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Category:G01R1/067
Subcategories
This category has the following 15 subcategories, out of 15 total.
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Pages in category "G01R1/067"
The following 57 pages are in this category, out of 57 total.
1
- 17401252. Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms simplified abstract (Microfabrica Inc.)
- 17464612. Methods of Reinforcing Plated Metal Structures and Independently Modulating Mechanical Properties Using Nano-Fibers simplified abstract (Microfabrica Inc.)
- 17493802. Shielded Probes for Semiconductor Testing, Methods for Using, and Methods for Making simplified abstract (Microfabrica Inc.)
- 17507598. Probes with Planar Unbiased Spring Elements for Electronic Component Contact and Methods for Making Such Probes simplified abstract (Microfabrica Inc.)
- 17571537. POGO PIN-FREE TESTING DEVICE FOR IC CHIP TEST AND TESTING METHOD OF IC CHIP simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17572892. Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making simplified abstract (Microfabrica Inc.)
- 17680211. Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making simplified abstract (Microfabrica Inc.)
- 17854756. Compliant Pin Probes with Extension Springs, Methods for Making, and Methods for Using simplified abstract (Microfabrica Inc.)
- 17888384. Multi-Beam Probes with Decoupled Structural and Current Carrying Beams and Methods of Making simplified abstract (Microfabrica Inc.)
- 17898446. Compliant Probes Including Dual Independently Operable Probe Contact Elements Including At Least One Flat Extension Spring, Methods for Making, and Methods for Using simplified abstract (Microfabrica Inc.)
- 17968552. Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes simplified abstract (Microfabrica Inc.)
- 17968601. Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes simplified abstract (Microfabrica Inc.)
- 17968638. Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes simplified abstract (Microfabrica Inc.)
- 18180101. TESTING APPARATUS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18244566. RESISTANCE MEASUREMENTS IN ELECTRICAL CHARACTERIZATION SYSTEM (International Business Machines Corporation)
- 18290459. IC NOISE IMMUNITY DETECTION DEVICE AND IC NOISE IMMUNITY DETECTION METHOD simplified abstract (Mitsubishi Electric Corporation)
- 18345469. INSPECTION DEVICE FOR DISPLAY APPARATUS AND INSPECTION METHOD FOR DISPLAY APPARATUS simplified abstract (Samsung Display Co., Ltd.)
- 18382906. CONTACT SENSOR FOR DETECTING LOOSE SPROCKET SEGMENTS OF A FINAL DRIVE (Caterpillar Inc.)
- 18432506. MANUFACTURING METHOD AND TEST METHOD OF POWER MODULE (Hyundai Motor Company)
- 18432506. MANUFACTURING METHOD AND TEST METHOD OF POWER MODULE (Kia Corporation)
- 18467894. REMOVABLE HIGH-SPEED SIGNAL MEASUREMENT DEVICE (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18468309. Wireless Harness Automated Measurement Systems and Methods (Lockheed Martin Corporation)
- 18605556. METHODS AND APPARATUS FOR SOURCE MEASUREMENT UNIT (SMU) OPERATION simplified abstract (Texas Instruments Incorporated)
- 18606516. WAFER TESTING APPARATUS AND CONTROL METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18669800. PROBE HEAD STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18784516. ELECTRO-OPTICAL PROBING AND MECHANICAL MICROPROBING OF MEMORY DIE USING A CANTILEVER (Micron Technology, Inc.)
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- International business machines corporation (20240183880). CLUSTERED RIGID WAFER TEST PROBE simplified abstract
- International business machines corporation (20250085310). RESISTANCE MEASUREMENTS IN ELECTRICAL CHARACTERIZATION SYSTEM
- International business machines corporation (20250093383). REMOVABLE HIGH-SPEED SIGNAL MEASUREMENT DEVICE
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on February 1st, 2024
- International Business Machines Corporation patent applications on June 6th, 2024
- International Business Machines Corporation patent applications on March 13th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 20th, 2025
M
- Micron technology, inc. (20250123305). ELECTRO-OPTICAL PROBING AND MECHANICAL MICROPROBING OF MEMORY DIE USING A CANTILEVER
- Micron Technology, Inc. patent applications on April 17th, 2025
- Mitsubishi electric corporation (20240241169). INSPECTION DEVICE FOR OPTICAL SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240280631). IC NOISE IMMUNITY DETECTION DEVICE AND IC NOISE IMMUNITY DETECTION METHOD simplified abstract
- Mitsubishi Electric Corporation patent applications on August 22nd, 2024
- Mitsubishi Electric Corporation patent applications on July 18th, 2024
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- Samsung display co., ltd. (20240094246). INSPECTION DEVICE FOR DISPLAY APPARATUS AND INSPECTION METHOD FOR DISPLAY APPARATUS simplified abstract
- Samsung Display Co., Ltd. patent applications on March 21st, 2024
- Samsung electronics co., ltd. (20240319229). WAFER TESTING APPARATUS AND CONTROL METHOD THEREOF simplified abstract
- Samsung electronics co., ltd. (20240353442). PROBE CARD AND SEMICONDUCTOR DEVICE INSPECTION SYSTEM INCLUDING THE SAME simplified abstract
- Samsung Electronics Co., Ltd. patent applications on October 24th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
T
- Taiwan semiconductor manufacturing company, ltd. (20240302410). PROBE HEAD STRUCTURE simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- Texas instruments incorporated (20240310411). METHODS AND APPARATUS FOR SOURCE MEASUREMENT UNIT (SMU) OPERATION simplified abstract
- Texas Instruments Incorporated patent applications on September 19th, 2024