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K7/20, H05K9/00
CPC Code(s): H05K7/2039
Abstract: an electronic device is disclosed. the electronic device includes a first shield can configured to accommodate an electronic component, a second shield can spaced apart from the first shield can, a heat dissipation structure comprising a heat dissipation material including an end connected to the first shield can and another end connected to the second shield can, and a thermally conductive material disposed in the heat dissipation structure, extending from at least a portion of an inner space of the first shield can to at least a portion of an inner space of the second shield can through the heat dissipation structure.
20250089234. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangsig KIM of Seoul (KR) for samsung electronics co., ltd., Taeho Park of Seoul (KR) for samsung electronics co., ltd., Jaemin Son of Seoul (KR) for samsung electronics co., ltd., Yunwoo Shin of Seoul (KR) for samsung electronics co., ltd., Juhee Jeon of Seoul (KR) for samsung electronics co., ltd., Kyoungah Cho of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/20
Abstract: a semiconductor memory device is provided. the semiconductor device includes: a word line extending in a lateral direction; a sensing line apart from the word line, the sensing line overlapping the word line in a vertical direction and extending in the lateral direction; a vertical semiconductor structure passing through the word line and the sensing line in the vertical direction, the vertical semiconductor structure having a vertical channel region facing the word line in the lateral direction; and a gate dielectric film between the vertical channel region and the word line. the vertical semiconductor structure includes a first heavily doped film of a first conductivity type, a first lightly doped film of a second conductivity type, a second lightly doped film of the first conductivity type, and a second heavily doped film of the second conductivity type, which are sequentially provided in the vertical direction.
Inventor(s): Jeonil LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngjun KIM of Gwangju (KR) for samsung electronics co., ltd., Jinbum KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor device including an active pattern; a gate structure connected to the active pattern; a bit line structure connected to the active pattern; a buried contact connected to the active pattern; a contact pattern covering the buried contact; a landing pad connected to the contact pattern; and a capacitor structure connected to the landing pad, wherein the buried contact includes a first growth portion and a second growth portion spaced apart from each other, and the landing pad includes an interposition portion between the first growth portion and the second growth portion.
20250089239. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Seokhan PARK of Suwon-si (KR) for samsung electronics co., ltd., Gyuhwan OH of Suwon-si (KR) for samsung electronics co., ltd., Bowon YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: provided is a semiconductor memory device including a plurality of word lines extending in a first horizontal direction, a plurality of channel patterns adjacent to a plurality of word line structures, arranged in a row in the first horizontal direction, and extending in a vertical direction, a plurality of bit lines extending in a second horizontal direction different from the first horizontal direction and electrically connected to a plurality of channel patterns, the plurality of word lines adjacent to the plurality of channel patterns, and the plurality of channel patterns on the bit lines, a shield conductive layer arranged below the plurality of bit lines and extending in the vertical direction between the bit lines, and a cover insulating layer arranged between the plurality of bit lines and the shield conductive layer. in a plan view the shield conductive layer comprises a main body unit and a pad unit, the plurality of bit lines overlapping the main body unit in the vertical direction, and a pad unit extending from the main body unit but the plurality of bit lines not overlapping the pad unit in the vertical direction.
20250089252. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongseon AHN of Suwon-si (KR) for samsung electronics co., ltd., Hyunju KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehwang SIM of Suwon-si (KR) for samsung electronics co., ltd., Seulbi LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes a gate electrode structure, a memory channel structure, and a contact plug. the gate electrode structure includes gate electrodes sequentially stacked and spaced apart from each other on a substrate in a first direction perpendicular to an upper surface of the substrate. each of the gate electrodes extends in a second direction substantially parallel to the upper surface of the substrate. the memory channel structure extends through the gate electrode structure. the contact plug extends partially through the gate electrode structure to contact an upper surface of a first gate electrode among the gate electrodes. the contact plug is electrically insulated from a second gate electrode that is over the first gate electrode. at least a portion of the contact plug has a width decreasing from a top toward a bottom thereof in the first direction in a stepwise manner.
Inventor(s): Sea Hoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jun Hee LIM of Suwon-si (KR) for samsung electronics co., ltd., Jun Seok OH of Suwon-si (KR) for samsung electronics co., ltd., Seong Pil CHANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H10B41/27, H10B41/41, H10B43/27
CPC Code(s): H10B43/40
Abstract: a transistor that may provide improved durability and reliability is disclosed. the transistor includes a substrate including an active region, an element isolation film in the substrate that defines the active region, a first impurity region on a lower surface of the element isolation film, a second impurity region in the substrate, a gate electrode on the substrate and extending in a first direction, a source/drain area on at least one side of the gate electrode, a first source/drain contact group on the source/drain area, and a second source/drain contact group on the source/drain area and spaced apart from the first source/drain contact group in the first direction, wherein the second impurity region is between the first source/drain contact group and the second source/drain contact group.
Inventor(s): Kiyeon YANG of Suwon-si (KR) for samsung electronics co., ltd., Haeryong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hajun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Changseung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B63/00, H10B63/10
CPC Code(s): H10B63/845
Abstract: provided are a memory device, a manufacturing method thereof, and an electronic apparatus including the memory device. the memory device may include a plurality of first conductors arranged apart from each other and perpendicular to a substrate, a second conductor extending perpendicular to the substrate, a chalcogenide layer extending perpendicular to the substrate between the plurality of first conductors and the second conductor, and a plurality of first diffusion barrier layers selectively arranged only on the plurality of first conductors between the plurality of first conductors and the chalcogenide layer. the plurality of first diffusion barrier layers each may include a carbon-based material.
Inventor(s): Ingyu Baek of Suwon-si (KR) for samsung electronics co., ltd., Kumhyo Kang of Suwon-si (KR) for samsung electronics co., ltd., Hyunmook Choi of Suwon-si (KR) for samsung electronics co., ltd., Soonhyung Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/30
CPC Code(s): H10D1/714
Abstract: an example semiconductor device includes a capacitor structure on a substrate. the capacitor structure includes a first electrode structure, a second electrode structure, and a capacitor dielectric layer. the first electrode structure includes first horizontal electrode portions apart from each other in a first direction perpendicular to the substrate and a first conductive pillar connected to each of the first horizontal electrode portions and extending in the first direction. the second electrode structure includes a second conductive pillar extending through the first horizontal electrode portions in the first direction and second horizontal electrode portions apart from each other in the first direction on a side wall of the second conductive pillar and alternately arranged with the first horizontal electrode portions. the capacitor dielectric layer is between the side wall of the second conductive pillar and the first horizontal electrode portions.
Inventor(s): JEEWOONG KIM of Suwon-si (KR) for samsung electronics co., ltd., SUNGMOON LEE of Suwon-si (KR) for samsung electronics co., ltd., YUNSUK NAM of Suwon-si (KR) for samsung electronics co., ltd., KEUN HWI CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L21/285, H01L23/528, H01L29/06, H01L29/08, H01L29/40, H01L29/423, H01L29/45, H01L29/66, H01L29/775
CPC Code(s): H10D30/6729
Abstract: a semiconductor device according to embodiment includes: a base insulation layer having a first surface and a second surface facing each other with a thickness therebetween; a channel layer on the first surface of the base insulation layer; a first source/drain pattern and a second source/drain pattern on the first surface of the base insulation layer and arranged in a first direction with the channel layer therebetween; a gate structure, that extends in a second direction crossing the first direction on the first surface of the base insulation layer, and surrounds the channel layer; a first silicide layer on a side wall of a recess pattern that penetrates the first source/drain pattern in a third direction that is perpendicular to the first direction and the second direction; and an interlayer insulation layer that is disposed in the recess pattern.
20250089299. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junbeom Park of Seoul (KR) for samsung electronics co., ltd., Sangsu Kim of Yongin-si (KR) for samsung electronics co., ltd., Junggil Yang of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L29/417
CPC Code(s): H10D30/6735
Abstract: a semiconductor device includes a first source/drain structure having a first length in a horizontal direction, as viewed in a planar cross-sectional view, the horizontal direction being perpendicular to a vertical direction, a second source/drain structure having a second length in the horizontal direction, as viewed in the planar cross-sectional view, the second length being less than the first length, channels extending between the first source/drain structure and the second source/drain structure, the channels being spaced apart from each other in the vertical direction, at least one sacrificial pattern between adjacent ones of the channels, and a trench penetrating the channels and the at least one sacrificial pattern.
Inventor(s): Donghoon HWANG of Suwon-si (KR) for samsung electronics co., ltd., Hyojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Byungho MOON of Suwon-si (KR) for samsung electronics co., ltd., Myungil KANG of Suwon-si (KR) for samsung electronics co., ltd., Doyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L27/092, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H10D62/121
Abstract: a three-dimensional semiconductor device includes a first active region on a substrate, including a first active region on a substrate, including a lower channel pattern and lower source/drain patterns connected to the lower channel pattern, the lower channel pattern including a plurality of lower semiconductor patterns stacked and spaced apart from each other in a first direction that is perpendicular to an upper surface of the substrate, and the lower semiconductor patterns including a lowermost first semiconductor pattern, a second active region stacked on the first active region, including an upper channel pattern and an upper source/drain pattern connected to the upper channel pattern, a lower gate electrode on the lower channel pattern, and a lower insulating pattern under the first semiconductor pattern, the first semiconductor pattern spaced apart from the lower insulating pattern in the first direction. the lower gate electrode includes a first portion adjacent to a first sidewall of the lower insulating pattern and extending in the first direction from an upper surface to a bottom surface of the lower gate electrode, a second portion adjacent to a second sidewall of the lower insulating pattern and extending in the first direction from the upper surface to the bottom surface of the lower gate electrode, the second sidewall facing the first sidewall in a second direction which is perpendicular to the first direction, and a third portion in contact with a bottom surface of the lower insulating pattern and extending from the first portion to the second portion in the second direction.
20250089320. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yeonchoo CHO of Seongnam-si (KR) for samsung electronics co., ltd., Kyung-Eun BYUN of Seongnam-si (KR) for samsung electronics co., ltd., Keunwook SHIN of Yongin-si (KR) for samsung electronics co., ltd., Hyeonjin SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/04, H01L23/522, H01L29/16, H01L29/161, H01L29/49, H01L29/78
CPC Code(s): H10D62/40
Abstract: a semiconductor device is provided. the semiconductor device includes a metal layer, a semiconductor layer in electrical contact with the metal layer, a two-dimensional (2d) material layer disposed between the metal layer and the semiconductor layer and having a 2d crystal structure, and a metal compound layer disposed between the 2d material layer and the semiconductor layer.
Inventor(s): Sunkyu HWANG of Seoul (KR) for samsung electronics co., ltd., Jongseob KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/40, H01L29/20, H01L29/66, H01L29/778
CPC Code(s): H10D64/01
Abstract: a method of manufacturing a power semiconductor device includes forming a channel separation pattern on a substrate; forming a passivation layer on the substrate and the channel separation pattern; forming a gate hole, a source hole, and a drain hole penetrating the passivation layer in a same process step; and simultaneously forming a gate electrode pattern, a source electrode pattern, and a drain electrode pattern. the gate electrode pattern may be formed on the channel separation pattern. a side surface of the gate electrode pattern and a side surface of the channel separation pattern may have a step difference.
Inventor(s): Hoseok HEO of Suwon-si (KR) for samsung electronics co., ltd., Minhyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokhoon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/49, G11C16/04, H01L21/28, H10B43/27
CPC Code(s): H10D64/665
Abstract: a non-volatile memory device may include a channel layer extending in a first direction, a plurality of gate electrodes and a plurality of insulating layers spaced apart from the channel layer and alternately arranged in the first direction, a charge trap layer between the channel layer and the plurality of gate electrodes, and a charge tunneling layer between the channel layer and the charge trap layer. the plurality of gate electrodes may include m, a, and x, where m may include a metal; a may include a group 13 element, a group 14 element, or v, or a combination thereof; x may include carbon or nitrogen, and m, a, and x may be arranged to have a layered crystal structure.
20250089352. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chang Woo Noh of Suwon-si (KR) for samsung electronics co., ltd., Myung Gil Kang of Suwon-si (KR) for samsung electronics co., ltd., Byeong Hee Son of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/088, H01L21/8234, H01L29/06, H01L29/417, H01L29/423, H01L29/45, H01L29/66, H01L29/775
CPC Code(s): H10D84/83
Abstract: a semiconductor includes a substrate, first and second active patterns that are on the substrate and extend in a first horizontal direction, a first gate electrode that is on the first active pattern and extends in a second horizontal direction, a second gate electrode that is on the second active pattern and extends in the second horizontal direction, an active cut trench that extends in the second horizontal direction and is between the first gate electrode and the second gate electrode, an active cut including a first layer and a second layer on the first layer, a first source/drain region that is between the first gate electrode and the active cut and is on the first active pattern, and a first source/drain contact that is on the first source/drain region, where at least a part of the first source/drain contact overlaps the first layer in a vertical direction.
20250089371. DRIVING CIRCUIT MOUNTING FILM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): KYOUNGSUK YANG of Suwon-si (KR) for samsung electronics co., ltd., SEONGHO SHIN of Suwon-si (KR) for samsung electronics co., ltd., MI-NA CHOI of Suwon-si (KR) for samsung electronics co., ltd., JU-YOUN CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/12, G09G3/00
CPC Code(s): H10D86/60
Abstract: a driving circuit mounting film according to an embodiment includes a base film having a first surface and a second surface facing each other, a driving circuit part positioned on the first surface of the base film, a plurality of signal lines positioned on the first surface of the base film, and a test signal pad part positioned on the second surface of the base film, wherein the test signal pad part includes a plurality of openings, and at least part of the plurality of openings overlaps with at least part of the plurality of first signal lines.
Inventor(s): Sangin Bae of Suwon-si (KR) for samsung electronics co., ltd., HYEYEON PARK of Suwon-si (KR) for samsung electronics co., ltd., HYUNSEOK SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, G02B5/20
CPC Code(s): H10F39/8053
Abstract: an image sensor including a first substrate including first and second surfaces facing each other and a plurality of photoelectric conversion regions, a plurality of color filters positioned on the second surface of the substrate, the plurality of color filters including a first color filter, a second color filter, and a third color filter; and a microlens layer including a plurality of microlenses and positioned to overlap each of the color filters. an upper surface of at least one of the first color filter, the second color filter, or the third color filter has a concave curved surface, and curvature of the upper surface of the third color filter is different from curvature of the upper surface of the second color filter or curvature of the upper surface of the first color filter.
Inventor(s): Young Woo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Soo Eon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yo Seph KIM of Suwon-si (KR) for samsung electronics co., ltd., Chan Hyeon SEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H10F39/807
Abstract: an image sensor and a manufacturing method thereof are provided. the image sensor includes a substrate including first and second surfaces opposed to each other, a first pixel group in the substrate including a first to forth unit pixels adjacent to one another in a plan view, a photoelectric conversion area in the first to fourth unit pixels, a first isolation trench in the substrate surrounding the first pixel group, a second isolation trench in the substrate between the first unit pixel and the fourth unit pixel and between the second unit pixel and the third unit pixel, the second isolation trench in contact with the second surface of the substrate, and a first color filter on the second surface of the substrate covering the first pixel group.
Inventor(s): Kyungwook HWANG of Suwon-si (KR) for samsung electronics co., ltd., Jungwoon Shin of Hwaseong-si (KR) for samsung electronics co., ltd., Keunsik Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Junsik Hwang of Suwon-si (KR) for samsung electronics co., ltd., Hakyeol Kim of Hwaseong-si (KR) for samsung electronics co., ltd., Sanghoon Song of Suwon-si (KR) for samsung electronics co., ltd., Eungyeong Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Dongho Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngtek Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/62, H01L25/075, H01L33/00
CPC Code(s): H10H20/857
Abstract: provided is a display apparatus including a display substrate, a first pad and a second pad, a first electrode on the first pad, a multilayer semiconductor layer including a first-type semiconductor layer, an active layer, and a second-type semiconductor layer on the first electrode, an insulating layer on the display substrate and adjacent to the first pad, the first electrode, and the multilayer semiconductor layer, a height of the insulating layer being lower than an upper surface of the multilayer semiconductor layer, and a second electrode on an upper surface of the multilayer semiconductor layer, an exposed lateral surface of the multilayer semiconductor layer, and a surface of the insulating layer, the second electrode connecting the second-type semiconductor layer and the second pad, an angle between the exposed lateral surface of the multilayer semiconductor layer and an upper surface of the insulating layer is 90 degrees or more.
Inventor(s): Seon-Jeong LIM of Yongin-si (KR) for samsung electronics co., ltd., Gae Hwang LEE of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K39/32, G02B5/00, G02B5/20
CPC Code(s): H10K39/32
Abstract: an image sensor includes a color filter array, a first photoelectric conversion device configured to absorb first light passing through the color filter array and convert the absorbed first light into electrical signals, and a second photoelectric conversion device configured to absorb second light passing through both the color filter array and the first photoelectric conversion device and convert the absorbed second light into electrical signals. the first photoelectric conversion device includes a first photoelectric conversion layer configured to selectively absorb a mixed light of the first and second colors. the second photoelectric conversion device comprises a second photoelectric conversion layer configured to absorb light including a third color. each of the first to third colors is one of three primary colors. the image sensor combines the electrical signals converted from the first and second photoelectric conversion devices to obtain electrical signals of the first to third colors.
Inventor(s): Hwang Suk Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangmo Kim of Suwon-si (KR) for samsung electronics co., ltd., Minsik Min of Suwon-si (KR) for samsung electronics co., ltd., Hyejin Bae of Suwon-si (KR) for samsung electronics co., ltd., Yeon Sook Chung of Suwon-si (KR) for samsung electronics co., ltd., Hyesung Choi of Suwon-si (KR) for samsung electronics co., ltd., Joon Heo of Suwon-si (KR) for samsung electronics co., ltd., Hosuk Kang of Suwon-si (KR) for samsung electronics co., ltd., Jong Soo Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonghyuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngmok Son of Suwon-si (KR) for samsung electronics co., ltd., Yeonkyung Lee of Suwon-si (KR) for samsung electronics co., ltd., Daun Jeong of Suwon-si (KR) for samsung electronics co., ltd., Kyeongsik Ju of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/02, C09K11/06, H10K50/11
CPC Code(s): H10K85/346
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Hwang Suk Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangmo Kim of Suwon-si (KR) for samsung electronics co., ltd., Minsik Min of Suwon-si (KR) for samsung electronics co., ltd., Hyejin Bae of Suwon-si (KR) for samsung electronics co., ltd., Yeon Sook Chung of Suwon-si (KR) for samsung electronics co., ltd., Hyesung Choi of Suwon-si (KR) for samsung electronics co., ltd., Joon Heo of Suwon-si (KR) for samsung electronics co., ltd., Hosuk Kang of Suwon-si (KR) for samsung electronics co., ltd., Jong Soo Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonghyuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngmok Son of Suwon-si (KR) for samsung electronics co., ltd., Yeonkyung Lee of Suwon-si (KR) for samsung electronics co., ltd., Daun Jeong of Suwon-si (KR) for samsung electronics co., ltd., Kyeongsik Ju of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/02, C09K11/06, H10K50/11
CPC Code(s): H10K85/346
Abstract:
Inventor(s): Hwang Suk Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangmo Kim of Suwon-si (KR) for samsung electronics co., ltd., Minsik Min of Suwon-si (KR) for samsung electronics co., ltd., Hyejin Bae of Suwon-si (KR) for samsung electronics co., ltd., Yeon Sook Chung of Suwon-si (KR) for samsung electronics co., ltd., Hyesung Choi of Suwon-si (KR) for samsung electronics co., ltd., Joon Heo of Suwon-si (KR) for samsung electronics co., ltd., Hosuk Kang of Suwon-si (KR) for samsung electronics co., ltd., Jong Soo Kim of Suwon-si (KR) for samsung electronics co., ltd., Joonghyuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngmok Son of Suwon-si (KR) for samsung electronics co., ltd., Yeonkyung Lee of Suwon-si (KR) for samsung electronics co., ltd., Daun Jeong of Suwon-si (KR) for samsung electronics co., ltd., Kyeongsik Ju of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/02, C09K11/06, H10K50/11
CPC Code(s): H10K85/346
Abstract: wherein mis a transition metal; yto yare each independently c or n; ris a substituted or unsubstituted c-calkyl group; ring cyto ring cyare each independently a c-ccarbocyclic group or a c-cheterocyclic group; lis a single bond, o, s, se, n(r), b(r), c(r)(r), or si(r)(r); a1 is 1, 2, 3, 4, or 5; b10, b20, b30, b40, and b50 are each independently 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10; and the remaining substituent groups of formula 1 are as provided herein.
Inventor(s): Myungsun SIM of Suwon-si (KR) for samsung electronics co., ltd., Sunghun LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Seoul (KR) for samsung electronics co., ltd., Jiwhan KIM of Seoul (KR) for samsung electronics co., ltd., Jeoungin YI of Seoul (KR) for samsung electronics co., ltd., Mitsunori ITO of Kanagawa-ken (JP) for samsung electronics co., ltd., Wataru SOTOYAMA of Kanagawa-ken (JP) for samsung electronics co., ltd., Kum Hee LEE of Seoul (KR) for samsung electronics co., ltd., Byoungki CHOI of Hwaseong-si (KR) for samsung electronics co., ltd., Sunghyun JUNG of Yongin-si (KR) for samsung electronics co., ltd., Dalho HUH of Yongin-si (KR) for samsung electronics co., ltd., Hyungsun KIM of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/02, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K50/17, H10K50/18, H10K101/00, H10K101/30
CPC Code(s): H10K85/346
Abstract: provided are a composition and an organic light-emitting device including the same, wherein the composition includes a platinum-containing organometallic compound, a first compound, a second compound, and a third compound.
Inventor(s): Joonghee WON of Suwon-si (KR) for samsung electronics co., ltd., Jong Soo KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungho NAM of Suwon-si (KR) for samsung electronics co., ltd., Sangmo KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonghyuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Jiwhan KIM of Suwon-si (KR) for samsung electronics co., ltd., Yusuke MARUYAMA of Suwon-si (KR) for samsung electronics co., ltd., Yeonkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Halim LEE of Suwon-si (KR) for samsung electronics co., ltd., Sooghang IHN of Suwon-si (KR) for samsung electronics co., ltd., Juhyung LIM of Suwon-si (KR) for samsung electronics co., ltd., Soonok JEON of Suwon-si (KR) for samsung electronics co., ltd., Daun JEONG of Suwon-si (KR) for samsung electronics co., ltd., Yeon Sook CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Yongsik JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C09K11/02, C09K11/06, H10K85/30, H10K101/00
CPC Code(s): H10K85/658
Abstract: a light-emitting device, an electronic apparatus including the light emitting device, and a condensed cyclic compound represented by formula 1. the light-emitting device includes a first electrode, a second electrode facing the first electrode, and an interlayer arranged between the first electrode and the second electrode, the interlayer including an emission layer. the emission layer includes an emitter and one or more host(s) of number m1, m1 is an integer of 1 or more, and if m1 is 2 or more, two or more of the hosts are different from each other, the emitter and the host(s) m1 are different from each other, the emitter includes a condensed ring in which two or more monocyclic groups are condensed with each other, at least one of the monocyclic groups is a 6-membered ring including a boron atom, a nitrogen atom, and a carbon atom as ring-forming atoms, and at least one of the protection coefficient of the boron atom in the emitter is 0.7 or more. formula 1 provided herein.
Inventor(s): Yuna GIL of Suwon-si (KR) for samsung electronics co., ltd., Sumin YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N70/00, H10B63/00
CPC Code(s): H10N70/841
Abstract: a semiconductor device includes a word line extending in a first direction. a bit line extends on the word line in a second direction intersecting the first direction. a memory cell is disposed between the word line and the bit line. the memory cell includes a lower electrode, a selection element, and an upper electrode sequentially disposed on the word line. a filling pattern is on a side surface of the memory cell. an etch stop pattern includes an insulating material between the filling pattern and the bit line. a lower surface of the etch stop pattern is positioned at a higher level than a level of a lower surface of the upper electrode.
Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- Samsung Electronics Co., Ltd.
- A47L9/28
- A47L9/00
- A47L11/40
- G05D1/648
- G05D101/00
- G05D105/10
- CPC A47L9/2826
- Samsung electronics co., ltd.
- H02J7/00
- CPC A47L9/2873
- A47L15/42
- CPC A47L15/4246
- A61B5/0245
- A61B5/00
- A61B5/308
- CPC A61B5/0245
- A61B5/361
- A61B5/024
- CPC A61B5/361
- A61B5/0295
- A61B5/16
- CPC A61B5/7267
- B01L7/00
- CPC B01L7/52
- B24B49/04
- B24B49/14
- CPC B24B49/04
- B25J9/16
- B25J13/08
- CPC B25J9/1666
- B65D5/50
- B65D5/38
- CPC B65D5/5035
- C07F15/00
- C07B59/00
- C09K11/02
- C09K11/06
- H10K85/30
- H10K85/60
- CPC C07F15/0033
- D06F37/22
- D06F23/02
- CPC D06F37/22
- F24F11/63
- F24F120/10
- CPC F24F11/63
- G01J1/42
- G06F1/16
- G09G5/10
- H04N23/88
- CPC G01J1/4204
- G01R31/26
- G01R19/10
- H01L27/06
- CPC G01R31/2608
- G01R31/28
- H01L21/66
- CPC G01R31/2894
- G01S19/29
- G01S19/30
- G01S19/37
- CPC G01S19/29
- G01T1/36
- G01T1/20
- H01L21/67
- CPC G01T1/362
- G03F7/00
- CPC G03F7/70633
- G06F3/01
- CPC G06F1/163
- G02B27/01
- CPC G06F3/011
- G06F3/06
- CPC G06F3/0611
- G06F12/0815
- CPC G06F3/0616
- CPC G06F3/0619
- CPC G06F3/0631
- CPC G06F3/064
- CPC G06F3/0655
- G06F3/14
- G02B7/02
- CPC G06F3/1423
- G06F9/451
- CPC G06F9/451
- G06F9/455
- CPC G06F9/45558
- G06F9/50
- G06F11/34
- CPC G06F9/5016
- CPC G06F9/5055
- G06F11/10
- G06F9/30
- G06F11/07
- CPC G06F11/1064
- G06F13/16
- CPC G06F11/1068
- G06F11/22
- CPC G06F11/2273
- G06F12/02
- CPC G06F12/0223
- H01L23/00
- H01L25/065
- H01L25/18
- H10B41/27
- H10B43/27
- H10B80/00
- CPC G06F12/0246
- CPC G06F12/0292
- G06F12/0862
- G06F12/0804
- G06F12/123
- CPC G06F12/0862
- G06F12/14
- H04L9/14
- CPC G06F12/1408
- G06F13/12
- G06F13/40
- CPC G06F13/1642
- G06F16/9537
- H04W4/029
- CPC G06F16/9537
- G06F17/14
- CPC G06F17/14
- G06F40/106
- G06F16/957
- CPC G06F40/106
- G06N3/0455
- G06N3/0985
- CPC G06N3/0455
- G06N3/08
- G06F17/18
- G06F18/2113
- G06F18/214
- G06F18/22
- G06N3/045
- G06N7/01
- CPC G06N3/08
- G06N3/09
- CPC G06N3/09
- G06N3/126
- G06N3/092
- CPC G06N3/126
- G06N20/00
- G06F11/30
- CPC G06N20/00
- G06T7/00
- G06T3/40
- G06V10/74
- CPC G06T7/0002
- G06T7/33
- G06T5/77
- G06T7/13
- G06T7/70
- G06T15/20
- G06V20/64
- CPC G06T7/33
- G06T7/73
- G06T7/536
- G06V20/58
- G06V20/62
- G06V30/18
- G06V30/19
- CPC G06T7/73
- G06V10/40
- G06V10/82
- G06V20/40
- CPC G06T7/75
- G06T9/00
- CPC G06T9/002
- G06T15/08
- CPC G06T15/08
- G06T19/00
- CPC G06T19/006
- G06T19/20
- G06T17/20
- H04N23/61
- CPC G06T19/20
- G06V10/60
- G06V10/77
- CPC G06V10/60
- G06V10/75
- G06T7/60
- CPC G06V10/751
- G06V10/80
- G01S17/86
- G01S17/89
- G06V10/44
- CPC G06V10/806
- G06V10/98
- H04N9/64
- H04N25/611
- CPC G06V10/993
- G06V20/20
- G06T13/40
- G06V40/16
- CPC G06V20/20
- G06V40/10
- A61B5/1455
- G06V10/56
- G06V10/764
- G06V10/774
- H04N23/611
- H04N23/71
- H04N23/72
- H04N23/74
- H04N23/84
- CPC G06V40/15
- G06V10/141
- G06V10/20
- H04N23/80
- CPC G06V40/16
- G06V40/20
- CPC G06V40/20
- G08C17/02
- G08C23/04
- CPC G08C17/02
- G11C7/10
- CPC G11C7/1096
- G11C11/4099
- G11C11/4074
- G11C11/408
- CPC G11C11/4099
- G11C16/10
- G11C16/04
- G11C16/08
- CPC G11C16/102
- G11C29/56
- CPC G11C29/56016
- G16H50/30
- A61B5/0205
- A61B5/11
- CPC G16H50/30
- H01J37/32
- CPC H01J37/32642
- H01L21/683
- G01J3/443
- G05B19/4099
- CPC H01L21/67253
- H01L21/768
- H01L23/522
- CPC H01L21/76819
- H01L23/532
- H10B41/41
- CPC H01L22/34
- H01L23/13
- G02B6/42
- H01L23/498
- H01L25/16
- CPC H01L23/13
- H01L23/31
- CPC H01L23/315
- H01L23/495
- CPC H01L23/49572
- H01L21/48
- CPC H01L23/49822
- H01L21/56
- H01L23/29
- CPC H01L23/49827
- CPC H01L23/5226
- H01L23/528
- H10B41/35
- H10B43/35
- CPC H01L23/5283
- H10B43/10
- H10B43/40
- H01L21/8238
- H01L27/02
- H01L27/092
- H01L29/06
- H01L29/423
- H01L29/78
- H01L29/786
- CPC H01L23/5286
- H01L23/544
- H01L23/48
- CPC H01L23/544
- H01L23/552
- H01L23/36
- H01L23/538
- H01L25/10
- H01Q1/22
- CPC H01L23/552
- CPC H01L23/562
- H01L23/64
- H01L23/28
- CPC H01L23/642
- CPC H01L24/08
- CPC H01L24/13
- CPC H01L24/74
- H01L25/00
- CPC H01L25/0652
- H01L23/15
- H01L23/367
- CPC H01L25/0655
- H01L23/16
- CPC H01L25/0657
- CPC H01L25/105
- H01L23/04
- CPC H01L25/167
- H01M4/66
- H01M4/02
- H01M4/131
- H01M4/133
- H01M10/0525
- H01M10/0562
- H01M10/42
- CPC H01M4/668
- H01M4/583
- H01M10/26
- CPC H01M10/0562
- H01Q1/24
- H01Q1/52
- H05K1/02
- CPC H01Q1/243
- H01Q5/364
- CPC H01Q5/364
- H02J50/60
- G01S13/04
- H02J50/12
- CPC H02J50/60
- H03K3/017
- H03K3/037
- H03K5/00
- CPC H03K3/017
- H04B1/50
- H04B1/401
- CPC H04B1/50
- H04B7/0456
- H04B7/06
- CPC H04B7/0456
- CPC H04B7/0626
- H04L1/08
- H04W72/0446
- H04W72/21
- CPC H04L1/08
- H04L5/00
- H04W72/232
- CPC H04L5/0053
- CPC H04L5/0055
- H04L7/033
- H04L43/087
- CPC H04L7/033
- H04L9/00
- H04L9/06
- CPC H04L9/008
- H04L25/03
- CPC H04L25/03057
- H04L27/38
- H03K5/01
- CPC H04L27/3863
- H04L43/0852
- H04L43/062
- CPC H04L43/0852
- H04M1/02
- H01Q1/38
- CPC H04M1/0283
- H04N5/915
- G11B27/00
- H04N5/77
- CPC H04N5/915
- H04N19/52
- H04N19/117
- H04N19/159
- H04N19/176
- H04N19/635
- H04N19/64
- CPC H04N19/52
- H04N21/422
- G06F3/0362
- CPC H04N21/42222
- H04N21/4227
- G06F3/0354
- G06F3/04883
- G06F21/32
- G06V40/13
- G08C17/00
- H04N21/41
- H04N21/4415
- H04N21/45
- H04N21/472
- H04N21/475
- H04W88/02
- CPC H04N21/4227
- H04N23/68
- H04N23/55
- H04N23/67
- CPC H04N23/687
- H04N23/741
- CPC H04N23/71
- H04R1/34
- H04R1/02
- H04R1/10
- CPC H04R1/345
- H04R5/04
- CPC H04R5/04
- H04W12/041
- H04W12/10
- CPC H04W12/041
- H04W16/28
- H04W56/00
- H04W72/231
- H04W74/0808
- CPC H04W16/28
- H04W24/10
- H04L41/147
- CPC H04W24/10
- H04W28/02
- H04W28/082
- H04W52/02
- H04W88/10
- CPC H04W28/0268
- H04W36/06
- H04W72/044
- CPC H04W36/06
- H04W36/08
- H04W36/00
- CPC H04W36/08
- H04W36/36
- CPC H04W36/362
- CPC H04W52/0206
- H04W68/02
- CPC H04W68/02
- H04W74/0833
- H04W76/27
- CPC H04W72/0446
- H04W72/56
- H04W72/0457
- H04L1/1812
- H04L5/14
- H04W72/0453
- H04W72/1273
- CPC H04W72/0457
- H04W76/10
- H04W76/38
- CPC H04W76/10
- H04W76/15
- H04W28/16
- H04W88/08
- CPC H04W76/15
- H04W76/19
- H04W4/06
- H04W76/20
- H04W76/30
- CPC H04W76/19
- CPC H04W76/20
- H04W76/28
- H04W72/40
- CPC H04W76/28
- H04W76/50
- H04L65/1016
- H04W4/14
- H04W4/90
- H04W48/16
- CPC H04W76/50
- H05B6/12
- A47J36/32
- H02J50/10
- CPC H05B6/1236
- H05K1/11
- H05K1/09
- CPC H05K1/115
- H05K1/14
- H05K1/18
- H05K5/00
- H05K7/20
- CPC H05K1/144
- H05K3/34
- CPC H05K3/3478
- CPC H05K5/0052
- H05K5/02
- G06F1/18
- H01L25/075
- CPC H05K5/0217
- CPC H05K7/20327
- H05K9/00
- CPC H05K7/2039
- H10B12/00
- CPC H10B12/20
- CPC H10B12/315
- CPC H10B12/482
- CPC H10B43/27
- CPC H10B43/40
- H10B63/00
- H10B63/10
- CPC H10B63/845
- H01G4/30
- CPC H10D1/714
- H01L29/417
- H01L21/285
- H01L29/08
- H01L29/40
- H01L29/45
- H01L29/66
- H01L29/775
- CPC H10D30/6729
- CPC H10D30/6735
- CPC H10D62/121
- H01L29/04
- H01L29/16
- H01L29/161
- H01L29/49
- CPC H10D62/40
- H01L29/20
- H01L29/778
- CPC H10D64/01
- H01L21/28
- CPC H10D64/665
- H01L27/088
- H01L21/8234
- CPC H10D84/83
- H01L27/12
- G09G3/00
- CPC H10D86/60
- H01L27/146
- G02B5/20
- CPC H10F39/8053
- CPC H10F39/807
- H01L33/62
- H01L33/00
- CPC H10H20/857
- H10K39/32
- G02B5/00
- CPC H10K39/32
- H10K50/11
- CPC H10K85/346
- H10K50/15
- H10K50/16
- H10K50/17
- H10K50/18
- H10K101/00
- H10K101/30
- CPC H10K85/658
- H10N70/00
- CPC H10N70/841