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Category:H01L23/10
Subcategories
This category has the following 10 subcategories, out of 10 total.
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F
J
K
L
M
T
Pages in category "H01L23/10"
The following 53 pages are in this category, out of 53 total.
1
- 17460705. PACKAGE STRUCTURES AND METHOD FOR FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17708894. SEAL RING STRUCTURE FOR SEMICONDUCTOR DEVICE AND THE METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17822470. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17839292. Forming Structures In Empty Regions On Wafers With Dual Seal Ring Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18155713. SEMICONDUCTOR PACKAGES WITH SHORTENED TALKING PATH simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18228278. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368302. Inductive Heatable Particles in Semiconductor Module (Infineon Technologies AG)
- 18391891. CHIP PACKAGE WITH LID simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18422220. DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18480254. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18557785. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18576203. POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18624727. PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18674930. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18733196. SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18734669. THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION CIRCUIT simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18764060. SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
- 18974221. SEMICONDUCTOR DEVICE (Rohm Co., Ltd.)
- 18974937. SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19004494. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
B
M
- Mitsubishi electric corporation (20240234237). POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240243023). STRESS RELIEF STRUCTURE, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING STRESS RELIEF STRUCTURE simplified abstract
- Mitsubishi electric corporation (20240347403). SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20250096049). SEMICONDUCTOR DEVICE
- Mitsubishi Electric Corporation patent applications on July 11th, 2024
- Mitsubishi Electric Corporation patent applications on July 18th, 2024
- Mitsubishi Electric Corporation patent applications on March 20th, 2025
- Mitsubishi Electric Corporation patent applications on October 17th, 2024
S
T
- Taiwan semiconductor manufacturing co., ltd. (20240162183). DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240186372). SELF-ALIGNED CONTACT AIR GAP FORMATION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250055). PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312852). MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250105090). SEMICONDUCTOR DEVICE
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on May 16th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105530). Integrated Circuit Packages, Devices Using the Same, and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120294). CHIP PACKAGE WITH LID simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379475). PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 23rd, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024