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Category:Chandra Sekhar Mandalapu of Ft. Collins CO US

From WikiPatents

Chandra Sekhar Mandalapu

Chandra Sekhar Mandalapu from Ft. Collins CO US has applied for patents in technology areas such as H01L21/20, H01L21/683, H01L23/00 with advanced micro devices, inc..

Patents

CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER (20250112047)

Pages in category "Chandra Sekhar Mandalapu of Ft. Collins CO US"

The following 2 pages are in this category, out of 2 total.

1

18478746. CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER (Advanced Micro Devices, Inc.)

A

Advanced micro devices, inc. (20250112047). CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER

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