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Category:H01L21/20
Subcategories
This category has the following 7 subcategories, out of 7 total.
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Pages in category "H01L21/20"
The following 22 pages are in this category, out of 22 total.
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- 18299610. EPITAXIAL STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18446583. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18478746. CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER (Advanced Micro Devices, Inc.)
- 18587031. BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME simplified abstract (YANGTZE MEMORY TECHNOLOGIES CO., LTD.)
- 18906945. Method for Thinning a Semiconductor Substrate (IMEC VZW)
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- Micron technology, inc. (20240186298). DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract
- Micron Technology, Inc. patent applications on April 3rd, 2025
- Micron Technology, Inc. patent applications on June 6th, 2024
- Micron Technology, Inc. patent applications on March 14th, 2024
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- Taiwan semiconductor manufacturing company, ltd. (20240113205). SOURCE/DRAIN FORMATION WITH REDUCED SELECTIVE LOSS DEFECTS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347340). EPITAXIAL STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024